专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JPH10265927A MANUFACTURE OF PB PLATING AIRTIGHT TERMINAL 失效
公开(公告)号：JPH10265927A
公开(公告)日：1998-10-06
申请号：JP9293897
申请日：1997-03-26
申请人： MIYOTA KK
发明人： AOKI KAZUAKI , TAKAYANAGI HIROAKI , SHIOZAWA REIKO
IPC分类号： C23C18/32 , C23C2/10 , C23C2/34 , C23C18/52 , C23C28/02 , C25D5/34 , C25D5/48 , C25D7/00
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a Pb plating airtight terminal which is excellent in appearance characteristic, etc., by establishing respective factors and conditions at the time of executing high temp. soldering and plating (Pb plating). SOLUTION: After the pretreatment such as the defatting, washing and activation of the airtight terminal is executed in the manufacturing method of the Pb plating airtight terminal by which the Pb plating (90% or larger Pb plating) is executed on the surfaces of an outer peripheral metal and a lead, 1. Ni plating is executed on the airtight terminal as a substrate of the Pb plating. The roughens of a basis material is reduced by setting the thickness of Ni plating to 2 to 5 μm. 2. Next, the surface condition of the Pb plating is improved by removing an oxidized film of the airtight terminal, on which the substrate Ni plating is smoothly executed, thereby activating the surface of the substrate Ni plating. 3. Next, the airtight terminal is immersed into a Pb plating bath, to which a brightening agent is added, to electrodeposit the Pb plating by setting the Pb content in the Pb plating bath to 90 to 92.5%. 4. Finally, the Pb plated airtight terminal is completed by executing the chemical treatment or heat treatment of the Pb plated airtight terminal.

IPRDB

热门服务

关于我们

友情链接

联系方式