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1. 发明专利

JP2002124539A METHOD AND STRUCTURE FOR CONNECTING PAD ELECTRODE, AND METHOD FOR INSPECTING CONNECTING CONDITION 失效
公开(公告)号：JP2002124539A
公开(公告)日：2002-04-26
申请号：JP2000312192
申请日：2000-10-12
申请人： MURATA MANUFACTURING CO
发明人： MORIMOTO RYOICHI , HIROTA MIHO , FUNAKI TATSUYA
IPC分类号： G01N23/04 , G01N33/20 , H01L21/60 , H01L21/66 , H01L23/498 , H05K1/18 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a method and structure for connecting component-side pad electrode with a substrate-side pad electrode by soldering bump, and a method for inspecting the connection condition capable of complying with a high density packaging and downsizing a product made by packaging a surface mount component on a substrate. SOLUTION: The substrate-side pad electrodes 12 are disposed within a mounting area A of the component, and the length L1 of the substrate-side pad electrodes 12 is set longer than the length L2 of the corresponding component-side pad electrodes 2. An IC chip (surface mounting component) 4 is mounted and heated so that solder bumps 3 are confronted with the prescribed substrate-side pad electrode 12 and the melted solder bumps 3 connect the component-side pad electrode 2 with the substrate-side pad electrode 12 through the solder 3a. The width of the component-side pad electrodes and the solder bump on the component-side pad electrodes are set wider than the width of the substrate-side pad electrodes.

2. 发明专利

JP2001358452A ELECTRONIC COMPONENT MOUNTING METHOD 失效
公开(公告)号：JP2001358452A
公开(公告)日：2001-12-26
申请号：JP2000180085
申请日：2000-06-15
申请人： MURATA MANUFACTURING CO
发明人： MORIMOTO RYOICHI , HIROTA MIHO
IPC分类号： H05K3/28 , B23K35/14 , H01L21/60 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a method for mounting electronic components that can efficiently and securely mount surface mounting parts and ICs onto one substrate. SOLUTION: High-temperature solder paste 4 is supplied to an electrode 2 for mounting the surface mounting parts, surface mounting parts 40 are mounted onto the electrode 2 for temporarily fixing by the paste 4, flux 5 is applied onto an electrode 1 where an IC 30a having eutectic soldering bump should be mounted or is applied to an eutectic soldering bump 31, the IC 30a is mounted onto the electrode 1 for temporarily fixing by the flux 5, a wiring board 10 is heated in high-temperature atmosphere where the high-temperature and eutectic solder is fused, and the surface mounting parts 40 and IC 30a are subjected to reflow soldering.

3. 发明专利

JPH0745930A MOUNTING STRUCTURE OF ELECTRONIC PART ELEMENT AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH0745930A
公开(公告)日：1995-02-14
申请号：JP20898393
申请日：1993-07-29
申请人： MURATA MANUFACTURING CO
发明人： ARIYOSHI AKIRA , SARUTA SADAKICHI , HORI YOSHITSUGU , MORIMOTO RYOICHI
IPC分类号： H05K1/18 , H01L21/60 , H05K3/32 , H05K3/34
摘要： PURPOSE:To provide the mounting structure and the manufacturing method of an electronic part element without application of large stress on the electronic part element even if mechanical stress of thermal stress of a board is applied. CONSTITUTION:An intermediate member 20, in which a plurality of conductor wires 18 are arranged and filled in the thickness direction of a flat binder 17, is prepared. Electrode layers 16 are formed at positions corresponding to a piezoelectric element electrodes 9A and 9B as the conductor of a piezoelectric element 5 and a board 10 as the conductor connecting parts by vapor deposition and the like. The intermediate member 20 is mounted on the substrate 10. The piezoelectric element 5 is mounted on the intermediate member 20. One end side of a conductor wire 18 of the intermediate member 20 is connected to the electrode 9A of the piezoelectric element 5 with solder 7, and the other end side is connected to the electrode 9B of the substrate 10 with the solder 7. The binder 17 and the excessive conductor wire 18 are removed with solvent. The piezoelectric element 5 is mounted on the substrate 10 through the conductor wire 18.

4. 发明专利

JPH06349894A ELECTRONIC COMPONENT EQUIPMENT 失效
公开(公告)号：JPH06349894A
公开(公告)日：1994-12-22
申请号：JP16029693
申请日：1993-06-04
申请人： MURATA MANUFACTURING CO
发明人： MORIMOTO RYOICHI , HORI YOSHITSUGU
IPC分类号： H01L21/60 , H01L21/321
摘要： PURPOSE:To accurately position an integrated circuit parts on a board, and improve workability at the time of mounting, when the integrated circuit parts is mounted on the board. CONSTITUTION:Bumps 25 for position alignment which largely protrude more downward than each bump 24 for signal are formed on the lower side surface of a chip 21, and each land 27 is formed in the position corresponding with each of the bumps 25 for position alignment on a board 26. When the chip 21 is mounted on the board 26, a connection part 25B of each of the bumps 25 for position alignment is heated and fused. By the effect of the surface tension of the connection parts 25B turned into the state of liquid, the chip 21 is positioned accurately on the board 26.

5. 发明专利

JPH0614581B2 失效
公开(公告)号：JPH0614581B2
公开(公告)日：1994-02-23
申请号：JP1841488
申请日：1988-01-27
申请人： MURATA MANUFACTURING CO
发明人： HATA TOSHIO , MORIMOTO RYOICHI , OOTA HIROYUKI , KODO GIICHI
IPC分类号： H05K3/46 , H05K1/02 , H05K1/03 , H05K3/00 , H05K3/40

6. 发明专利

JPH01278092A MULTILAYER CERAMIC SUBSTRATE 失效
公开(公告)号：JPH01278092A
公开(公告)日：1989-11-08
申请号：JP10783588
申请日：1988-04-30
申请人： MURATA MANUFACTURING CO
发明人： MORIMOTO RYOICHI , NISHIDE MITSUYOSHI
IPC分类号： H05K9/00 , H05K3/46
摘要： PURPOSE:To obtain a good shielding effect by a method wherein shield electrode layers are constituted of one set each of electrode layers which are faced each other by sandwiching individual reticulated layers and whose electrode patterns are formed in such a way that their meshes disappear when they are piled up mutually. CONSTITUTION:Shield electrode layers 14 are constituted of one set each of electrode layers 14a, 14b which are faced each other by sandwiching individual reticulated ceramic layers 2 and whose electrode patterns are formed in such a way that their meshes disappear when they are piled up mutually. Since the individual electrode layers 14a, 14b are connected to the upper and lower ceramic layers through their mesh parts, it is possible to prevent the layers from being stripped; in addition, the electrode patterns are formed in such a way that their mesh parts disappear when the individual electrode layers 14a, 14b are piled up mutually; accordingly, through the collaboration a good shielding effect can be obtained.

7. 发明专利

JPH01260889A MANUFACTURE OF MULTILAYER INTERCONNECTION BOARD 失效
公开(公告)号：JPH01260889A
公开(公告)日：1989-10-18
申请号：JP8968288
申请日：1988-04-12
申请人： MURATA MANUFACTURING CO
发明人： MORIMOTO RYOICHI
IPC分类号： H05K3/46
摘要： PURPOSE:To fill each through hole with an adequate amount of conductive paste and to avoid the attachment of the conductive paste to the stage of a printing apparatus, by printing a wiring pattern on one side surface of a first green sheet, laminating and temporarily compressing a second green sheet thereon, printing a wiring pattern on the upper surface of the laminated green sheet, forming via-holes, and thereafter temporarily compressing another green sheet on the upper part thereof. CONSTITUTION:Wiring patterns L4 and L5 are printed on the surface of a green sheet 2. Then a green sheet 1 is laminated on the printed surface of the green sheet 2 and temporarily compressed. Then the temporarily compressed green sheet is turned over. Wiring patterns L6 and L7 are formed on the surface of the green sheet 2 by screen printing. Thereafter, a green sheet 3 is laminated on the upper part of the green sheet 2 and temporarily compressed. Then, the laminated green sheet is turned over. Conductive paste is printed on the side of the green sheet 1. Wiring patterns L1, L2 and L3 are formed. Through holes H1 and H2 are filled with the conductive paste.

8. 发明专利

JPH11312711A METHOD FOR CONNECTING ELECTRONIC COMPONENT 失效
公开(公告)号：JPH11312711A
公开(公告)日：1999-11-09
申请号：JP12017098
申请日：1998-04-30
申请人： MURATA MANUFACTURING CO
发明人： MORIMOTO RYOICHI , NITTA KOICHI
IPC分类号： H05K3/32 , H01L21/60 , H01L23/485 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a connecting method with superior productivity for connecting a first electronic component such as an IC chip with a wiring board as a second electronic component in a connecting structure in a bump electrode configuration. SOLUTION: Thermosetting conductive adhesive is applied to an electrode 25 for connecting an IC chip 21 as a first electronic component by printing, and by making it hardened a protrusion electrode 26 in a bump electrode configuration protruded so as to be tapered like a cone can be formed. Conductive adhesive 2 for connection is applied to the protrusion electrode 26, and in a stage that the conductive adhesive 27 is not yet hardened, the IC chip 21 and a wiring board 22 as a second electronic component are positioned so that the top end of the protrusion electrode 26 can be brought into contact with an electrode 29 for connection on the wiring board 22, and in this state, the conductive adhesive 27 for connection is hardened.

9. 发明专利

JPH08307196A MOUNTING STRUCTURE FOR PIEZOELECTRIC ELEMENT 失效
公开(公告)号：JPH08307196A
公开(公告)日：1996-11-22
申请号：JP10961295
申请日：1995-05-08
申请人： MURATA MANUFACTURING CO
发明人： MORIMOTO RYOICHI
IPC分类号： H01L23/28 , H01L41/09 , H03H9/02 , H03H9/25
摘要： PURPOSE: To ensure sufficient vibration function, to make the size small and the height low and to improve the vibration resistance and heat and shock resistance considerably by interposing a resin layer made of a resin material fully between an inner side of a case cover and a rear side of a piezoelectric element opposite to a vibration face. CONSTITUTION: The inside of an opening recessed part 2a on which a SAW filter 1 is mounted is closed by a metal-made case cover bonded by a seam welding to the opening end, and a resin layer 9 packing a thermosetting resin material of a non-solvent group such as an epoxy resin between a rear side of the SAW filter 1 opposite to the case cover 6, that is, the rear side opposite to the vibration face and the inner face of the case cover 6 and cured is interposed. Then the rear side of the SAW filter 1 opposite to the vibration face provided with a bump 7 is connected to the case cover 6 via the resin layer 9 and connected to the case main body 2 via the case cover 6.

10. 发明专利

JPH0834341B2 失效
公开(公告)号：JPH0834341B2
公开(公告)日：1996-03-29
申请号：JP22646489
申请日：1989-08-31
申请人： MURATA MANUFACTURING CO
发明人： MORIMOTO RYOICHI , OKUMURA SHO
IPC分类号： H05K3/22 , H05K1/16

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