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1. 发明专利

JPH04154864A POLYAMIDE RESIN COMPOSITION 失效
公开(公告)号：JPH04154864A
公开(公告)日：1992-05-27
申请号：JP27932090
申请日：1990-10-19
申请人： MITSUBISHI GAS CHEMICAL CO , FUJITSU LTD , FUJITSUU KASEI KK
发明人： WATANABE NORIYOSHI , MORISHIGE KIYOSHI , SATO JUNICHI , ANDO KATSURA , USUI MAKOTO , NISHII KOTA , MURATANI TAKASHI , KOBAYASHI TOSHIHIRO , TAMURA KAZUYUKI
IPC分类号： C08K3/22 , C08K3/34 , C08K7/06 , C08L53/00 , C08L53/02 , C08L71/12 , C08L77/00
摘要： PURPOSE:To obtain a light-weight polyamide resin composition consisting of a meta-xylylene group-containing polyamide resin, modified polyphenylene ether resin, carbon fiber and mica and having excellent water resistance, moldability, mechanical properties, etc., with reduced warpage and deformation. CONSTITUTION:The objective polyamide resin composition obtained by blending 100 pts.wt. resin composition consisting of (1) 20-80wt.% meta-xylylene group- containing polyamide resin, preferably a mixture obtained by blending 40-99wt.% meta-xylylene-containing polyamide resin with 60-1wt.% polyamide 66 and (2) 80-20wt.% unsaturated carboxylic acid (anhydride)-modified polyphenylene ether resin with (3) 2-30 pts.wt. carbon fiber and (4) 2-30 pts.wt. mica and, preferably, (5) 1-15 pts.wt. hydrogenated A-B-A type block copolymer elastomer (A is the polymerization block of a vinyl aromatic compound; B is the polymerization block of a conjugated diene-based compound).

2. 发明专利

JPH04151222A PLASTIC BOX BODY STRUCTURE, AND MANUFACTURE AND MOLD STRUCTURE THEREOF 失效
公开(公告)号：JPH04151222A
公开(公告)日：1992-05-25
申请号：JP27319190
申请日：1990-10-15
申请人： FUJITSU LTD , FUJITSUU KASEI KK
发明人： ADACHI KATSURA , USUI MAKOTO , NISHII KOTA , MURATANI TAKASHI , KOBAYASHI TOSHIHIRO , TAMURA KAZUYUKI , SATO JUNICHI
IPC分类号： B29C45/00 , B29C45/26 , B29C45/37 , B29L22/00 , H05K5/00
摘要： PURPOSE:To enable lightening without lowering torsional strength by forming the board thickness of a bottom board section in one third or two third of the board thickness of a peripheral rising section. CONSTITUTION:In a box body 1, the board thickness of a bottom board section 3 is formed in two third or one third of the board thickness of a peripheral rising section 2, the mean board thickness of the peripheral rising section 2 is shaped in 3mm or less, and the area of the peripheral rising section 2 is formed in the half or less of the area of the bottom board section 3. The box body 1 has rib structure, and cylindrical bosses 5 combining screws or tapping screw receivers and extrusion are mounted at the intersection of the ribs 4 or on the ribs 4. The ribs 4 are utilized as the flow paths of a resin on injection molding, and a product is extruded by a cylindrical sleeved knockout pin from the cylindrical boss sections 5. In the molding die, the inflow gates 10, 10' of the resin are arranged at two positions or more on the rear of the box body 1, and insert structure for gas vent or a knockout pin 11 is disposed to a final filled-air reservoir section resulting from a plurality of the resin inflow gates 10, 10'.

3. 发明专利

JPH09165568A ADHESIVE 失效
公开(公告)号：JPH09165568A
公开(公告)日：1997-06-24
申请号：JP32561895
申请日：1995-12-14
申请人： FUJITSU LTD
发明人： TOKUHIRA EIJI , HOZUMI YUUKO , DATE HITOAKI , USUI MAKOTO
IPC分类号： C08K9/04 , C08L77/00 , C09J9/02 , C09J167/00 , C09J167/02 , C09J169/00 , C09J177/00 , H05K3/30 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To obtain an adhesive having characteristics of both surely bonding an element to be mounted to a circuit board, electrically connecting the element and readily removing the bonded element from the board. SOLUTION: This adhesive is obtained by mixing 1.0 pt.wt. of a binder resin material composed of a polyamide-based resin with 0.5 pt.wt. of at least one compounding resin material having heat resistance among a polycarbonate resin, a polyethylene terephthalate resin and a polybutylene terephthalate resin. Or, an electroconductive fine particle of a microcapsule type, etc., is mixed with/dispersed into the adhesive to give an electroconductive adhesive, which is used for bonding an element to a circuit board or electrically connecting the element to the board so that the bonded element can be readily removed therefrom by heating, etc. These adhesives are excellent in heat resistance and are electrically stabilized even in burn-in, etc., to improve reliability.

4. 发明专利

JPH0827446A ADDITIVE FOR ADHSIVE, CURING AGENT AND ADHSIVE 失效
公开(公告)号：JPH0827446A
公开(公告)日：1996-01-30
申请号：JP16558194
申请日：1994-07-18
申请人： FUJITSU LTD
发明人： DATE HITOAKI , HOZUMI YUUKO , TOKUHIRA EIJI , USUI MAKOTO
IPC分类号： C09J11/02 , C09J11/04 , C09J11/06 , C09J163/00 , H05K3/30
摘要： PURPOSE:To obtain an adhesive, comprising a specific additive and a specified curing agent, capable of prolonging the pot life at ambient temperature to a long period, shortening the curing time, excellent in reliability of bonding and operability and useful for joining, etc., of electronic parts. CONSTITUTION:This additive 1 contains (A) a principal agent such as an epoxy resin 2 and an additive such as aluminum nitride powder 5 having a higher thermal conductivity and a lower thermal expansion coefficient than those of the principal agent and insulating properties and (B) a curing agent such as an imidazole 3, having a higher melting point than ambient temperature and wrapped with a resin such as an acrylic resin 4. Furthermore, the amount of the added additive is preferably within the range of 10-80wt.% and the amount of the blended component (B) is preferably within the range of 20-80wt.%.

5. 发明专利

JPH07102225A ADHESIVE FOR BONDING ELECTRONIC PART 失效
公开(公告)号：JPH07102225A
公开(公告)日：1995-04-18
申请号：JP24773693
申请日：1993-10-04
申请人： FUJITSU LTD
发明人： HOZUMI YUUKO , DATE HITOAKI , TOKUHIRA EIJI , USUI MAKOTO
IPC分类号： C09J7/00 , C09J11/00 , C09J133/00 , C09J133/04 , C09J163/00 , C09J201/00 , H01L21/52 , H05K3/30
摘要： PURPOSE:To obtain an adhesive for bonding electronic parts which facilitates repair of bonding defects and control of the amt. of the adhesive applied, is of one-pack type, and has a long pot life and a greatly improved workability. CONSTITUTION:The adhesive of one-pack type is prepd. by mixing the main component contg. a repairability improver and a thixotrpic agent with a capsulated curative obtd. by coating a monomer reactive with the main component with a resin.

6. 发明专利

JPH0570750A CONDUCTIVE ADHESIVE 失效
公开(公告)号：JPH0570750A
公开(公告)日：1993-03-23
申请号：JP23035391
申请日：1991-09-10
申请人： FUJITSU LTD
发明人： DATE HITOAKI , USUI MAKOTO
IPC分类号： H01B1/22 , C09J9/02 , C09J201/00 , H01L21/60 , H05K1/09
摘要： PURPOSE:To provide a high-reliability conductive adhesive which is made conductive by dispersing metallic particles in the base of the adhesive and can import a stable electric resistance to the desired area without forming an electrical connection among the adjoining patterns. CONSTITUTION:A microencapsulated conductive adhesive is made by dispersing a microencapsulated conductive filler, prepared by forming a metallic plating 11 on the surface of a resin ball 10 and forming an electrical insulating polymer 12 around the external surface of the metallic plating 11, in a one-pack adhesive.

7. 发明专利

JPH0545236A METHOD FOR MEASURING STRESS RECEIVED BY INSERT 失效
公开(公告)号：JPH0545236A
公开(公告)日：1993-02-23
申请号：JP20103091
申请日：1991-08-12
申请人： FUJITSU LTD
发明人： MURATANI TAKASHI , NISHII KOTA , USUI MAKOTO , KIMURA KOICHI
IPC分类号： B29C45/14 , G01L1/00
摘要： PURPOSE:To simply and precisely measure the stress received by an insert without being restricted by the molding conditions. CONSTITUTION:A magnetic coating 2 is applied to the surface of an insert 1 and magnetized, and the magnetic flux density in initial period Bi is measured. This insert 1 is insert molded in a resin 3. Then the post-molding magnetic flux density Bm of the magnetic coating 2 is measured. The shrink stress applied to the insert 1 at the time of molding is determined from Bi-Bm.

8. 发明专利

JPH0496981A MICRO-ENCAPSULATED ELECTRICALLY CONDUCTIVE ADHESIVE AND BONDING METHOD 失效
公开(公告)号：JPH0496981A
公开(公告)日：1992-03-30
申请号：JP21244090
申请日：1990-08-10
申请人： FUJITSU LTD
发明人： DATE HITOAKI , USUI MAKOTO
IPC分类号： H05K3/32 , C09J5/00 , C09J9/02 , C09J11/04 , H01L21/52 , H01L21/60
摘要： PURPOSE:To obtain the subject adhesive capable of keeping insulated state in high reliability by preparing the 1st microcapsules consisting of electrically conductive fine particles covered with a resin shell and the 2nd microcapsules containing a hardener encapsulated in a shell and uniformly dispersing the microcapsules in an adhesive resin. CONSTITUTION:The objective adhesive can be produced by uniformly dispersing (A) the 1st microcapsules 3 produced by covering the surface of electrically conductive fine particles 1 with a shell 2 made of a resin and (B) the 2nd microcapsules having particle diameter larger than the 1st microcapsule 3 and containing a curing agent 4 sealed in a shell 5 made of a resin in (C) an adhesive resin 7. It can be applied to a part having narrow terminal gap such as a beam lead-type IC in which insulation cannot be guaranteed by the use of conventional adhesive.

9. 发明专利

JPS5795736A TWO-WAY DATA TRANSMISSION DEVICE 失效
公开(公告)号：JPS5795736A
公开(公告)日：1982-06-14
申请号：JP17178280
申请日：1980-12-05
申请人： FUJITSU LTD
发明人： OKADA MASANORI , USUI MAKOTO , FUJIMOTO TAKEO , MURATANI TAKASHI
IPC分类号： H04L5/14 , H04L5/16
摘要： PURPOSE:To reduce the number of transmission lines, by providing one control pulse generator and a required number of transceivers in separated places A and B respectively and by controlling places A and B by a transmission/receiving mode designating signal so that one of them is set to the receiving side when the other is the transmission side. CONSTITUTION:A control pulse generator CPG and transceivers TR1-TR4 are provided in places A and B respectively, and control pulse generators CPG are connected by two timing clock lines La and Lb, and transceivers are connected to each other by data transmission lines L1-L4 respectively. A clock CLK, which determines the period of transmission data bits and a clock CLK2 which determines the data transmission start timing are inputted to the control pulse generator CPG to generate transmission clocks Qa-Qc, a receiving clock -CLK1, and a transmission/receiving mode designating signal Qd repeating H and L levels. The transceiver TR has a data selector 62, which transmits N-bit parallel data in serial by clocks Qa-Qc, and a shift register, which outputs received serial data as parallel data by the clock -CLK1, and inserts or removes in inverter 50 into or from the circuit of the signal Qd, thus controlling transceivers in places A and B so that one is set to the receiving side when the other is the transmission side.

10. 发明专利

JPH1129748A ADHESIVE, ADHESION, AND MOUNTED SUBSTRATE BOARD ASSEMBLY 失效
公开(公告)号：JPH1129748A
公开(公告)日：1999-02-02
申请号：JP34324997
申请日：1997-12-12
申请人： FUJITSU LTD
发明人： DATE HITOAKI , MOTOYAMA YUUKO , TOKUHIRA EIJI , USUI MAKOTO , IMAIZUMI NOBUHIRO
IPC分类号： C09J4/06 , C09J4/02 , C09J5/06 , C09J9/02 , C09J163/00 , H01L21/56 , H01L21/60 , H05K1/03 , H05K3/30 , H05K3/38
摘要： PROBLEM TO BE SOLVED: To lessen the thermal stress of a bonded part by using an adhesive which comprises an acrylic monomer, a peroxide, a reducing agent, an epoxy resin precursor, and a curative and is a two-component system consisting of component A contg. the acrylic monomer and at least either the peroxide or the reducing agent and component B contg. all the rest. SOLUTION: The amt. of the acrylic monomer mixed is pref. 0.1-500 wt.% of the epoxy resin precursor. At least one of all the ingredients is pref. microcapsuled with a thermoplastic resin. Fine conductive particles coated with an insulating resin is pref. contained as a filler. ω-Carboxypolycaprolactone mono(meth)acrylate, (meth)acrylic acid, etc., are used as the acrylic monomer; benzoyl peroxide, cumene peroxide, etc., as the peroxide; dimethylaniline, ferrous sulfide, etc., as the reducing agent; a bisphenol A type, a naphthalene type, etc., as the epoxy resin precursor; and phthalic acid, imidazole, etc., as the curative.

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