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2. 发明专利

JPH09132240A CHIP CASE 失效
公开(公告)号：JPH09132240A
公开(公告)日：1997-05-20
申请号：JP29313495
申请日：1995-11-10
申请人： MITSUBISHI MATERIALS CORP
发明人： ARAMAKI SUSUMU , NAGAYA KATSUAKI
IPC分类号： B65D21/02
摘要： PROBLEM TO BE SOLVED: To simply make a bundle of chip cases without using an adhesive tape by a method wherein when separate case main bodies are stacked on the top and bottom, the case main bodies are bonded by an engagement between an upper engaging part of the case main body which is located on the bottom, and a lower engaging part of the case main body which is located on the top, to each other. SOLUTION: For a chip case 10 which houses throw-away chips, housing parts 14 are provided by a wall part 12 which is formed in a case main body 11, and a guide rail 15 is formed on a side wall 11a of the case main body 11. Then, both edges of an upper lid 16 are inserted between the guide rail 15 and the upper part of the wall part 12, and the upper lid 16 is made freely slidable in the longitudinal direction of the case main body 11. Also, on the side wall 11a and a side wall 11b which the upper lid 16 hits, an upper edge part 17 is formed in such a manner that the upper edge part 17 may slightly protrude upward from the surface of the upper lid 16, and at the same time, a protruding part 18 is provided on the lower surface 11c of the case main body 11. The protruding part 18 is fitted in the upper edge part 17 when the chip cases 10 are stacked on the top and bottom.

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