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1. 发明专利

JP2010174351A Oxygen-free copper rough drawing wire for winding and method for producing oxygen-free copper rough drawing wire for winding 有权
标题翻译：无氧铜卷绕线用于卷绕和生产无氧铜卷绕粗线的方法
公开(公告)号：JP2010174351A
公开(公告)日：2010-08-12
申请号：JP2009020144
申请日：2009-01-30
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： ISHIDA TOKUKAZU , NAKAMOTO HITOSHI , MACHIDA JUNICHI
IPC分类号： C22C9/00 , B21B1/46 , B21B3/00 , B21C1/00 , B22D1/00 , B22D11/00 , B22D11/06 , B22D11/12 , B22D27/20 , C22F1/00 , C22F1/08 , H01B5/02 , H01B13/00
摘要： PROBLEM TO BE SOLVED: To provide an oxygen-free copper rough drawing wire for windings in which surface quality after cold working such as drawing is satisfactory, and the generation of a blister defect or the like can be suppressed, and to provide a method for producing an oxygen-free copper rough drawing wire for windings. SOLUTION: The oxygen-free copper rough drawing wire for windings used as a material for producing windings has a composition comprising, by parts per million mass, at least one selected from Zr and Mg by 3 to 20 ppm, and in which the content of O is regulated to ≤10 ppm, and the balance Cu with inevitable impurities. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于绕组的无氧铜粗糙拉丝，其中诸如拉伸的冷加工之后的表面质量令人满意，并且可以抑制起泡缺陷等的产生，并且提供一种用于绕组的无氧铜粗拉丝的制造方法。解决方案：用作用于生产绕组的材料的绕组的无氧铜粗糙拉丝具有以百万分之一以上的量选自Zr和Mg中的至少一种为3〜20ppm的组成，其中 O的含量调节至≤10ppm，余量为Cu与不可避免的杂质。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JPH1017957A MANUFACTURE OF COPPER ALLOY INGOT HAVING FINE CAST STRUCTURE 失效
公开(公告)号：JPH1017957A
公开(公告)日：1998-01-20
申请号：JP17530596
申请日：1996-07-05
申请人： MITSUBISHI MATERIALS CORP
发明人： TAKUNO NAOKI , YAJIMA KENJI , KOSHIBA YUTAKA , ISHIDA TOKUKAZU
IPC分类号： C22C1/02 , C22C9/00 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacture of a Cu-Fe-C copper alloy ingot capable of production of lead frame for semiconductor device and having fine cast structure. SOLUTION: An Fe-base master alloy, having a composition consisting of, by weight, 0.005-1.2% C, 0.005-1.0% Si, 0.1-3.0% Mn, 0.01-0.1% M (where M means one or >=2 elements among Al, Zr, Cr, P, and Ti), and the balance Fe with inevitable impurities, is added to a molten metal prepared by melting pure copper, and the resultant molten metal is cast. By this method, the Cu-Fe-C copper alloy ingot having fine cast structure can be manufactured.

3. 发明专利

JP2010189678A Cr-containing copper alloy wire, and method for producing the same 有权
标题翻译：含CR铜合金线及其制造方法
公开(公告)号：JP2010189678A
公开(公告)日：2010-09-02
申请号：JP2009033090
申请日：2009-02-16
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： ISHIDA TOKUKAZU , KUMAGAI TSUTOMU
IPC分类号： C22C9/00 , B22D1/00 , B22D21/00 , C22C1/02 , C22F1/00 , C22F1/08 , H01B1/02 , H01B5/02 , H01B13/00
摘要： PROBLEM TO BE SOLVED: To provide a Cr-containing copper alloy wire in which the increase of strength can be achieved by the incorporation of Cr, and further, occurrence of disconnection when it is wire-drawn to an extra fine wire with a diameter of ≤80 μm can be suppressed, and to provide a method for producing the Cr-containing copper alloy wire.
SOLUTION: In the Cr-containing copper alloy wire used as the stock when producing an extra fine wire with a diameter of ≤80 μm, the number of undissolved Cr and Cr carbides with a grain size of ≥50 μm is ≤2 pieces per 3 kg. Further, in the method for producing a Cr-containing copper alloy wire used as the stock when producing the extra fine wire with the diameter of ≤80 μm, the method comprises: a molten copper production stage S1 where a copper raw material is melted so as to produce molten copper; a Cr addition stage S3 where metal Cr is added to the molten copper; and a casting stage S5 where the molten copper with the Cr added is cast, and in which the content of carbon in the metal Cr added in the Cr addition stage S3 is ≤150 ppm by mass ratio.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种含Cr的铜合金线，其中通过引入Cr可以实现强度的增加，并且当进一步地，当线拉丝到超细线时发生断开，可以抑制直径≤80μm，提供含Cr的铜合金丝的制造方法。
解决方案：在生产直径≤80μm的超细线材时，作为原料使用的含Cr铜合金线，粒径≥50μm的未溶解Cr和Cr碳化物的数量≤2 每3公斤。此外，在制造直径≤80μm的超细线时，作为原料使用的含Cr的铜合金线的制造方法，其特征在于，将铜原料熔融的熔融铜生产工序S1 生产熔融铜; 将Cr添加到熔融铜中的Cr添加阶段S3; 以及投入添加有Cr的熔融铜的铸造台S5，Cr添加阶段S3中添加的金属Cr中的碳含量以质量比计≤150ppm。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2006341268A APPARATUS AND METHOD FOR CONTINUOUSLY MANUFACTURING COPPER ALLOY 审中-公开
公开(公告)号：JP2006341268A
公开(公告)日：2006-12-21
申请号：JP2005168390
申请日：2005-06-08
申请人： MITSUBISHI MATERIALS CORP
发明人： ISHIDA TOKUKAZU , MANTANI SUMIO
IPC分类号： B22D11/00 , B22D1/00 , B22D11/106 , B22D11/108 , B22D45/00 , C22C9/00
摘要： PROBLEM TO BE SOLVED: To provide an apparatus and a method for continuously manufacturing a copper alloy, by which apparatus and method, even an alloy having high alloy concentration and an alloy containing difficult-to-dissolve elements can be stably melted and cast. SOLUTION: The apparatus comprises a heating furnace 3 into which an oxygen free copper in a molten state is supplied by means of an oxygen free copper supplying means 2. The heating furnace 3 comprises a first adding means 7 capable of adding an additive containing an alloy element of the copper alloy, and a tundish 4 arranged on downstream side of the heating furnace 3 via a gutter 6 through which the molten copper flows. A second adding means 8 is provided on any one of the gutter 6 and the tundish 4. COPYRIGHT: (C)2007,JPO&INPIT

5. 发明专利

JPH0499239A STRUCTURAL MEMBER FOR HIGH ENERGY ACCELERATOR MADE OF EXTRA LOW OXYGEN COPPER 失效
公开(公告)号：JPH0499239A
公开(公告)日：1992-03-31
申请号：JP20976390
申请日：1990-08-08
申请人： MITSUBISHI MATERIALS CORP
发明人： IWAMURA TAKURO , FURUYA TSUGIO , ISHIDA TOKUKAZU , ASAO HARUHIKO
IPC分类号： H05H7/00 , C22B15/14 , C22C9/00
摘要： PURPOSE:To obtain a structural member made of extra low oxygen copper exerting no adverse influence on accelerated particles even by the high outputting of a high energy accelerator by constituting the structural member for a high energy accelerator of extra low oxygen copper with high purity contg. specified ratios of 0 and H. CONSTITUTION:A reducing gas obtd. by mixing, e.g. N2or N2+CO with H2 in the total ratio of 0.5 to 50 vol. is blown into the molten metal of pure copper stock equivalent to the conventional oxygen-free copper with >=99.99% purity contg. 3 to 10ppm [0] and =99.99% purity in which the [0] content is regulated to

6. 发明专利

JP2014025138A Copper alloy trolley wire and method of manufacturing copper alloy trolley wire 有权
标题翻译：铜合金拉线及其制造铜合金拉线的方法
公开(公告)号：JP2014025138A
公开(公告)日：2014-02-06
申请号：JP2012168910
申请日：2012-07-30
申请人： Mitsubishi Cable Ind Ltd , 三菱電線工業株式会社 , Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： ASHIDA TETSUYA , HASHIMOTO KOJI , NAKAMOTO HITOSHI , ISHIDA TOKUKAZU
IPC分类号： C22C9/06 , B60M1/13 , C22C9/00 , C22C9/02 , C22C9/04 , C22F1/00 , C22F1/08
摘要： PROBLEM TO BE SOLVED: To provide a copper alloy trolley wire excellent in strength, conductivity, thermal resistance and form accuracy, and to provide a method of manufacturing the copper alloy trolley wire.SOLUTION: A copper alloy trolley wire contains Co;0.12 mass% to 0.40 mass%, P;0.040 mass% to 0.16 mass%, Sn;0.005 mass% to 0.70 mass% and the balance of Cu with inevitable impurities, and an average particle diameter is 10 nm or more, the number of deposition having a particle size of 5 nm or more is 90% or more of observed depositions, and thermal resistance HR defined by HR=TS/TS×100, where TSis an initial tensile strength and TSis a tensile strength at 400°C after 2 hours, is 90% or more.
摘要翻译：要解决的问题：提供强度，导电性，耐热性和形状精度优良的铜合金拉杆线，并提供一种制造铜合金电车线的方法。解决方案：一种铜合金电车线包含Co; 0.12质量％至0.40质量％，P：0.040质量％至0.16质量％，Sn：0.005质量％至0.70质量％，余量由不可避免的杂质构成，平均粒径为10nm以上， 5nm以上的粒径为观察到的沉积的90％以上，由HR = TS / TS×100确定的热阻HR，其中TS为初始拉伸强度，TS为2小时后400℃的拉伸强度 90％以上。

7. 发明专利

JP2010188362A METHOD AND APPARATUS OF MANUFACTURING Cu-Mg BASED ROUGH DRAWING WIRE 有权
标题翻译：制备Cu-Mg基粗糙拉丝线的方法和装置
公开(公告)号：JP2010188362A
公开(公告)日：2010-09-02
申请号：JP2009033091
申请日：2009-02-16
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： NAKAMOTO HITOSHI , HATTORI YOSHIAKI , ISHIDA TOKUKAZU
IPC分类号： B22D11/06 , B22D1/00 , B22D11/00 , B22D11/12 , B22D11/124 , B22D21/00 , C22C9/00 , C22F1/00 , C22F1/08
摘要： PROBLEM TO BE SOLVED: To provide a method and apparatus of manufacturing a Cu-Mg based rough drawing wire which enable a high quality and easy-to-handle Cu-Mg based rough drawing wire to be efficiently manufactured and which enable a long Cu-Mg based rough drawing wire to be manufactured without splicing it.
SOLUTION: This invention is related to a manufacturing method of a Cu-Mg based rough drawing wire containing 0.01-0.70 mass% Mg. The method includes: a molten copper forming process S1 for melting copper raw material to form molten copper; a deoxidizing process S2 for making oxygen content of the molten copper to be ≤10 ppm; an Mg adding process S3 for adding Mg to the deoxidized molten copper; a continuous casting process S4 in which the Mg added molten copper is supplied to a belt-wheel type continuous casting machine to continuously obtain a casting copper material; and a continuous rolling process S5 for continuously rolling the casting copper material. By controlling a cooling condition in the continuous casting process S4, the temperature is made 720°C or higher for the casting copper material that is turned out from the belt-wheel type continuous casting machine.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种能够有效制造高品质且易于处理的Cu-Mg基粗糙拉丝的Cu-Mg系粗拉丝的制造方法和装置，长Cu-Mg基粗糙拉丝线要制造而不会拼接。解决方案：本发明涉及含有0.01-0.70质量％Mg的Cu-Mg基粗拉丝的制造方法。该方法包括：将铜原料熔化以形成熔融铜的熔融铜成形工艺S1; 用于使熔融铜的氧含量为10ppm的脱氧工艺S2; 将Mg添加到脱氧熔融铜中的Mg添加工序S3; 连续铸造工艺S4，其中将Mg加入的熔融铜供给到带轮式连续铸造机，以连续地获得铸造铜材料; 以及连续轧制铸造铜材料的连续轧制工序S5。通过控制连续铸造工序S4中的冷却条件，对于从带轮式连续铸造机转出的铸造铜材料，温度为720℃以上。版权所有（C）2010，JPO＆INPIT

8. 发明专利

JP2005059023A Method for manufacturing copper ingot with high-density oxygen 有权
标题翻译：用高密度氧气制造铜箔的方法
公开(公告)号：JP2005059023A
公开(公告)日：2005-03-10
申请号：JP2003208017
申请日：2003-08-20
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： ISHIDA TOKUKAZU , TAKAGI KENICHI , SAKUMICHI KENICHI , HORI KAZUMASA
IPC分类号： B22D21/02 , B22D21/00 , C22C9/00
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a copper ingot with high-density oxygen which is used when an elongated copper product such as a copper plate and a copper bar, and an electric wire or the like are manufactured, has a specific gravity of ≥8.9, and is almost free from gas hole.
SOLUTION: In the method for manufacturing the copper ingot with the high-density oxygen, oxygen-free molten copper having an oxygen content of
摘要翻译：解决的问题：为了提供一种在制造铜板和铜棒等细长铜制品和电线等时使用的用于制造具有高密度氧的铜锭的方法，比重≥8.9，几乎没有气孔。解决方案：在具有高密度氧的铜锭的制造方法中，氧含量<10ppm的无氧熔融铜通过用具有以下的电炉熔化高纯度电解铜或重熔铜制成非氧化气氛。在将所得到的无氧熔融铜引导到模具的过程中，将露点≤30℃的氧气或由氧气和惰性气体组成的混合气体引入到无氧熔融铜中。通过向无氧熔融铜中加入氧气调节包含在熔融铜中的氧量后，执行铸造。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JPH06279893A COPPER ALLOY EXCELLENT IN STRENGTH AND ELECTRICAL CONDUCTIVITY 失效
公开(公告)号：JPH06279893A
公开(公告)日：1994-10-04
申请号：JP9083193
申请日：1993-03-25
申请人： MITSUBISHI MATERIALS CORP , NAT RES INST METALS
发明人： ISHIDA TOKUKAZU , IWAMURA TAKURO , WADA HITOSHI
IPC分类号： C22C9/00
摘要： PURPOSE:To obtain a copper alloy excellent in strength and electrical conductivity and usable for the electrically conductive material of an ultrastrong magnetic filed generating device. CONSTITUTION:This copper alloy is the one having a compsn. contg., by weight, 8.0 to 20.0% Ag and 0.03 to 0.7% Zr, and the balance Cu with inevitable impurities and having a structure in which the fine precipitates of Cu-Zr intermetallic compounds, Ag-Zr intermetallic compounds and Cu-Ag-Zr intermetallic compounds are dispersed into the basis constituted of primary crystals and eutectic crystals. Otherwise, this copper alloy is another one having a compsn. contg. 8.0 to 20.0% Ag and 0.03 to 0.7% Zr, and the balance Cu with inevitable impurities and having a cold-processed structure in which the fine precipitates of Cu-Zr intermetallic compounds, Ag-Zr intermetallic compounds and Cu-Ag-Zr intermetallic compounds are dispersed into the basis constituted of primary crystals and eutectic crystals.

10. 发明专利

JPH0525565A HIGH PURITY CU ALLOY FOR STABILIZING MATERIAL FOR SUPERCONDUCTING USE HAVING HIGH RESIDUAL RESISTANCE VALUE 失效
公开(公告)号：JPH0525565A
公开(公告)日：1993-02-02
申请号：JP20654891
申请日：1991-07-23
申请人： MITSUBISHI MATERIALS CORP
发明人： ISHIDA TOKUKAZU , IWAMURA TAKURO , YAJIMA KENJI
IPC分类号： C22C9/00
摘要： PURPOSE:To obtain the Cu alloy by incorporating specific amount of Zr into high purity copper whose oxygen content and purity are regulated to a specific value or below and a specific value or above, respectively. CONSTITUTION:Zr is incorporated as alloy component by 1-15ppm into high purity copper having =99.998 purity. As compared with Zr-free high purity copper, this Cu alloy has by far the highest residual resistance value by the presence of Zr and can produce superior properties when used as stabilizing material for superconducting wire. In the above- mentioned alloy, when oxygen content exceeds 1ppm and purity is below 99.998% and further Zr content is outside the above range, the desired high residual resistance value cannot be obtained in respective cases.

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