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    • 3. 发明专利
    • SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
    • JPH0344968A
    • 1991-02-26
    • JP18111289
    • 1989-07-12
    • MATSUSHITA ELECTRIC IND CO LTD
    • OTSUKA REITAKEDA YOSHIYA
    • H01L23/52H01L21/3205H01L29/78H01L29/786
    • PURPOSE:To manufacture a semiconductor device having a simple structure at a high yield through a small number of manufacturing processes by providing a plurality of silicon films of non-single crystals at specific positions and making the film on one side to contain more hydrogen elements. CONSTITUTION:After forming a Cr metal layer 2 by sputtering, the layer 2 is selectively etched. Then the layer 2 is successively coated with SiNx layer 3, a-Si layer 4 containing little impurities, snd SiNx layer 5 of specific concentrations. The layer 5 contains more hydrogen than the layer 3 does and the layer 3 is composed principally of a high-melting point metal containing a nonmetallic element between a silicon film of non-single crystals and wiring. In addition, the layer 5 is formed between the layer 3 and the above-mentioned silicon film of non-single crystals. When such structure is used, the problem of stripping off can be eliminated, since no n a-Si film is formed, and the number of manufacturing processes can be reduced while the ohmic property is maintained in the connection between the layer 4 and metallic wiring. Therefore, the yield can be improved and wiring resistance can be reduced.
    • 7. 发明专利
    • MANUFACTURE OF AMORPHOUS SILICON PHOTOCONDUCTIVE FILM
    • JPH01164074A
    • 1989-06-28
    • JP23301288
    • 1988-09-16
    • MATSUSHITA ELECTRIC IND CO LTD
    • TAKEDA YOSHIYAFUJIWARA SHINJI
    • H01L31/08H01L21/205H01L31/0248H01L31/09H01L31/20
    • PURPOSE:To obtain an image pickup tube target whose number of pinholes is a few and whose photoconductive characteristic is excellent by a method wherein a hydrogen concentration value of a first amorphous silicon film is controlled so as to be smaller than a hydrogen concentration value of a second amorphous silicon film when a film is to be formed, CONSTITUTION:When a layer 3 whose hydrogen concentration value is large is formed on the surface side of a film, it is possible to restrain a carrier from being injected from an electrode 4 on the opposite side of a transparent electrode 1; a dark current is reduced. For example, a photoconductive film 33 whose hydrogen concentration value is comparatively small is formed on an In2O3 transparent electrode 32 on a glass substrate 31 by using a magnetron sputtering device under conditions of a substrate temperature of 200 deg.C, an argon pressure of PAr=5X10 Torr and a discharge electric power of 200W under a hydrogen partial pressure of PH2=2X10 Torr for 10 minutes; after that, a hydrogen partial pressure of PH2=8X10 Torr is introduced for 60 minutes; a photoconductive film 34 whose hydrogen concentration value is comparatively large is formed; a good photoconductive film without a pinhole and with a thickness of 1mum can be obtained.
    • 8. 发明专利
    • MANUFACTURE OF SEMICONDUCTOR DEVICE
    • JPH01133323A
    • 1989-05-25
    • JP29235787
    • 1987-11-19
    • MATSUSHITA ELECTRIC IND CO LTD
    • TAKEDA YOSHIYA
    • H01L21/302H01L21/3065
    • PURPOSE:To perform microetching of a layer without giving no damage to a foundation by using gas for etching containing the first gas having fluorine as a constituent and the second gas having nitrogen as a constituent so as to etch the layer formed on tantalum oxide. CONSTITUTION:Fluorine hydrocarbon system gas such as CF4, CHF3, nitrogen fluoride such as NF3 and XeF are used as the first gas containing fluorine as a constituent, while nitrogen oxide such as N2, N2O and NH3, NF3 are used as the second gas. A means, which generally excites a substance, such as plasma discharge, ultraviolet ray radiation may do as a means for forming the first and the second gas mentioned above into radicals and ions of fluorine and nitrogen. A radical of fluorine reacts on Si to become silicon fluoride and tantalum becomes gas called tantalum fluoride having high vapor pressure so as to advance etching. Here, under existing fluorine, the radical of nitrogen is excluded from advancing to silicon nitride by reacting on Si. However, in the case of tantalum, reaction on tantalum nitride having low vapor pressure on the tantalum surface advances even under existing fluorine to prevent further etching so as to obtain a large etching selection ratio.