专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2004158819A Head and method for mounting component 有权
标题翻译：头部和安装组件的方法
公开(公告)号：JP2004158819A
公开(公告)日：2004-06-03
申请号：JP2003134763
申请日：2003-05-13
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OKUDA OSAMU , TANAKA YOICHI , SAITO HIROTAKA , IWAMOTO USEI
IPC分类号： H05K13/04
CPC分类号： H05K13/0413 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53174 , Y10T29/53178
摘要： PROBLEM TO BE SOLVED: To provide a head and a method for mounting components, which make it possible to recognize holding attitudes of components, held by a plurality of component holding members, as a head and a method for mounting components that recognize the holding attitudes by picking up an image of the components and mount the respective components on a circuit board according to the recognition result. SOLUTION: The component mounting head is equipped with a 1st component imaging part capable of picking up an image of a component held by a component holding member along the axis of the component holding member and a 2nd component imaging part capable of picking up an image of the held component in a direction crossing the axis of the component holding member nearly at nearly right angles; and images of the component are picked up by the 1st and 2nd component imaging parts from two nearly orthogonal directions and the holding attitude of the component is recognized according to the images. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种用于安装部件的头部和方法，其使得能够识别由多个部件保持部件保持的部件的保持姿态作为头部，以及用于安装识别的部件的安装方法通过拾取部件的图像并根据识别结果将各个部件安装在电路板上来保持姿态。解决方案：部件安装头配备有第一部件成像部件，其能够拾取由部件保持部件沿着部件保持部件的轴线保持的部件的图像，以及能够拾取的第二部件成像部件所述保持部件在与所述部件保持部件的轴线成几乎成直角的方向上的图像; 并且从两个近似正交的方向由第一和第二分量成像部分拾取部件的图像，并且根据图像识别部件的保持姿态。版权所有（C）2004，JPO

2. 发明专利

JP2006269754A Method and apparatus for device tact time optimization and mounting processing apparatus 有权
标题翻译：装置触发时间优化和安装处理装置的方法和装置
公开(公告)号：JP2006269754A
公开(公告)日：2006-10-05
申请号：JP2005085876
申请日：2005-03-24
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MAENISHI YASUHIRO , TAKEDA TAKESHI , KAKISHIMA NOBUYUKI , MIMURA NAOTO , OBARA HIROSHI , UEDA TOMIYASU , SAITO HIROTAKA , HAMA TOMOAKI
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To optimize power consumption by using an idle time while keeping line balance. SOLUTION: When a component mounting machine 100 provided in a mounting line is targeted, and the time before it becomes ready to carry out a printed board 20 having been mounted after it becomes ready to carry the printed board 20 in the component mounting machine 100, is represented as a device tact time, a device tact time of one of mounting processing devices constituting the mounting line is acquired as a reference tact to optimize the device tact, the device tact time when the component mounting machine 100 performs a mounting process under reference mounting processing conditions, is acquired as an initial tact, and the acceleration of a multi-mounting head 112 that the component mounting machine 100 is equipped with, is determined so that, when the initial tact time is less than the reference tact time, the power consumption decreases with a device tact time which does not exceed the reference tact time. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：通过使用空闲时间同时保持线路平衡来优化功耗。解决方案：当设置在安装线中的部件安装机100被瞄准时，并且在准备好执行已经安装的印刷电路板20准备好将印刷电路板20携带在部件安装中之后的时间机器100被表示为设备节拍时间，获取构成安装线的安装处理设备之一的设备节拍时间作为优化设备节拍的参考手段，组件安装机100执行安装的设备节拍时间在基准安装处理条件下的处理被获取为初始节拍，并且确定组件安装机100所装备的多安装头112的加速度，使得当初始节拍时间小于参考节拍时时间，功率消耗随着不超过参考节拍时间的设备节拍时间而减小。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2003071350A Method and apparatus for coating 有权
标题翻译：涂料的方法和装置
公开(公告)号：JP2003071350A
公开(公告)日：2003-03-11
申请号：JP2001265604
申请日：2001-09-03
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KAKISHIMA NOBUYUKI , SAITO HIROTAKA , NAKAHIRA HITOSHI
IPC分类号： B05D1/26 , B05B12/02 , B05C5/00 , B05C11/10 , B05D7/24 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a coating method by which the irregular coating of a coating surface area is suppressed even if a coating operation by different coating magnification is carried out using the same nozzle and to provide an apparatus for the nozzle.
SOLUTION: The instructed coating magnification and the coating magnification in the practical coating operation are not to be different but they have to be similar to the utmost. Namely, a plurality of instructed coating magnifications are set for every nozzles 112 for material coating. A coating place to be an object for the material coating is segmented into a plurality of groups corresponding to the coating magnification. The instructed coating magnification most approximate to the coating magnification of each group of the plurality of the instructed coating magnification is used for recognition trial. The instructed coating magnification and the coating magnification in the coating operation become similar by setting a plurality of the instructed coating magnification respectively to the average value of the coating magnification of the coating object belonging to each group. In the case an instructed coating magnification is provided to each nozzle, the average value of the coating magnification for coating place to be the object is used as the instructed coating magnification.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：即使使用相同的喷嘴进行不同的涂布倍率的涂布操作并且提供喷嘴的装置，也提供了涂覆表面积的不规则涂布被抑制的涂布方法。解决方案：实际涂装操作中指定的涂布倍率和涂布倍率不一样，但必须最大程度上相同。也就是说，对于每个用于材料涂覆的喷嘴112设定多个指示的涂布倍率。将作为材料涂层的物体的涂覆部分分成对应于涂层倍率的多个组。指定的涂布倍率最接近于多组指定的涂布倍率的各组的涂布倍率用于识别试验。通过将多个指示的涂布倍率分别设定为属于各组的涂布对象的涂布倍率的平均值，涂布操作中的指示涂布倍率和涂布倍率变得相似。在向每个喷嘴提供指示的涂布倍率的情况下，将涂布位置的涂布倍率的平均值用作对象，作为指示的涂布倍率。

4. 发明专利

JP2004327591A Finishing machine and its maintenance method 审中-公开
公开(公告)号：JP2004327591A
公开(公告)日：2004-11-18
申请号：JP2003118282
申请日：2003-04-23
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KAKISHIMA NOBUYUKI , TANAKA YOICHI , SAITO HIROTAKA , NAKANO KAZUYUKI
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To solve the problem that a maintenance key switch and an enabling switch had to be acted when enclosure is opened and maintenance work is done. SOLUTION: When enclosures 15, 16, 17 are opened, for the sake of safety a power source of support vertical bulb 5 for regulating power of a motor 4 or a substrate P is cut off by a built-in safety circuit B, or only when maintenance is necessary, the safety circuit is made into useless, and power is returned. Such a specification apparatus is realized conventionally by two switches. This can be realized by operation level which can be set by a specified manager with an operation screen 18 and one switch 7a or 7b. COPYRIGHT: (C)2005,JPO&NCIPI

5. 发明专利

JP2001102736A PRINTER AND PRINTING METHOD OF CREAM SOLDER 失效
公开(公告)号：JP2001102736A
公开(公告)日：2001-04-13
申请号：JP27566199
申请日：1999-09-29
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MATSUMOTO MASAYA , WACHI AKIHIKO , SAITO HIROTAKA , NISHIKAWA NOBORU
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a printer and a printing method, in which an operation is executed depending on the type and level of a printing fault of solder cream upon detection thereof. SOLUTION: Cream solder is screen printed on a circuit board carried into a printer (S5), and when a printing fault is detected by inspection (S6), it is sorted (S8-S11) and an operation preset for each type of incomplete print is executed, depending on the level of incomplete print.

6. 发明专利

JP2002162370A METHOD AND DEVICE FOR X-RAY INSPECTION OF SUBSTRATE 失效
公开(公告)号：JP2002162370A
公开(公告)日：2002-06-07
申请号：JP2000356161
申请日：2000-11-22
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SAITO HIROTAKA , NAKAHIRA HITOSHI , KAKISHIMA NOBUYUKI
IPC分类号： G01N23/04 , G21K5/02 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a method for X-ray inspection of substrate and its usable device preventing any inspected area from overlapping as well as rapidly acquiring transfer imaging. SOLUTION: An X-ray source 23 obliquely radiating X-ray toward a horizontally-placed substrate 3 is furnished on the top of this substrate 3, and a linear X-ray sensor 25 detecting X-ray radiated from the X-ray source 23 to be transmitted through the substrate 3 is furnished on the bottom of the substrate 3, allowing relative displacement of the substrate 3 in horizontal direction opposed to both the X-ray source 23 and the linear X-ray sensor 25. Thus relatively shift the substrate 3 located between the X-ray source 23 and the linear X-ray sensor 25 in horizontal direction to image a transfer imaging of X-ray throughout the substrate 3 and then rotate the substrate 3 on a level surface by a certain angle, relatively shift the rotated substrate in horizontal direction again between the X-ray source 23 and the linear X-ray sensor 25 to image a transfer imaging of X-ray throughout the entire substrate 3.

7. 发明专利

JP2002217593A ELECTRONIC COMPONENT MOUNTING MACHINE 失效
公开(公告)号：JP2002217593A
公开(公告)日：2002-08-02
申请号：JP2001011232
申请日：2001-01-19
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： OBARA HIROSHI , SAITO HIROTAKA , NAKANO KAZUYUKI
IPC分类号： H05K13/02 , G05B9/02
摘要： PROBLEM TO BE SOLVED: To provide an electronic component mounting machine, capable of smoothly and rapidly returning an operating mechanism to a prescribed movably setting range and restoring the mechanism without hand, when a protecting function is operated due to runaway or the like of a software. SOLUTION: The electronic component mounting machine comprises a drive source 2 for operating the operating mechanism 1 for supplying or mounting an electronic component; a drive controller 10 for controlling to drive the source 2 to operate the mechanism 1 in a prescribed movable setting range; detection sensors 4, 7 for detecting the mechanism operated out of the set range; a protective functional unit 8 for cutting off a power supply to the source 2 or the controller 10, based on detection signals of the sensors 4, 7; a protecting function releasing means 18 for forcibly releasing cutting off of the power supply by the unit 8; and a restoring means 11 for functioning the means 18 and then operating the mechanism 1 toward the setting range.

8. 发明专利

JP2002160347A SOLDER PASTE PRINTING APPARATUS, ITS CONTROL METHOD, AND MEMORY MEDIUM 失效
公开(公告)号：JP2002160347A
公开(公告)日：2002-06-04
申请号：JP2000356162
申请日：2000-11-22
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SAITO HIROTAKA , WACHI AKIHIKO , NAKANO KAZUYUKI
IPC分类号： B41F15/26 , B41F15/08 , B41F33/14 , G05D3/12 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a solder paste printing apparatus and its control method that can align all lands on the surfaces of both a printing screen and a circuit board, particularly putting emphasis on the lands arranged with high density. SOLUTION: The apparatus includes the circuit board 3 having a plurality of lands 3b formed thereon, and the printing screen 5 having a plurality of land openings 5b arranged thereon corresponding to the respective positions of lands 3b. The board 3 is aligned and overlaid with the screen 5, and printed solder paste on the lands 3b. The control method includes the steps of imaging the entire surface of the board 3 while imaging the entire surface of the screen 5, detecting information about the openings 5b and the lands 3b (area of a land and distance between adjacent lands) from the obtained image data, and moving the screen 5 and the board 3 relatively to each other based on the detected information about the openings 5b and the lands 3b.

9. 发明专利

JP2002210923A METHOD FOR CLEANING PRINTING PRESS 失效
公开(公告)号：JP2002210923A
公开(公告)日：2002-07-31
申请号：JP2001008353
申请日：2001-01-17
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NAKAHIRA HITOSHI , SAITO HIROTAKA , NAKANO KAZUYUKI
IPC分类号： B41F15/08 , B41F15/12 , B41F35/00
摘要： PROBLEM TO BE SOLVED: To provide a method for cleaning a printing press, capable of reducing cleaning tact and not bringing about the rising of power consumption or noise. SOLUTION: In the printing press repeating operation for feeding a substrate to a Y Z table 4 to print a printing paste material, the cleaning period of a screen plate 7 is judged from a repeating condition and it is detected that the cleaning period arrives to perform cleaning by a cleaner. In this case, the cleaner 19 is operated in standby frequency lower than operation frequency until the cleaning period arrives and, when the cleaning period arrives, the cleaner 19 is changed over to operation frequency to be operated until the printing of the fed-in substrate 1 is completed and cleaning is performed by the cleaner 19 after the printing of the substrate is completed. In this method, since the time required in the alteration of frequency is overlapped with feed and printing operations, cleaner tact can be shortened.

10. 发明专利

JP2002019084A METHOD AND APPARATUS FOR INSPECTING PRINTING STATE OF CREAM SOLDER 失效
公开(公告)号：JP2002019084A
公开(公告)日：2002-01-22
申请号：JP2000210616
申请日：2000-07-12
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： WACHI AKIHIKO , MATSUMOTO MASAYA , SAITO HIROTAKA , NAKANO KAZUYUKI
IPC分类号： B41F15/08 , B41F15/12 , B41F15/40 , B41F33/14 , G01N21/956 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for inspecting a cream solder printing state capable of surely inspecting the printing state. SOLUTION: The method for inspecting the cream solder printing state comprises the steps of setting a threshold value at a step 1, photographing a color image of the cream solder at a step 2, acquiring image data by image processing the image at a step 3, and deciding the printing state of the solder at a step 4. The method further comprises the steps of regulating an illuminance if a solder extracting amount is much to exceed an allowable range at a step 6 when a deciding result is abnormal at a step 5, inserting a polarizing film to regulate an intensity of the solder if the intensity is larger than a reference value at a step 7, inserting a wavelength cutting film if both the cream solder and a land cannot be extracted at a step 8, and re-inspecting them.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式