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    • 1. 发明专利
    • Method and system for mounting component
    • 安装组件的方法和系统
    • JP2003318599A
    • 2003-11-07
    • JP2002119118
    • 2002-04-22
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • MIURA IZUMINAKANO TOMOYUKIHATA JUNICHI
    • H05K13/04H05K13/08
    • PROBLEM TO BE SOLVED: To provide a method and a system for mounting a component accurately at a high speed in which components having a polarity, arranged at random in a component feeding section without recognizing its polarity, can be set in a state of arranged polarity at the time of mounting on a board. SOLUTION: By means of a head 47 holding and transferring a package component 75, the package component 75 having a polarity arranged previously in the component feeding section 59 is chucked and mounted at a specified position on a circuit board 41. Based on image data obtained by imaging the package component 75, polarity direction of the package component 75 is recognized and the orientation of the chucked package component 75 is altered such that the recognized polarity direction is aligned with a specified direction. COPYRIGHT: (C)2004,JPO
    • 要解决的问题:为了提供一种高精度地安装组件的方法和系统,其中具有极性的部件在分量馈送部分中被随机布置而不识别其极性,可以被设置在一个状态 在安装在电路板上时极性极好。 解决方案:通过保持和传送封装部件75的头部47,预先在部件供给部分59中布置的具有极性的封装部件75被夹紧并安装在电路板41上的指定位置。基于 识别包装部件75的成像,封装部件75的极性方向得到的图像数据,并且改变卡盘封装部件75的取向,使得识别的极性方向与指定的方向对齐。 版权所有(C)2004,JPO
    • 5. 发明专利
    • ELECTRONIC PARTS MOUNTING DEVICE HAVING PARTS DETECTING FUNCTION
    • JPH09298395A
    • 1997-11-18
    • JP11146496
    • 1996-05-02
    • MATSUSHITA ELECTRIC IND CO LTD
    • MIURA IZUMI
    • B23P21/00H05K13/04H05K13/08
    • PROBLEM TO BE SOLVED: To set the data optimally so that it may not give shocks to parts, by having a function of detecting the shock waves generated between the surface of a part and the suction face of a nozzle by means of a piezoelectric element, and performing the detection of the part by an electric signal. SOLUTION: This mounting device is provided with a piezoelectric sensor 18 at the mounting contact part of a nozzle so as to detect the shock waves caused by the contact between the nozzle and the part sucked by the nozzle when sucking the part, or the shock waves caused between the part and a printed board when mounting the part sucked by the nozzle onto a printed board. The voltage generated from the sensor 18 is amplified with a sensor amplifier 19, and is sent to the main controller card 21 through an I/O card 20. When this starts detection of parts, this shifts to the suction of the parts. This catches the shock waves generated between the nozzle and the parts during parts sucking action, and performs the judgment of existence of parts. Hereby, the data on the mounting can be set in real time for minimizing and optimizing the shock.
    • 7. 发明专利
    • JPH05347497A
    • 1993-12-27
    • JP15630692
    • 1992-06-16
    • MATSUSHITA ELECTRIC IND CO LTD
    • MIURA IZUMI
    • B23P21/00H05K13/04H05K13/08
    • PURPOSE:To provide an electronic component mounting machine having a function of making optimum a recognition field region for an insertion hole pitch of a printed board into which electronic components are inserted to improve recognition accuracy. CONSTITUTION:A recognition side printed board 26 and an insertion side printed board 27 are disposed on an XY table 25 for two sheets of the foregoing boards. There are disposed a first recognition camera 21, a second recognition camera 22, a thrid recognition camera 23, and an insertion head 24. The first recognition camera 21 and the second recognition camera 22 are set to optimum recognition fields, mathced respectively with an insertion pitch of higher frequency of its use and with an insertion pitch of lower frequency of its use. The insertion head 24 and the first recognition camera 21 are constructed so as to satisfy a relative position relation, and in the case of use of the first recognition camera 21 it is recognized simultaneously with the insertion process, while in the case of use of the second recognition camera 22 the XY table 25 is moved for recognition.
    • 10. 发明专利
    • METHOD AND DEVICE FOR MOUNTING PART
    • JP2000236199A
    • 2000-08-29
    • JP3751799
    • 1999-02-16
    • MATSUSHITA ELECTRIC IND CO LTD
    • MIURA IZUMINAKANO TOMOYUKIMIMURA NAOTO
    • H05K13/04H05K13/08
    • PROBLEM TO BE SOLVED: To highly precisely mount a part position in short time by controlling an operation, based on image recognition position information, determining correction degree on actual picture information, setting an image condition to a right degree and mounting a part based on position information in image recognition. SOLUTION: An illuminance calibration for making an image pickup condition to be right is manually or automatically set in a control system (1). A position recognition mark corresponding to a prescribed position on a circuit board, where an electronic part is mounted, is moved to a position in the image pickup view of a recognition camera (3) through the operation for picking up the prescribed electronic component by a mounting head (2). The position recognition mark is illuminated with an illumination means and the recognition camera picks up its image. The partial image of the circuit board with the position recognition mark as a center is picked up on a CCD area sensor, and it is converted into image data of an electrical signal. The right degree of the recognition state of image data is determined, illumination is made right (5) and it is stored in a memory as right image pickup data of the position recognition mark of the circuit board (6).