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1. 发明专利

JP2004160543A Method of manufacturing ingot for manufacturing ti-containing copper alloy plate or bar of excellent workability 有权
标题翻译：制造含钛合金板或优良工作性能的棒的制造方法
公开(公告)号：JP2004160543A
公开(公告)日：2004-06-10
申请号：JP2003191624
申请日：2003-07-04
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： AOKI SHOJI , YAJIMA KENJI , FURUSHIBA YUTAKA , KOIDE MASATO
IPC分类号： B22D11/00 , B22D11/124 , C22C9/00 , C22F1/00 , C22F1/08
摘要： PROBLEM TO BE SOLVED: To provide a continuous casting method for an ingot for manufacturing a Ti-containing copper alloy plate or bar excellent in workability, particularly, bendability.
SOLUTION: In the method of manufacturing an ingot for manufacturing a Ti-containing copper alloy plate or bar excellent in bendability, the temperature range from the solidification start time to the completion of eutectic generation at a center portion of the Ti-containing copper alloy plate or bar obtained by casting in a continuous casting mold is controlled so as to be cooled at the cooling speed of 160-700°C/min.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种用于制造具有优异的可加工性，特别是弯曲性的含钛铜合金板或棒的锭的连续铸造方法。解决方案：在制造具有优异弯曲性的含Ti的铜合金板或棒的锭的制造方法中，从含固化的起始时间到完成含钛含量的中心部分的共晶生成的温度范围控制通过在连续铸造模具中铸造而获得的铜合金板或棒以160-700℃/分钟的冷却速度冷却。版权所有（C）2004，JPO

2. 发明专利

JPH0987815A PRODUCTION OF COPPER ALLOY MOLD STOCK FOR CONTINUOUS CASTING FOR STEELMAKING, AND MOLD PRODUCED BY USING THE SAME 失效
公开(公告)号：JPH0987815A
公开(公告)日：1997-03-31
申请号：JP24498595
申请日：1995-09-22
申请人： MITSUBISHI MATERIALS CORP
发明人： NOGAMI TAKASHI , KOIDE MASATO , MORIMOTO TAKASHI , KOSHIBA YUTAKA
IPC分类号： B22C9/06 , B22D11/04 , B22D11/059 , C22C9/00 , C22F1/00 , C22F1/08
摘要： PROBLEM TO BE SOLVED: To produce an alloy mold stock for continuous casting for steelmaking, resistant thermal fatigue and hardly causing cracking, by subjecting a Cr-Zr type copper alloy of specific composition to specific hot working and then to respectively specified cooling and aging treatments. SOLUTION: An ingot of a Cr-Zr type copper alloy containing, by weight, 0.2-1.5% Cr and 0.02-0.2% Zr is heated at 920-1000 deg.C for >=30min and subjected to hot working such as hot rolling. This hot working is performed at >=60% draft at >=900 deg.C working finishing temp. Subsequently, the temp. of the ingot is dropped, without delay, to =10 deg.C/sec, preferably about (12 to 18) deg.C/sec. Then, the ingot is aged at 400-520 deg.C, preferably about 440-490 deg.C, for 1-5hr. The resulting stock is worked by machining, etc., by which a copper alloy mold for continuous casting for steelmaking, having

3. 发明专利

JP2014129580A Copper alloy hot-rolled sheet for sputtering target, and sputtering target 有权
标题翻译：铜合金热轧板用于喷射目标和喷射目标
公开(公告)号：JP2014129580A
公开(公告)日：2014-07-10
申请号：JP2012288705
申请日：2012-12-28
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： OKUBO KIYOYUKI , KOIDE MASATO
IPC分类号： C22C9/00 , B22D11/00 , C22C9/01 , C22C9/05 , C22F1/00 , C22F1/08 , C23C14/34
CPC分类号： H01J37/3429 , B21B3/00 , B22D11/00 , C22C9/00 , C22C9/01 , C22C9/05 , C22F1/08 , C23C14/3414
摘要： PROBLEM TO BE SOLVED: To provide a Cu-Ca-based copper alloy hot-rolled sheet for sputtering target, which is capable of suppressing generation of abnormal discharge in sputtering, and a sputtering target using the same.SOLUTION: Provided is a Cu-Ca-based copper alloy hot-rolled sheet containing Ca of 0.5 to 10.0 atomic%, with the balance substantially being Cu, in which the average grain size of Cu-α phase grains in the base alloy is regulated within the range of 5 to 60 μm.
摘要翻译：要解决的问题：提供能够抑制溅射中异常放电的产生的溅射靶的Cu-Ca系铜合金热轧板以及使用其的溅射靶。提供了一种Cu- 含Ca为0.5〜10.0原子％的Ca系铜合金热轧板，余量基本为Cu，其中，将基体合金中的Cu-α相的平均粒径调整为5〜60的范围微米。

4. 发明专利

JP2004156090A Component for vacuum equipment 审中-公开
公开(公告)号：JP2004156090A
公开(公告)日：2004-06-03
申请号：JP2002322232
申请日：2002-11-06
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： AOKI SHOJI , YAJIMA KENJI , KANO YOSHIO , FURUSHIBA YUTAKA , KOIDE MASATO
IPC分类号： H05H7/14 , C22C9/00
摘要： PROBLEM TO BE SOLVED: To provide vacuum equipment components which consist of high purity copper, in particular components for particle accelerators which requires an ultrahigh vacuum.
SOLUTION: The components for vacuum equipment, in particular the components for particle accelerators, consist of 99.9999mass% high purity copper containing ≤0.2 ppm Fe, ≤0.2 ppm Si, ≤0.05 ppm Al, ≤0.05 ppm Cr, ≤0.05 ppm Mg, and ≤0.05 ppm Zr.
COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2011184711A Processed high-purity copper material having uniform and fine crystalline structure, and process for production thereof 有权
标题翻译：具有均匀性和细小结晶结构的加工高纯度铜材料及其生产工艺
公开(公告)号：JP2011184711A
公开(公告)日：2011-09-22
申请号：JP2010048516
申请日：2010-03-05
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： KUMAGAI TSUTOMU , KOIDE MASATO
IPC分类号： C22F1/08 , B21B3/00 , B22D21/00 , C22F1/00 , C23C14/34
CPC分类号： C22F1/08 , B21B2003/005 , C23C14/165 , C23C14/3414
摘要： PROBLEM TO BE SOLVED: To provide a processed high-purity copper material which has a uniform and fine crystal structure, and is suitable for use as a sputtering target.
SOLUTION: A mass of a cast comprising high purity copper having a Cu purity of ≥99.9999 wt.% is hot-forged at ≥550°C, is thereafter rapidly water-cooled, is next warm-forged at the initial temperature of ≥350°C, is subsequently rapidly cooled with water, is then subjected to cold cross rolling at the total draft of ≥50%, and is then subjected to stress relieving annealing at ≥200°C so as to be a processed high-purity copper material having a uniform and fine crystal structure in which the average crystal particle diameter is ≤20 μm, and also, when the particle diameter distribution is measured for the individual crystal particles, the ratio of an area occupied by the crystal particles with particle diameter exceeding 2.5 times the average crystal particle diameter is
摘要翻译：要解决的问题：提供具有均匀和精细晶体结构并且适合用作溅射靶的经加工的高纯度铜材料。解决方案：将包含Cu纯度≥99.9999重量％的高纯度铜的铸件块在≥550℃下热锻，然后快速水冷，接着在初始温度下加热锻造 ≥350℃，随后用水快速冷却，然后以≥50％的总吃水进行冷交叉轧制，然后在≥200℃下进行应力消除退火，具有平均结晶粒径≤20μm的均匀且微细的晶体结构的纯度高的铜材料，并且当对于各个晶体粒子测量粒径分布时，晶体颗粒占据的面积与颗粒的比例超过平均结晶粒径的2.5倍的直径小于所有结晶粒子所占的总面积的10％。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JPH04220141A DEVICE AND METHOD FOR MANUFACTURING HOLLOW BILLET 失效
公开(公告)号：JPH04220141A
公开(公告)日：1992-08-11
申请号：JP40448890
申请日：1990-12-20
申请人： MITSUBISHI MATERIALS CORP
发明人： ASAO HARUHIKO , FURUSHIBA YUTAKA , SUGAWARA YUKIO , KOIDE MASATO , SHIDARA FUSAO
IPC分类号： B22D11/00 , B22D11/04 , B22D11/055 , H01B13/00 , H01B13/22
摘要： PURPOSE:To continuously and smoothly manufacture the hollow billet by drilling the cooling tube passage opening to one end side at the core, and inserting the coolant supplying tube which extends from one end of the cooling tube passage to the other end part and opens at the other end part. CONSTITUTION:The tubular mold 1 is cooled by supplying the coolant from the mold coolant supplying tube 7, the core 2 is arranged by the same axis in the casting mold 1. The molten metal C is supplied from one end side of the tubular space formed between the casting mold 1 and the core 2, and the hollow billet is manufactured by cooling and solidifying it in this space. Then, the cooling tube passage 21 which is entered from one end and opens to the same one end only is set in the core 2. Also, the core coolant supplying tube 23 which extends from the one end of the cooling tube passage 21 to the other end part and opens at this other end part is inserted. Therefore, the hollow billet without generating a segregating layer can be obtained.

7. 发明专利

JP2014173179A Copper grains for plating 审中-公开
标题翻译：铜粉粒
公开(公告)号：JP2014173179A
公开(公告)日：2014-09-22
申请号：JP2013049624
申请日：2013-03-12
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： AKIYAMA YOSHIYUKI , KOIDE MASATO , CHO TOSHIYUKI
IPC分类号： C25D17/10
摘要： PROBLEM TO BE SOLVED: To provide copper grains for plating capable of efficiently feeding copper ions into a plating solution consisting of a sulfuric acid solution, etc. without entailing a grave deterioration of the dissolution rate even in a case where the dissolution thereof has advanced.SOLUTION: The provided copper grains 10 for plating are used on an occasion for feeding copper ions into a plating solution, whereas particle diameters D thereof are confined to a range of 0.5 mm or above and 6.0 mm or below, whereas the interior of each includes pores 11 constituting a plurality of fine closed spaces, whereas the apparent density thereof is set within a range of 7.0 g/mL or above and 8.5 g/mL or below.
摘要翻译：要解决的问题：为了提供能够将铜离子有效地供给到由硫酸溶液等构成的电镀液中的电镀用铜粒子，即使在溶解速度提高的情况下也不会引起溶解速度的严重劣化。解决方案：所提供的用于电镀的铜颗粒10用于将铜离子供给到电镀液中的情况下，而其粒径D被限制在0.5mm以上且6.0mm以下的范围，而各自的内部包括孔11构成多个精细封闭空间，而其表观密度设定在7.0g / mL以上且8.5g / mL以下的范围内。

8. 发明专利

JP2014047401A Rough-drawn copper wire and winding 有权
标题翻译：粗糙的铜线和绕线
公开(公告)号：JP2014047401A
公开(公告)日：2014-03-17
申请号：JP2012192136
申请日：2012-08-31
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： KOIDE MASATO , WATANABE HIDEO
IPC分类号： C22C9/00 , C22F1/00 , C22F1/08 , H01B1/02 , H01B7/00
CPC分类号： H01B7/00 , B21C1/003 , B21C1/02 , B21C3/08 , B21C9/00 , B22D11/005 , B22D11/1206 , C22C9/00 , C22F1/00 , C22F1/08 , H01B1/026 , H01B13/00 , H01B13/06
摘要： PROBLEM TO BE SOLVED: To provide a rough-drawn copper wire having good surface quality and a winding suppressed in generation of a blister defect.SOLUTION: The rough-drawn copper wire has a composition which contains more than 10 to 30 ppm by mass of P, up to 10 ppm by mass of O, and up to 1 ppm by mass of H with the balance being Cu and unavoidable impurities, and exhibits a hydrogen concentration of 0.2 ppm by mass or less after being subjected to heat treatment for 30 minutes in vacuum at 500°C. A winding (70) is provided with both a drawn wire (71) produced using the rough-drawn copper wire and an insulation coating (72) formed on the outer surface of the drawn wire (71).
摘要翻译：要解决的问题：提供具有良好表面质量的粗糙铜线和抑制发生泡罩缺陷的绕组。解决方案：粗拉铜线具有含有大于10至30质量ppm的 P，高达10质量ppm的O和至多1质量ppm的H，余量为Cu和不可避免的杂质，并且在经受热处理30分钟后的氢浓度为0.2质量ppm以下在500℃真空中。绕组（70）设有使用粗拉铜线制成的拉丝（71）和形成在拉丝线（71）的外表面上的绝缘涂层（72）。

9. 发明专利

JP2010100931A Copper alloy wire having high strength and excellent bending disconnection resistance 有权
标题翻译：具有高强度和优异的弯曲断开电阻的铜合金线
公开(公告)号：JP2010100931A
公开(公告)日：2010-05-06
申请号：JP2009209111
申请日：2009-09-10
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： KOIDE MASATO , IIDA NORIHISA , CHO TOSHIYUKI
IPC分类号： C22C9/00 , C22C9/02 , C22F1/00 , C22F1/08 , H01B1/02 , H01B5/02
摘要： PROBLEM TO BE SOLVED: To provide a copper alloy wore used as a wiring for automobiles, robots or the like and having high strength and excellent bending resistance, particularly a copper alloy fine wire having a diameter smaller than 0.35 mm and having high strength and bending resistance.
SOLUTION: The copper alloy wire has a component composition containing, by mass, 0.2-0.5% Cr, 0.017-0.05% Zr, 0.05-0.5% Ag, and 0.05-0.3% Sn and further containing one or two kinds of 0.05-0.2% Mg and 0.05-0.1% Si if needed and the balance Cu and inevitable impurities and has high strength and excellent bending resistance.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种铜合金，其被用作汽车，机器人等的布线，并且具有高强度和优异的抗弯曲性，特别是直径小于0.35mm并且具有高的铜合金细线强度和抗弯强度。＆lt; P＆gt;解决方案：铜合金线材具有以质量计含有0.2-0.5％Cr，0.017-0.05％Zr，0.05-0.5％Ag和0.05-0.3％Sn的组分组合物，并且还含有一种或两种如果需要，0.05-0.2％的Mg和0.05-0.1％的Si，余量为Cu和不可避免的杂质，具有高强度和优异的耐弯曲性。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2007051351A Mn-CONTAINED COPPER ALLOY SPUTTERING TARGET WITH LESS OCCURRENCE OF PARTICLE 有权
标题翻译：含锰铜合金溅射靶材，不含颗粒物
公开(公告)号：JP2007051351A
公开(公告)日：2007-03-01
申请号：JP2005238171
申请日：2005-08-19
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： AOKI SHOJI , WADA MASAHIKO , KOIDE MASATO
IPC分类号： C23C14/34 , H01L21/285
CPC分类号： C23C14/3414 , C22C9/05 , C23C14/16 , H01J37/3426 , H01L21/2855 , H01L21/76831 , H01L21/76843 , H01L21/76873
摘要： PROBLEM TO BE SOLVED: To provide an Mn-contained copper alloy sputtering target with less occurrence of particles with which the diffusion preventive film and seed film of a semi-conductor device wiring can be deposited simultaneously. SOLUTION: This Mn-contained copper alloy sputtering target consists of a copper alloy containing 0.6-30 mass% Mn, and the balance Cu with impurities, wherein the contents of the impurities are regulated to be ≤40 ppm metallic impurities, ≤10 ppm oxygen, ≤5 ppm nitrogen, ≤5 ppm, and ≤10 ppm carbon. COPYRIGHT: (C)2007,JPO&INPIT

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