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1. 发明专利

JPH0859826A POLYAMIDE AND HEAT-RESISTANT ADHESIVE PREPARED THEREFROM 失效
公开(公告)号：JPH0859826A
公开(公告)日：1996-03-05
申请号：JP19146194
申请日：1994-08-15
申请人： MITSUI TOATSU CHEMICALS
发明人： TAMAI MASAJI , IIYAMA KATSUAKI , SHIBUYA ATSUSHI , YAMAGUCHI TERUHIRO
IPC分类号： C08G69/42 , C09D177/00 , C09D177/06 , H05K3/38
摘要： PURPOSE: To obtain a heat-resistant adhesive of a low-temp. adhesion type by using a polyamide obtd. by reacting bis(aminophenoxydimethylbenzyl)benzene, a specific diaminosiloxane compd., and terephthaloyl chloride. CONSTITUTION: A polyamide is produced by reacting 1mol of 1.3- or 1,4-bis[4-(4 aminophenoxy)-α, α-dimethylbenzyl]benzene, 1-0.005-mol of a diaminosiloxane compd. of formula I wherein n is 0-7), and terephthaloyl or isophthaloyl chloride. It is important from the viewpoint of the adhesive properties and heat resistance of the resulting adhesive that the polyamide contains the siloxane units derived from the compd. of formula I and the units of formula II in a ratio of the former units to the latter of 1-0.005, pref. 0.2-0.1. In the above reaction a monocarboxylic acid or a monoamine can be used for blocking molecular terminals. A low-temp. soln. polycondensation method is suitable for obtaining a heat-resistant adhesive soln. contg. the polyamide. The soln. is applied and dried to bond a copper foil to glass. etc., providing a sufficient 90 deg. peeling strength even at low temp. and pressure.

2. 发明专利

JPH07268097A POLYIMIDE OF GOOD THERMAL OXIDATION STABILITY AND ITS PRODUCTION 失效
公开(公告)号：JPH07268097A
公开(公告)日：1995-10-17
申请号：JP6099494
申请日：1994-03-30
申请人： MITSUI TOATSU CHEMICALS
发明人： SHIBUYA ATSUSHI , SAKATA YOSHIHIRO , GOI MASAJI , YAMAGUCHI TERUHIRO
IPC分类号： C08G73/10
摘要： PURPOSE:To obtain a polyimide excellent in thermal oxidation stability, dimensional stability, flame retardancy and electrical insulation properties. CONSTITUTION:This polyimide is the one having a C1 content of 10ppm or below and comprising repeating units represented by the formula (wherein R1 is a 2-27C bivalent group selected from the group consisting of an aliphatic group, a cycloaliphatic group, a monocyclic aliphatic group, a fused polycyclic aromatic group and a nonfused polycyclic aromatic group composed of aromatic groups bonded with each other directly or through bridging members; and R2 is a 2-27C tetravalent group selected from the group consisting of an aliphatic group, a cycloaliphatic group, a monocyclic aliphatic group, a fused polycyclic aromatic group and a nonfused polycyclic aromatic group composed of aromatic groups bonded with other directly or through bridging members).

3. 发明专利

JPH07165913A POLYIMIDE HAVING EXCELLENT THERMAL-OXIDATIVE STABILITY AND ITS PRODUCTION 失效
公开(公告)号：JPH07165913A
公开(公告)日：1995-06-27
申请号：JP31779793
申请日：1993-12-17
申请人： MITSUI TOATSU CHEMICALS
发明人： TAMAI MASAJI , SHIBUYA ATSUSHI , KOGA NOBUSHI , YAMASHITA WATARU , YAMAGUCHI TERUHIRO
IPC分类号： C08G73/10
摘要： PURPOSE:To obtain the polyimide useful for electric.electronic devices, devices for space navigation, having a specific iron content by reacting a diamine compound with a tetracarboxylic aid anhydride. CONSTITUTION:This polyimide is obtained by heating and melting (A) a diamine compound of formula I (R1 is one or more bifunctional groups selected from a 2-45C aliphatic group, cyclocaliphatic, monocyclic bifunctional group) (e.g. ethylenediamine, 1,4-diaminobutane, 1,4-diaminocyclohexane or m- phenylenediamine) and (B) a tetracarboxylic acid dianhydride of formula II (R2 is a 4-27C aliphatic, cycloaliphatic or monocyclic aliphatic tetrafunctional group) (e.g. butanetetracarboxylic acid dianhydride or cyclopentanetetracarboxylic acid dianhydride) preferably in the presence of an organic solvent. The resultant polyimide has

4. 发明专利

JPH11322927A POLYAMIC ACID COPOLYMER, POLYIMIDE COPOLYMER, AND HEAT-RESISTANT ADHESIVE 失效
公开(公告)号：JPH11322927A
公开(公告)日：1999-11-26
申请号：JP12787998
申请日：1998-05-11
申请人： MITSUI TOATSU CHEMICALS
发明人： SAKATA YOSHIHIRO , OKUMURA TOMOMI , SHIBUYA ATSUSHI , KUROKI TAKASHI , OKAWA YUICHI , OIKAWA HIDEAKI
IPC分类号： C09J179/08 , C08G73/10
摘要： PROBLEM TO BE SOLVED: To obtain a polyamic acid copolymer which develops excellent adhesiveness and bonding strength even under application conditions including a low bonding temperature and/or a low bonding pressure by subjecting a diamine mixture obtained by combining a group of specified diamine compounds in a specified compositional ratio and an aromatic tetracarboxylic acid dianhydride to a polymerization reaction. SOLUTION: The diamine mixture comprises an aromatic diamine represented by formula I (wherein X is a direct bond, O, CO, or the like; and R1 to R4 and R1 ' to R4 ' are each H, F, Cl, or the like) and an ethylene glycol diamine represented by formula II (wherein (m) is 1-3; and (n) is 0 or 1-3) and/or an alkylenediamine represented by formula III (wherein (k) is 2-12) and has a ratio of the number of moles of the aromatic diamine to that of moles of the other diamines of 0.05-1.0. The aromatic tetracarboxylic acid dianhydride is represented by formula IV (wherein Ar is formula V or the like). In the polymerization, the reaction temperature is -20 to 70 deg.C, and the reaction time is 1-48 hr.

5. 发明专利

JPH11322928A POLYAMIC ACID COPOLYMER, POLYIMIDE COPOLYMER, AND HEAT-RESISTANT ADHESIVE 失效
公开(公告)号：JPH11322928A
公开(公告)日：1999-11-26
申请号：JP12788098
申请日：1998-05-11
申请人： MITSUI TOATSU CHEMICALS
发明人： SAKATA YOSHIHIRO , OKUMURA TOMOMI , SHIBUYA ATSUSHI , KUROKI TAKASHI , OKAWA YUICHI , OIKAWA HIDEAKI
IPC分类号： C08J3/12 , C08G73/10 , C08L79/08 , C09J179/08
摘要： PROBLEM TO BE SOLVED: To obtain a polyamic acid copolymer which develops excellent adhesiveness and bonding strength even under application conditions including a low bonding temperature and/or a low bonding pressure by subjecting a diamine mixture obtained by combining a group of specified diamine compounds in a specified compositional ratio and an aromatic tetracarboxylic acid dianhydride to a polymerization reaction. SOLUTION: The diamine mixture comprises an aromatic diamine represented by formula I (wherein X is a direct bond, O, CO, or the like; and R1 to R4 and R1 ' to R4 ' are each H, F, Cl, or the like) and an ethylene glycol diamine represented by formula II (wherein (m) is 1-3; and (n) is 0 or 1-3) and/or an alkylenediamine represented by formula III (wherein (k) is 2-12) and has a ratio of the number of moles of the aromatic diamine to that of moles of the other diamines of 0.05-1.0. The aromatic tetracarboxylic acid dianhydride is represented by formula IV (wherein Ar is formula V or the like). In the polymerization, the reaction temperature is -20 to 70 deg.C, and the reaction time is 1-48 hr.

6. 发明专利

JPH09157393A POLYAMIDE-IMIDE COPOLYMER 失效
公开(公告)号：JPH09157393A
公开(公告)日：1997-06-17
申请号：JP8113196
申请日：1996-04-03
申请人： MITSUI TOATSU CHEMICALS
发明人： SHIBUYA ATSUSHI , OKAWA YUICHI , TAMAI MASAJI , OTA MASAHIRO , YAMAGUCHI TERUHIRO
IPC分类号： C08L27/12 , C08G73/14 , C08L79/08 , C08L87/00 , D01F6/74
摘要： PROBLEM TO BE SOLVED: To obtain a liq.-crystalline polyamide-imide copolymer excellent in heat resistance, mechanical properties, processibility, thermotropic liq.-crystalline properties, resistance to water absorption. chemical resistance, etc., by selecting a specific polyamide-imide copolymer. SOLUTION: This liq.-crystalline polyamide-imide copolymer comprises 5-95mol% repeating structural units represented by formula I and 95-5mol% repeating structural units represented by formula II. The molecular ends of the copolymer may be blocked with an arom. dicarboxylic anhydride represented by formula I or IV (wherein Y and Z are each a 6-15C monocyclic arom. group, a condensed polycyclic arom. group, or a noncondensed polycyclic arom. group; and X a halogen) or an arom. monocarboxylic anhydride and/or an arom. monoamide represented by the formula: V-NH2 (wherein V is the same as Y or Z). The copolymer is used for a sliding member, a heat-resistant fiber, a molding, or a film.

7. 发明专利

JPH0841198A POLYIMIDE AND HEAT-RESISTANT ADHESIVE COMPRISING SAME 失效
公开(公告)号：JPH0841198A
公开(公告)日：1996-02-13
申请号：JP18221494
申请日：1994-08-03
申请人： MITSUI TOATSU CHEMICALS
发明人： TAMAI MASAJI , SHIBUYA ATSUSHI , YAMAGUCHI TERUHIRO
IPC分类号： C09J179/08 , C08G73/10
摘要： PURPOSE:To obtain a polyimide for a heat-resistant adhesive by reacting adding a specified diaminosiloxane compound to bis (aminophenoxydimethylbenzyl) benzenes and reacting the mixture with a tetracarboxylic acid dianhydride. CONSTITUTION:This polyimide is made by reacting under heating a diamine component containing 0.005-0.1mol of a diaminosiloxane compound of the formula (wherein n is 0-7) per mol of 1,3-and/or 1,4-bis [4-(4-aminophenoxy)-alpha,beta- dimethy]benzyl lbenzens with a tetracarboxylic acid dianhydride component such as pyromellitic acid in the presence of a dicarboxylic acid anhydride and/or a monoamino compound. When this polyimide is used for a heat-resistant adhesive, it is desirable that 0.95-1.05 mol of the diamine mixture is used per mol of the tetracarboxylic acid dianhydride. It is desirable that the acid anhydride and the monoamine both of which are used for termination are phthalic anhydride and an aniline derivative, respectively. When a heat-resistant adhesive solution comprising a solution of the polyimide is applied and dried, sufficient peeling adhesive strength can be attained even at low & temperature and pressure.

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