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1. 发明专利

JP2001096338A METHOD OF MANUFACTURING COPPER TUBE FOR REFRIGERATOR OR AIR-CONDITIONER 失效
公开(公告)号：JP2001096338A
公开(公告)日：2001-04-10
申请号：JP27283299
申请日：1999-09-27
申请人： MITSUI SHIPBUILDING ENG , HITACHI CABLE
发明人： SASAKI MASAHIKO , FUYU KIYOUHEI , OIZUMI KIYOSHI , SASAKI HAJIME
IPC分类号： B22D11/00 , B22D11/055 , C22F1/00 , C22F1/08
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a qualified copper tube for a refrigerator or air-conditioner at low manufacturing cost. SOLUTION: A material copper tube is prepared by continuous casting process used a heating mold, and the material tube, having a directionally solidified structure, is processed to form the copper tube with

2. 发明专利

JP2001096337A METHOD OF MANUFACTURING COPPER TUBE 失效
公开(公告)号：JP2001096337A
公开(公告)日：2001-04-10
申请号：JP27283199
申请日：1999-09-27
申请人： MITSUI SHIPBUILDING ENG , HITACHI CABLE
发明人： SASAKI MASAHIKO , FUYU KIYOUHEI , OIZUMI KIYOSHI , SASAKI HAJIME
IPC分类号： B22D11/00 , B21C1/00 , B21C9/00 , B22D11/055 , B22D11/059 , C22C9/00 , C22F1/00 , C22F1/08
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a copper tube which is inexpensive and stable in quality. SOLUTION: A material tube of copper is cast by a continuous casting process using a heated mold, and the resultant material tube having a directionally solidified structure is processed by applying at least twice of cold drawing and annealing to form the copper tube having a prescribed size.

3. 发明专利

JP2010150597A Rolled copper foil 审中-公开
标题翻译：卷绕铜箔
公开(公告)号：JP2010150597A
公开(公告)日：2010-07-08
申请号：JP2008329532
申请日：2008-12-25
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： SASAKI HAJIME , MUROGA TAKEMI
IPC分类号： C22C9/00 , C22F1/00 , C22F1/08 , H05K1/09
摘要： PROBLEM TO BE SOLVED: To provide a rolled copper foil having excellent flexibility at low cost for corresponding to the request of higher flexibility to a flexible wiring member, such as a flexible printed circuit.
SOLUTION: The rolled copper foil, is the one after the last cold-rolling process and before recrystallizing-annealing, and composed of the pure copper containing ≤300 ppm oxygen, and in the result obtained with an X-ray diffraction pole figure measurement using the rolled surface as an reference, the rolled copper foil has a characteristic in the existence of the crystal grain, with which the diffraction peaks to {220}
Cu surface of the copper crystal obtained with β-scanning in α angle=45° in the pole figure measurement, show 4-times symmetry by existing at least in each 90±5° of β angle.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种低成本地具有优异柔软性的轧制铜箔，对应于柔性布线部件（例如柔性印刷电路）的更高灵活性的要求。解决方案：轧制的铜箔是最后一个冷轧过程之后和再结晶退火之前的铜箔，由含有≤300ppm氧的纯铜组成，并且由X射线衍射极使用轧制面作为参考的图形测量，轧制的铜箔具有存在晶粒的特性，其中衍射峰值为用β-丙烯酸酯获得的铜晶体的ä220} Cu 在极角度测量中以α角度= 45°扫描，至少在β角度的每个90±5°内存在4次对称性。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2010121154A Method for producing rolled copper foil and rolled copper foil 审中-公开
标题翻译：用于生产滚压铜箔和滚压铜箔的方法
公开(公告)号：JP2010121154A
公开(公告)日：2010-06-03
申请号：JP2008294076
申请日：2008-11-18
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： SASAKI HAJIME , MUROGA TAKEMI
IPC分类号： C22F1/08 , B21B1/22 , B21B3/00 , C22F1/00
摘要： PROBLEM TO BE SOLVED: To provide a production method which stably and efficiently (i.e., inexpensively) produces rolled copper foil having high bending properties suitable for a flexible wiring member such as a flexible printed wiring board. SOLUTION: In the method for producing rolled copper foil, the rolled copper foil after base material annealing and before a final cold rolling step has an intensity ratio of the X-ray diffraction peak of copper crystals satisfying I ä200}Cu /I ä220}Cu ≥10 in a result obtained by X-ray diffraction 2θ/θ measurement with respect to the rolled face of the rolled copper foil, and in the copper foil in all the steps of the rolled copper foil after the final cold rolling step and before recrystallization annealing, the intensity ratio of the X-ray diffraction peak of the copper crystals satisfies I ä200}Cu /I ä220}Cu ≥1. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种稳定有效（即廉价地）生产具有适合柔性布线部件如柔性印刷线路板的弯曲性能高的轧制铜箔的生产方法。解决方案：在轧制铜箔的制造方法中，基材退火后的轧制铜箔和最终冷轧工序之间的铜合金的X射线衍射峰的强度比满足I ä200} 在通过X射线衍射获得的结果中相对于轧制铜箔的轧制面的2θ/θ测量结果，在铜箔中的铜箔中，Cu / I ä220} Cu < 在最终冷轧步骤和再结晶退火之前的轧制铜箔的所有步骤中，铜晶体的X射线衍射峰的强度比满足I / A220}铜≥1。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2010103061A Negative electrode copper alloy foil of secondary battery and manufacturing method for the same 审中-公开
标题翻译：二次电池用负极铜合金箔及其制造方法
公开(公告)号：JP2010103061A
公开(公告)日：2010-05-06
申请号：JP2008276034
申请日：2008-10-27
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： KODAIRA MUNEO , SASAKI HAJIME
IPC分类号： H01M4/66 , H01M4/70
CPC分类号： Y02E60/12
摘要： PROBLEM TO BE SOLVED: To provide a negative electrode copper alloy foil of a secondary battery which is excellent on an adhesive property to an active material, and a manufacturing method for a negative electrode copper alloy foil of a secondary battery.
SOLUTION: The negative electrode copper alloy foil 1 of a secondary battery functioned as a negative electrode for a secondary battery by preparing an active material layer 40 has a copper alloy foil 10 expanding and contracting in response to expansion and contraction in the plane direction of the active material layer 40, and a plating core 20 formed on the surface of the copper alloy foil 10 as a core of copper plating.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供一种对活性物质的粘合性优异的二次电池用负极铜合金箔及二次电池用负极铜合金箔的制造方法。解决方案：通过制备活性物质层40作为二次电池负极的二次电池用负极铜合金箔1具有铜合金箔10，其响应于平面中的膨胀和收缩而膨胀和收缩活性物质层40的方向，以及形成在作为镀铜芯的铜合金箔10的表面上的镀覆芯20。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2009194163A Copper foil for circuit board 审中-公开
标题翻译：电路板铜箔
公开(公告)号：JP2009194163A
公开(公告)日：2009-08-27
申请号：JP2008033460
申请日：2008-02-14
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： SASAKI HAJIME , MUROGA TAKEMI
IPC分类号： H05K1/09 , B32B15/01 , B32B15/08 , C22C27/04 , C22C38/00
摘要： PROBLEM TO BE SOLVED: To provide a copper foil for a circuit board which has outstanding bending characteristics.
SOLUTION: A coat 3 is formed on a surface of a rolled copper foil 2 with metals or an alloy thereof, thereby phenomenon from the formation of an adherence slip band to a first stage crack is relaxed, and thereby the copper foil for a circuit board improved in bending characteristics or having high bending lifetime in another word used for a flexible printed-wiring board or the like is provided. For example, in a metal like Fe which includes a body-centered cubic structure, when a cyclic load is added, two or more slip systems work, moreover intersection slide also tends to occur. Therefore, the coat 3 of a material like Fe is formed on a surface of the rolled copper foil 2, the load is distributed into two or more slip systems, the concentration of a local slip band to the rolled copper foil 2 is relaxed, the formation of the first stage crack is made to hardly arise in the copper foil and coat 3, thereby the bending lifetime of rolled copper foil (a copper foil for a circuit board) can be prolonged.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供具有优异弯曲特性的电路板用铜箔。解决方案：在金属或其合金的轧制铜箔2的表面上形成涂层3，从而形成粘附滑带到第一阶段裂纹的现象被松弛，从而铜箔提供了用于柔性印刷电路板等的另一字中的弯曲特性改善或弯曲寿命高的电路板。例如，在包含体心立方结构的Fe等金属中，当添加循环负荷时，两个以上的滑移系统工作，此外也容易发生交叉滑动。因此，在轧制铜箔2的表面上形成有Fe的材料3，负荷分布在两个以上的滑移系统中，使轧制的铜箔2的局部滑移带的集中放松，在铜箔和涂层3中几乎不会形成第一阶段裂纹，因此可以延长卷绕的铜箔（电路板的铜箔）的弯曲寿命。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2008171788A Collector for lithium ion cells and method for manufacturing it 审中-公开
标题翻译：锂离子电池收集器及其制造方法
公开(公告)号：JP2008171788A
公开(公告)日：2008-07-24
申请号：JP2007034496
申请日：2007-02-15
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： YOKOMIZO KENJI , KODAIRA MUNEO , SASAKI HAJIME
IPC分类号： H01M4/66 , H01M4/02 , H01M4/04 , H01M4/134 , H01M4/1395 , H01M4/38
CPC分类号： Y02P70/54
摘要： PROBLEM TO BE SOLVED: To provide a current collector for lithium ion cells which, while having a high discharge capacity, provides excellent cycle performance without active materials being exfoliated or dropped from a current collecting layer after repeated charges and discharges.
SOLUTION: In a current collector 1 for lithium ion cells which has a current collecting portion 3 formed on a substrate, a substrate 2 is formed of resin.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：为了提供一种锂离子电池用集电体，其具有高放电容量，提供优异的循环性能，而不会在反复进行充电和放电之后从集电层剥离或掉下活性材料。解决方案：在具有在基板上形成的集电部3的锂离子电池用集电体1中，基板2由树脂形成。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2005353920A Surface-roughening treatment method of copper foil for printed-wiring board 审中-公开
标题翻译：印刷电路板铜箔表面粗化处理方法
公开(公告)号：JP2005353920A
公开(公告)日：2005-12-22
申请号：JP2004174719
申请日：2004-06-11
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： MATSUMOTO YUKO , YOKOMIZO KENJI , ITO YASUYUKI , SASAKI HAJIME
IPC分类号： H05K3/38
摘要： PROBLEM TO BE SOLVED: To provide a surface treatment method for preventing copper-remaining phenomenon in which copper particles remain at the side of a base from being generated when forming wiring by etching, without decreasing the adhesive strength between the copper foil and the resin base.
SOLUTION: For an acid copper-plating bath with copper sulfate and sulfuric acid as main constituents, a plating bath is used in which at least one metal selected from among iron, nickel, cobalt, molybdenum, tungsten, titanium, and aluminum and gelatin as an organic compound are added. An arborescent copper electrolytic deposition layer is formed by performing electrolytic treatment at a current value exceeding the limiting current density to the side of a surface to be adhered in copper foil, and electrolytic treatment is applied to the copper foil, in which the arborescent copper electrolytic deposition layer is formed at a current value less than the limiting current density, thus making the arborescent copper change into bump-like copper.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种表面处理方法，用于防止在通过蚀刻形成布线时在基底侧保留铜颗粒而不产生铜残留现象，而不会降低铜箔和树脂基。解决方案：对于以硫酸铜和硫酸为主要成分的酸性镀铜浴，使用电镀浴，其中选自铁，镍，钴，钼，钨，钛和铝中的至少一种金属加入明胶作为有机化合物。通过以超过限制电流密度的电流值在铜箔中粘附的表面的一侧进行电解处理，并对铜箔进行电解处理，其中铜箔电解质沉积层以小于限制电流密度的电流值形成，从而使得基体铜变成凸起状的铜。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2005340633A Copper foil for printed wiring board and its production process 审中-公开
标题翻译：印刷电路板铜箔及其生产工艺
公开(公告)号：JP2005340633A
公开(公告)日：2005-12-08
申请号：JP2004159549
申请日：2004-05-28
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： ITO YASUYUKI , MATSUMOTO YUKO , YOKOMIZO KENJI , SASAKI HAJIME
IPC分类号： H05K1/09
摘要： PROBLEM TO BE SOLVED: To provide a copper foil containing no hexavalent chromium nor fluorine ion imposing high environmental burden and having a chromate film of trivalent chromium where environmental protection is taken into account for use in a printed wiring board, and to provide its production process.
SOLUTION: After a zinc plating film of 3-100 μg/cm
2 is applied onto the surface of a copper foil subjected to roughing, the copper foil is immersed into aqueous solution not containing hexavalent chromium nor fluorine ion but containing trivalent chromium ions by 0.11-0.50 mg/L as metal chromium, and nitric acid by 0.20-0.51 g/L thus performing trivalent chromium conversion treatment.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供不含六价铬的铜箔和具有高环境负荷的氟离子，并且在将印刷电路板用于环境保护的情况下具有三价铬的铬酸盐膜，并且提供其生产过程。解决方案：将经过粗加工的铜箔的表面上施加3-100μg/ cm 2的镀锌膜，将铜箔浸入不含六价铬的水溶液中不含氟离子，但含有作为金属铬的0.11-0.50mg / L的三价铬离子，硝酸为0.20-0.51g / L，进行三价铬转化处理。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2005313380A Copper clad laminated sheet and its manufacturing method 审中-公开
标题翻译：铜箔层压板及其制造方法
公开(公告)号：JP2005313380A
公开(公告)日：2005-11-10
申请号：JP2004131789
申请日：2004-04-27
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： SASAKI HAJIME , YOKOMIZO KENJI , ITO YASUYUKI
IPC分类号： H05K1/09 , B32B15/08 , C22C9/00 , C22C9/02 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a two-layered flexible copper clad laminated sheet possible to handle at a high temperature even if the thickness of a copper foil is reduced and having both of handleability and bending properties so as to be softened in a final manufacturing process.
SOLUTION: After varnish is applied to the copper foil comprising a layer 3 of an alloy B wherein 0.017 mass% of Sn is added to oxygen free copper, the coated copper foil is heated to 150, 200 and 250°C from 120°C over four stages and heated to 350°C for 10 min in a final process to form a polyimide layer 9 to manufacture the copper clad laminated sheet 20.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供即使铜箔的厚度减小并且具有可处理性和弯曲性两者也可以在高温下处理以便软化的双层柔性铜包层叠片材最终制造过程。解决方案：将清漆涂覆到包含合金B的层3的铜箔上，其中将0.017质量％的Sn加入到无氧铜中，将涂覆的铜箔从120加热到150,200和250℃ ℃，最后加热至350℃10分钟，形成聚酰亚胺层9，制造覆铜层压片20.（C）2006，JPO＆NCIPI

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