专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2008141219A Heat sink, and method of manufacturing heat sink 有权
标题翻译：散热器及其制造方法
公开(公告)号：JP2008141219A
公开(公告)日：2008-06-19
申请号：JP2008006284
申请日：2008-01-15
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： NEGISHI TAKESHI , NAGATOMO YOSHIYUKI , TOKIWA ASAO
IPC分类号： H01L23/36
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a heat sink achieving both of a cooling efficiency and space-saving. SOLUTION: In the method of manufacturing the heat sink, a comb-type material 10 having a plurality of teeth 12, and a plurality of corrugated fins 17, 17 machined to corrugate between teeth 12, 12, are provided, and the comb-type material 10 and the corrugated fin 17 are integrated with the brazing process, the corrugated fin 17 is divided into a plurality of sections between the teeth 12, 12. Moreover, the comb-type material 10 and the corrugated fin 17 are brazed with the heat treatment under the condition that a spacer 19 is inserted for pushing the corrugated fin 17 to the tooth 12 between these corrugated fins 17. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种实现冷却效率和节省空间的散热器的制造方法。解决方案：在制造散热器的方法中，提供了具有多个齿12的梳状材料10和被加工成在齿12,12之间波纹化的多个波纹状散热片17,17，并且梳状材料10和波纹状散热片17与钎焊工艺一体化，波纹状散热片17在齿12,12之间分成多个部分。此外，梳状材料10和波纹状散热片17被钎焊在将波纹状散热片17推入到这些波纹状散热片17之间的齿12的状态下插入间隔件19的情况下进行热处理。（C）2008，JPO＆INPIT

2. 发明专利

JP2006270062A Insulating heat-transfer structure and substrate for power module 有权
标题翻译：绝缘传热结构和功率模块基板
公开(公告)号：JP2006270062A
公开(公告)日：2006-10-05
申请号：JP2006036713
申请日：2006-02-14
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： NAGASE TOSHIYUKI , NEGISHI TAKESHI , UESUGI RYUJI , YAMAMOTO KAZUO
IPC分类号： H01L23/36 , H01L23/12 , H01L23/14 , H01L25/07 , H01L25/18
CPC分类号： H01L23/3735 , H01L23/3732 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an insulating heat-transfer structure and a substrate for a power module capable of efficiently transferring the heat on a heating body side to a heat sink side for dispersing heat, and exhibiting stable performance for an extended period even if thermal deformation occurs under such action as temperature cycle.
SOLUTION: There are provided an insulator layer 2 and high heat-transfer body layers 3 and 4 arranged on both side of the insulator layer 2. The insulator layer 2 comprises a junction layer 5 and diamond particles 6 projected into the high heat-transfer body layers 3 and 4. The projection area of the diamond particles 6 on the interface between the high heat-transfer body layers 3 and 4 and the insulator layer 2 is 20-60% of the area of the interface.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于能够有效地将加热体侧的热量传递到散热器侧以分散热量的功率模块的绝缘传热结构和基板，并且对于延长的性能表现出稳定的性能即使在诸如温度循环的作用下发生热变形。解决方案：设置绝缘体层2和布置在绝缘体层2两侧的高传热体层3和4.绝缘体层2包括接合层5和投射到高热中的金刚石颗粒6 - 转印体层3和4.在高传热体层3和4与绝缘体层2之间的界面处的金刚石颗粒6的投影面积是界面面积的20-60％。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2004200567A Radiator and its producing process, substrate for power module, power module 审中-公开
公开(公告)号：JP2004200567A
公开(公告)日：2004-07-15
申请号：JP2002369847
申请日：2002-12-20
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： NAGASE TOSHIYUKI , NEGISHI TAKESHI , NAGATOMO YOSHIYUKI
IPC分类号： H01L23/36 , H01L23/373
CPC分类号： H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To reduce the weight while enhancing machinability, and to attain a sufficient strength while preventing warp. SOLUTION: The radiator 16 is formed by integrating powder of a low thermal expansion material 17 having characteristics of small thermal expansion coefficient, and powder of a metal high heat conducting material 18. The low thermal expansion material 17 is an iron-nickel based alloy, e.g. Invar alloy. The high heat conducting material 18 is composed of a material having a high thermal conductivity, e.g. Cu or its alloy. COPYRIGHT: (C)2004,JPO&NCIPI

4. 发明专利

JP2004140159A Heat sink 有权
公开(公告)号：JP2004140159A
公开(公告)日：2004-05-13
申请号：JP2002303002
申请日：2002-10-17
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： NAGATOMO YOSHIYUKI , NEGISHI TAKESHI , NAGASE TOSHIYUKI
IPC分类号： H01L23/36
CPC分类号： H01L23/3735 , H01L23/15 , H01L23/473 , H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To provide a heat sink where warpage can be reduced irrespective of a difference in a coefficient of thermal expansion with a body to heat sink and a drop of thermal conductivity can be suppressed. SOLUTION: In a low thermal expansion material 18, steps 20 are arranged in a region confronted with an insulating substrate 11 in a thickness direction. When the coefficient of thermal expansion on an insulating substrate 11 is larger than that on the heat sink 16, a corresponding region of the low thermal expansion material 18 with the insulating substrate 11 is formed to dent so that it recedes from the insulating substrate 11 in the heat sink 16. When the coefficient of thermal expansion on the heat sink 16 is larger than that on the insulating substrate 11, the corresponding position of the low thermal expansion material 18 with the insulating substrate 11 is formed to swell so that it approaches the insulating substrate 11. COPYRIGHT: (C)2004,JPO

5. 发明专利

JPH0665617A APPARATUS FOR PRODUCTION OF POWDER 失效
公开(公告)号：JPH0665617A
公开(公告)日：1994-03-08
申请号：JP21940392
申请日：1992-08-18
申请人： MITSUBISHI MATERIALS CORP
发明人： NEGISHI TAKESHI , KIMURA TOSHIRO
IPC分类号： B22F9/10 , B22F9/14
摘要： PURPOSE:To prevent the skull accumulation on a disk without intrusion of foreign matter in powder and obviate the need for a separate heat source for heating the disk. CONSTITUTION:This apparatus has the rotary disk 1 which is formed of the same material as the material of the powder to be produced, a motor 2 which rotates this disk around its axial center, a cathode 4 which is disposed to face the rotary disk 1, a cathode position adjusting mechanism 6 which supports the cathode 4, a consumable anode 8 which is provided between the cathode 4 and the rotary disk 1 plungeably therebetween, a consumable anode retreating mechanism 10 for retreating the consumable anode 8 and a plasma power source. The device has a skull thickness measuring sensor 16 which detects the thickness of the skull sticking onto the rotary disk 1 and control mechanisms 18, 20, 22, 24 which retreat the consumable anode 8 according to the output signal therefrom.

6. 发明专利

JP2007067258A Cooler and power module 有权
标题翻译：冷却器和电源模块
公开(公告)号：JP2007067258A
公开(公告)日：2007-03-15
申请号：JP2005253159
申请日：2005-09-01
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： NAGASE TOSHIYUKI , NEGISHI TAKESHI , NAGATOMO YOSHIYUKI , KUROMITSU YOSHIO , CHOKAI MAKOTO
IPC分类号： H01L23/473 , H05K7/20
CPC分类号： H01L2224/32225 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a cooler with higher cooling ability and a power module. SOLUTION: A cooler body 12 is provided having a mounting surface 21B wherein an insulation circuit substrate 3 is mounted on its surface. In the cooler body 12, first to third flow path groups 24 to 26 wherein flow paths 21A to 23A for circulating cooling liquid are disposed in a plurality each along the mounting surface 21B are formed to overlap in a direction perpendicular to the mounting surface 21B. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供具有更高冷却能力的冷却器和功率模块。解决方案：冷却器主体12设置有安装表面21B，其中绝缘电路基板3安装在其表面上。在冷却器主体12中，形成有与安装面21B垂直的方向上重叠的第一至第三流路组24〜26，其中，使流过冷却液的流路21A〜23A分别沿安装面21B配置。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2006059859A Method for manufacturing substrate for power module 有权
标题翻译：用于制造功率模块的基板的方法
公开(公告)号：JP2006059859A
公开(公告)日：2006-03-02
申请号：JP2004237304
申请日：2004-08-17
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： NEGISHI TAKESHI , NAGASE TOSHIYUKI
IPC分类号： H01L23/12 , C04B37/02 , H01L23/15
CPC分类号： H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To realize highly efficient production of a substrate for power module and also realize thinning of a conductor pattern. SOLUTION: A solder material foil 15a is temporarily fixed on the surface of a ceramics substrate by the surface tension force of a volatile organic medium, and a conductor pattern member 13b punched out from a base material 13a is temporarily fixed on the surface of the solder material foil 15a by the surface tension force. Then, they are heated to volatilize the volatile organic medium, and the conductor pattern member 13a is pressurized in the direction of its thickness and the solder material foil 15a is melt to join the conductor pattern member 13b with the surface of the ceramics substrate 12. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了实现功率模块用基板的高效生产，还实现导体图案的薄型化。解决方案：通过挥发性有机介质的表面张力将焊料材料箔15a临时固定在陶瓷基板的表面上，并且将从基材13a冲出的导体图案部件13b临时固定在表面上的焊料材料箔15a的表面张力。然后，将其加热挥发挥发性有机介质，并且导体图案部件13a在其厚度方向上被加压，并且焊料材料箔15a熔化以将导体图案部件13b与陶瓷基板12的表面接合。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2004200568A Radiator and its producing process 审中-公开
标题翻译：散热器及其生产工艺
公开(公告)号：JP2004200568A
公开(公告)日：2004-07-15
申请号：JP2002369848
申请日：2002-12-20
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： NAGASE TOSHIYUKI , NEGISHI TAKESHI , NAGATOMO YOSHIYUKI
IPC分类号： H01L23/36 , H01L23/373
CPC分类号： H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To reduce the weight while enhancing machinability and to attain a sufficient strength while preventing warp. SOLUTION: The radiator 16 has a metallic main component 17 provided with a filler 18 having a low thermal expansion coefficient. The main component 17 is formed of a so-called high heat conducting material having a high thermal conductivity, e.g. Cu or a Cu alloy. The filler 18 is a linear body having an appropriate size formed of a metal, e.g. Invar alloy, having a thermal expansion coefficient smaller than that of the main component 17 integrally with the main component 17. The filler 18 is oriented to a specified direction on a plane when the radiator 16 is formed. COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：为了减轻重量，同时提高机械加工性并获得足够的强度同时防止翘曲。解决方案：散热器16具有设置有热膨胀系数低的填料18的金属主要部件17。主要部件17由具有高导热性的所谓的高导热材料形成，例如， Cu或Cu合金。填料18是具有由金属形成的合适尺寸的线状体，例如。殷钢合金的热膨胀系数小于与主要部件17一体的主要部件17的热膨胀系数。当形成散热器16时，填料18在平面上朝向特定方向。版权所有（C）2004，JPO＆NCIPI

9. 发明专利

JP2004172457A Power module and substrate therefor 有权
公开(公告)号：JP2004172457A
公开(公告)日：2004-06-17
申请号：JP2002338085
申请日：2002-11-21
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： NEGISHI TAKESHI , NAGATOMO YOSHIYUKI , NAGASE TOSHIYUKI
IPC分类号： H01L23/40 , H01L25/07 , H01L25/18
CPC分类号： H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To provide a substrate for power module that can suppress warping regardless of the difference between the coefficients of thermal expansion of an insulating substrate and a heat sink and, at the same time, can prevent the falling of its coefficient of thermal conductivity, and to provide a power module.
SOLUTION: The substrate 10 for power module is provided with the insulating substrate 11 and heat sink 16 provided on one surface of the substrate 11. The heat sink 16 is provided with a main body 17, a low thermally expandable material 18 having a lower coefficient of thermal expansion than the main body 17 has, and fins 19 installed to the main body 17. The main body 17 and the fins 19 are composed of an integrally molded cast material. The fins 19 are arranged in the direction connecting one end sections C and D holding flexural rigidity lower than that held between the other ends A and B between them of the facing ends A, B, C, and D of the peripheral edge of the heat sink 16.
COPYRIGHT: (C)2004,JPO

10. 发明专利

JP2004146737A Power module substrate, and power module 有权
公开(公告)号：JP2004146737A
公开(公告)日：2004-05-20
申请号：JP2002312594
申请日：2002-10-28
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： NAGATOMO YOSHIYUKI , NEGISHI TAKESHI , NAGASE TOSHIYUKI
IPC分类号： H01L23/36
CPC分类号： H01L23/3735 , H01L23/15 , H01L23/473 , H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To restrict deformation irrespective of the difference between thermal expansion coefficients of both of an insulating substrate and a heat radiator, and further suppress the lowering of thermal conductivity. SOLUTION: In the power module substrate 10 including a circuit layer 12 provided on the upper surface of the insulating substrate 11 and the heat radiator 16 provided on the lower surface of the insulating substrate 11, a low thermal expansion member 18 is laminated on a radiator body 17 of the heat radiator 16, and the low thermal expansion member 18 is made of a material having the quality of a low thermal expansion coefficient than that of the radiator body 17, for example invar alloy. In the low thermal expansion member 18, there is provided a stepped portion 20 in the direction of the thickness of a region facing the insulating substrate 11. A disposition position of the stepped portion 20 in the direction along the stepped portion 20 and in the direction along the lamination is determined by the disposition position in the direction along the surface of the insulating substrate 11 and a difference between the thermal expansion coefficients of the insulating substrate 11 and the radiator 16. COPYRIGHT: (C)2004,JPO

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式