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1. 发明专利

JP2004178667A Positioning method of light receiving element and assembling device for the same 审中-公开
公开(公告)号：JP2004178667A
公开(公告)日：2004-06-24
申请号：JP2002342422
申请日：2002-11-26
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TSURUTA SHUHEI , KANESHIMA KEINOSUKE , UCHIMURA SEIICHI , TSUCHIYAMA YOSHINORI
IPC分类号： G11B7/22 , G11B7/13
摘要： PROBLEM TO BE SOLVED: To provide a positioning method of a light receiving element which can always position the light receiving element with high accuracy in a position where a light receiving voltage value becomes the maximum regardless of the magnitude of variations in distortion of the backlash of a chuck which grasps the element, and an assembling device of the element which can embody faithfully the positioning method of the element.
SOLUTION: In this method, the light receiving voltage value of a light receiving element 4 is sampled by moving a chuck 8 which grasps the element 4 in a direction orthogonal to an incident laser beam L and the position of the element 4, where the light receiving voltage value becomes the maximum is detected and the maximum moving amount S in which the chuck 8 can move without changing the light received quantity of the element 4 while moving it from the idle state is detected and the chuck 8 is positioned and stopped at a prescribed position where the light receiving voltage value of the element 4 becomes the maximum while moving the chuck 8 in the same direction as that of the sampling time and the chuck 8 which is stopped at the prescribed position is moved by a distance S/2 being the half of the maximum moving amount S.
COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2000076710A Method and device for sticking substrate for optical disk 审中-公开
标题翻译：用于粘贴光盘的基板的方法和装置
公开(公告)号：JP2000076710A
公开(公告)日：2000-03-14
申请号：JP23979298
申请日：1998-08-26
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： HIGAKI NORIHIDE , MATSUNAGA KOJI , KANESHIMA KEINOSUKE
IPC分类号： B29C35/08 , B29C65/48 , B32B37/12 , G11B7/26
CPC分类号： B29C35/08 , B29C65/1406 , B29C65/1435 , B29C65/1483 , B29C65/1496 , B29C65/4845 , B29C65/521 , B29C65/7847 , B29C66/1122 , B29C66/452 , B29C66/71 , B29C66/72321 , B29C66/73921 , B29C66/8322 , B29C66/91216 , B29C66/91221 , B29C66/9141 , B29C66/91411 , B29C66/91431 , B29C66/91641 , B29C66/934 , B29C66/9532 , B29C66/9534 , B29C66/961 , B29C2035/0827 , B29K2101/10 , B29K2105/0097 , B29K2995/0027 , B29L2017/005 , B32B37/0023 , B32B37/12 , B32B2038/0076 , B32B2429/02 , G11B7/26 , B29K2069/00
摘要： PROBLEM TO BE SOLVED: To prevent the generation of deformation such as warpage in an optical disk, thereby obtaining the optical disk satisfactory in flatness when the optical disk is manufactured by sticking substrates for the optical disk. SOLUTION: This method is executed by irradiating a substrate pair Dx, which consists of a pair of the substrates for optical disk in which a photo setting adhesive layer (g) is interposed midway, with a hardening light, thereby photo setting the adhesive layer (g) and sticking the substrates with each other. The optical disk satisfactory in flatness, which is less in deformation such as warpage, is obtd. by taking measures for preventing deformation such as warpage generating in the substrate pair Dx such as arrangement of a spacer 110 on a mounting base 100, thereby providing difference in elevation between the central side and outer peripheral side of the substrate pair Dx when the adhesive layer (g) is photoset.
摘要翻译：要解决的问题：为了防止在光盘中产生诸如翘曲的变形，从而获得当通过粘附用于光盘的基板制造光盘时平坦度令人满意的光盘。解决方案：通过照射由一对用于光固化粘合剂层（g）的中间位于其中间的光盘基板组成的基板对Dx执行固化光，从而光固化粘合层（ g）并将基板粘贴在一起。平坦度好，翘曲变形少的光盘是可以实现的。通过采取措施来防止诸如在安装基座100上的间隔件110的布置等基板对Dx中的翘曲产生的变形，从而当粘合剂层Dx的基板对Dx的中心侧和外周侧之间的高度差异（g）是照片。

3. 发明专利

JP2000340533A CMP PROCESSING DEVICE 失效
公开(公告)号：JP2000340533A
公开(公告)日：2000-12-08
申请号：JP14597999
申请日：1999-05-26
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KANESHIMA KEINOSUKE , KAWA TOMOHIRO
IPC分类号： B24B37/30 , H01L21/304 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To make the polished surface of a work into accurate flat plane by polishing, independently of whether dust penetrates into a gap between the work and a suction table. SOLUTION: A CMP processing device is equipped with a suction table 37, which rotates sucking up and holding a work 23 with its support surface 37a and a polishing pad 30, which moves rotating and pressing on the work 23 so as to conduct chemical and mechanical polish (CMP processing) on the polished surface 23a of the work 23 through the intermediary of polishing slurry 3 fed between the polished surface 23a of the work 23 and the pad 30 itself. An elastic suction plate 38 is attached to the support surface 37a of the suction table 37 in a freely detachable manner. Or the entire suction table 37 is formed of resin.

4. 发明专利

JP2002056580A PANEL ALIGNMENT METHOD AND DEVICE FOR SUBSTRATE 失效
公开(公告)号：JP2002056580A
公开(公告)日：2002-02-22
申请号：JP2000245785
申请日：2000-08-14
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： HIGAKI NORIHIDE , HAMAMURA KOHEI , KANESHIMA KEINOSUKE
IPC分类号： C09J5/00 , G11B7/26
摘要： PROBLEM TO BE SOLVED: To provide a panel alignment method and device for aligning aligned substrates having stable quality by assuring sufficient strength with the least possible necessary adhesives. SOLUTION: Two substrates 11 and 12 are brought into tight contact with each other within a vacuum atmosphere and the adhesives 47 are applied to the aligned surfaces of the outer peripheral parts thereof and the inner peripheral parts of center holes 11c and 12c. The adhesives are cured while the tight adhesion of the substrates with each other is maintained in such a manner that the whole or part of the aligned surfaces does not come into contact with the outdoor air.

5. 发明专利

JP2000334655A CMP WORKING DEVICE 失效
公开(公告)号：JP2000334655A
公开(公告)日：2000-12-05
申请号：JP14597899
申请日：1999-05-26
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KANESHIMA KEINOSUKE , KAWA TOMOHIRO , YASUHIRA NOBUO
IPC分类号： B24B37/12 , B24B37/32 , H01L21/304 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To remarkably reduce frictional heat generated between a working surface of a polishing pad and a retainer ring by rotating the retainer ring following the polishing pad by receiving rotational force of the polishing pad when the polishing pad is moved on the retainer ring. SOLUTION: A retainer ring 34 is supported on a sucking table 24 and the supporting base part 27 in a freely ratable state by interposing a bell bearing 37. As a result, when a polishing pad 30 is moved on the retainer ring 34, the retainer ring 34 is rotated following the polishing pad 30 by receiving rotational force of the polishing pad 30. Therefore, the existence of the retainer ring 34 does not become remarkably large resistance for rotation of the polishing pad 30 and frictional heat generated between a working surface 30a of the polishing pad 30 and the retainer ring 34 is remarkably reduced. Therefore, excellent flat performance can be secured for a comparatively long period.

6. 发明专利

JPH11283505A ELECTRODE PANEL WITHSTAND VOLTAGE TESTING METHOD AND DEVICE 失效
公开(公告)号：JPH11283505A
公开(公告)日：1999-10-15
申请号：JP8569198
申请日：1998-03-31
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KANESHIMA KEINOSUKE , ISHIKURA YASUHISA
IPC分类号： H01J9/42
摘要： PROBLEM TO BE SOLVED: To simply, accurately test an electrode panel by arranging a testing electrode to form a gap between a dielectric layer and the testing electrode through a discharging gas atmosphere formed on the dielectric layer surface of the electrode panel and applying a voltage between a discharge electrode of the electrode panel and the testing electrode. SOLUTION: The tip of a gas passing through-hole 55 along the both sides of a testing electrode 80 from a gas chamber 54 is communicated with a gas- holding space 56. The gas-holding space 56 is wider than the gas passing through-hole 55, discharging gas is filled in the gas holding space 56, then passed through a gap between the lower end of a testing arm 50 and an electrode panel 20, and exhausted from the both sides of the testing arm 50. Since the fixed range of the lower end periphery of the testing electrode 80 is covered with a testing gas atmosphere, the testing electrode 80 and a discharge electrode 24 of the electrode panel 20 are kept in the discharge atmosphere which is similar to that of a cell space at the using of a PDP. Thereby, since withstand voltage test is conducted in the environment similar to the using conditions, quality of the electrode panel 20 is determined accurately and simply.

7. 发明专利

JP2002228440A AXIS CENTER POSITIONING METHOD AND DEVICE THEREOF 失效
公开(公告)号：JP2002228440A
公开(公告)日：2002-08-14
申请号：JP2001027578
申请日：2001-02-05
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MITO SEIKI , KANESHIMA KEINOSUKE
IPC分类号： G01B5/25 , F04D29/04 , F16C23/02 , F16C41/00 , G01B21/24
摘要： PROBLEM TO BE SOLVED: To provide an axis center positioning method and a device thereof capable of easily and reliably fitting the axis of a rotor in the center of a bearing, reducing the occurrence of mechanical fatigue such as friction, deformation, etc., in a shaft and the bearing, extending the durability and lives of a motor, etc., and reducing energy consumption. SOLUTION: In the basis of the X-Y coordinates of the axis center J3 in every direction obtained by pressing the shaft J2 in the bearing J1 in any given direction, the center coordinates C1 of the bearing obtained by computations in accordance with the theorem that the point of intersection of the perpendicular bisectors of the sides of a triangle is the center of a circle passing through the points J3c, J3a, and J3b are taken as coordinates for positioning the axis center. By positioning the shaft J2 to the bearing J1, it is possible to position the axis center J3 to the center of the bearing J1 without rotating the shaft J2, to shorten the time necessary for the positioning, and to secure accuracy in positioning the axis center J3 to the bearing J1 at all times.

8. 发明专利

JP2001198801A POLISHING DEVICE AND POLISHING METHOD 失效
公开(公告)号：JP2001198801A
公开(公告)日：2001-07-24
申请号：JP2000012931
申请日：2000-01-21
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KAWA TOMOHIRO , KANESHIMA KEINOSUKE , SHINGU KATSUKI
IPC分类号： B24B37/005 , B24B37/015 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To provide a polishing device and a polishing method suitable for flattening the surface of the work to be processed at a controlled temperature by a chemical and mechanical polishing(CMP) method. SOLUTION: A fluid pressure in a first passage 13 to supply the fluid 11 to a space 14 is kept bigger than a fluid pressure in a second passage 15 to discharge the fluid from the space 14 by using a polishing tool 100 having the space 14 formed so as to make contact with a polishing pad 1 through an elastic body 2 in a polishing pad holder 5. The flow of the fluid is produced in the space 14 and the fluid pressure in the space 14 is practically kept at a designated value by supplying the fluid to the space 14 and discharging it from the space 14. The polishing pad 1 is pressed onto a work by transmitting the fluid pressure in the space 14 to the polishing pad 1 through the elastic body 2, and the polishing pad 1 is moved relatively to the work while controlling the temperature of the fluid supplied to the space 14, in order to grind the work.

9. 发明专利

JP2001053040A POLISHING DEVICE AND METHOD 失效
公开(公告)号：JP2001053040A
公开(公告)日：2001-02-23
申请号：JP22509799
申请日：1999-08-09
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TSUTSUMI HIDETAKA , INAGAKI NORIYUKI , KANESHIMA KEINOSUKE , KAWA TOMOHIRO
IPC分类号： B23Q11/00 , B23Q11/08 , B24B55/04 , B24B57/02 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To confine scattering of a polishing liquid caused during polishing in a certain space to prevent contamination of elements of a polishing device with the polishing liquid. SOLUTION: There are provided a rotating portion 13 on which a polishing pad 15 is mounted, a fixed portion 12 on which the rotating portion is mounted, and a head cover 14 for enclosing the rotating portion. A polishing head 10 whose lower edge portion is positioned below a polishing surface of the polishing pad is used. A liquid is supplied on the outside surface of the head cover 14. The supplied liquid is allowed to flow down from the whole periphery of the lower edge portion of the head cover 14 to form a water curtain 26. Thus, scattering of the polishing liquid is confined in a space formed by the head cover 14 and the water curtain 26.

10. 发明专利

JP2000340536A CMP RROCESSING METHOD 失效
公开(公告)号：JP2000340536A
公开(公告)日：2000-12-08
申请号：JP14597799
申请日：1999-05-26
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KANESHIMA KEINOSUKE , YASUHIRA NOBUO , OKUYA NORIO , KAWA TOMOHIRO , SHINGU KATSUKI
IPC分类号： B24B37/10 , H01L21/304 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To provide a CMP processing method capable of lessening a CMP processing device in size and accurately and uniformly flattening over the entire surface of a work through polishing. SOLUTION: A pad rotating table 24 is rotated and equipped with a polishing pad 23 on its surface, and a suction pad 28 sucks up a work 27 to hold and rotates while pressing the work 27 against a polishing pad 23 to chemically and mechanically polish (CMP processing) the surface of the work 27 through the intermediary of polishing slurry fed between the work 27 and the polishing pad 23, and the rotating table 24 and the suction pad 28 are rotated at the same number of revolutions.

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