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1. 发明专利

JPH0996494A HEAT PIPE AND ITS MANUFACTURE 失效
公开(公告)号：JPH0996494A
公开(公告)日：1997-04-08
申请号：JP25505695
申请日：1995-10-02
申请人： MITSUBISHI ELECTRIC CORP
发明人： MASUDA TAKASHI , YAO AKIRA
IPC分类号： F28D15/02
摘要： PROBLEM TO BE SOLVED: To keep heat transmitting capacity for a long period of time by a method wherein a pipe body formed of an aluminum allow containing an alkali metal and/or an alkali earth metal is filled with a heating medium and a reduced hydrogen gas amount is reduced to a value lower than a specified amount. SOLUTION: A pipe body formed of an aluminum alloy containing an alkali metal and/or an alkali earth metals is filled with a heating medium. A total sum of an amount of hydrogen gas present in the pipe body, an amount of adsorption water and crystalline water present in the pipe body, and hydrogen gas generated through reaction of a moisture content, contained by the heating medium, with a metal by which the pipe body is comprised is a reduced hydrogen gas amount. An amount of reduced hydrogen gas in the pipe body is set to 10ppm or less. Even when hydrogen gas is generated in the pipe body, an amount thereof is within an allowable range, and this constitution prevents impedance of the flow of the heating medium by hydrogen gas and lowering of heat transport capacity for a long period. Further, the pipe body has a high mechanical strength and high thermal conductivity.

2. 发明专利

JP2009070970A Heat pipe panel 审中-公开
标题翻译：热管板
公开(公告)号：JP2009070970A
公开(公告)日：2009-04-02
申请号：JP2007236698
申请日：2007-09-12
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YAO AKIRA
IPC分类号： H05K7/20 , F28D15/02 , H01L23/427
摘要： PROBLEM TO BE SOLVED: To provide a heat pipe panel which can mount thereon an radiation type electronic device having a high heat generation density while eliminating the need for enlarging a panel because of a small thermal resistance from the mounted device to a heat pipe.
SOLUTION: A heat pipe 3 buried in a heat panel 1 is provided at its both ends or one end with a heat collecting plate 3a which collects heat emitted from an electronic device 5 mounted on one end of the panel 1 and transmits the collected heat to the heat pipe 3, and is also provided with a filter tube 3b which fills an operating fluid into the heat pipe 3 at a position other than the both ends of the heat pipe 3.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种热管板，其可以在其上安装具有高发热密度的辐射型电子设备，同时由于从安装的装置到热量的热阻小而不需要扩大面板管。解决方案：埋在热板1中的热管3的两端或一端设置有集热板3a，集热板3a收集从安装在面板1一端的电子设备5发出的热量，并将向热管3收集热量，并且还设置有过滤管3b，其在除热管3的两端以外的位置将工作流体填充到热管3中。（C）2009 ，JPO＆INPIT

3. 发明专利

JP2006011962A Design process management system 审中-公开
标题翻译：设计流程管理系统
公开(公告)号：JP2006011962A
公开(公告)日：2006-01-12
申请号：JP2004190034
申请日：2004-06-28
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YOSHIMURA YUJI , YAO AKIRA , GOTO AKIHIRO , NAKAJIMA YASUSHI
IPC分类号： G06F9/44 , G06Q10/00 , G06Q10/06 , G06Q50/00 , G06Q50/04
CPC分类号： Y02P90/30
摘要： PROBLEM TO BE SOLVED: To achieve a design process management system which permits the management of a design process and grasping of progress from the stage of initial designing by converting a design process of integral type architecture into a design process of modular architecture. SOLUTION: In each cell of a matrix formed by taking a longitudinal axis as a subsystem and a horizontal axis as a gate indicating each time unit forming a time axis, a design interface item gate management table describing a design interface item between each subsystems is created by a design interface item gate management table creating part 522 of a server 501, so that it becomes possible to define timing for interfacing between subsystems constituting a product by each cell of the matrix, and even in a design process of the integral type architecture, design process management equivalent to that of the modular architecture can be realized. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：实现设计过程管理系统，其允许通过将整体式架构的设计过程转换为模块化架构的设计过程从初始设计阶段管理设计过程并掌握进度。解决方案：在通过以纵轴作为子系统和水平轴作为指示形成时间轴的每个时间单位的门的形式的每个单元中，设计界面项目门管理表描述每个单元之间的设计接口项通过设计接口项目门管理表创建服务器501的部分522创建子系统，使得可以定义由矩阵的每个单元构成产品的子系统之间的接口，并且甚至在集成的设计过程中类型架构，可以实现与模块化架构相当的设计流程管理。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JPH09253761A PRODUCTION OF BENT PIPE 失效
公开(公告)号：JPH09253761A
公开(公告)日：1997-09-30
申请号：JP6820696
申请日：1996-03-25
申请人： MITSUBISHI ELECTRIC CORP
发明人： NOMURA TAKEHIDE , YAO AKIRA
IPC分类号： F28F1/40 , B21D7/03 , B21D7/16 , B21D53/06
摘要： PROBLEM TO BE SOLVED: To reduce the deformation of cross-sectional shape of a bending part without contaminating the inside in the bending process for a bent pipe having the inside wall of complicated shape. SOLUTION: In the bending process of a pipe 1, a reinforcing material 2 is adhered to a bending outer periphery side, then the rigidity of the outer periphery side is made relatively higher in comparison with a bending inner periphery side. Therefore, the neutral axis is moved to the bending outer periphery side when applying the bending moment, the compression stress generating on the bending inner periphery side is made large than the tensile stress generated on the bending outer periphery side. Accordingly, in the bending process of this pipe, the ratio of the plastic strain caused by the compression of the bending inner periphery side is made large and progressed. Since the plastic strain caused by the compression is smaller than the plastic strain cause by the tension, the bent pipe small in deformation of cross-sectional shape is produced.

5. 发明专利

JP2002181469A LOOPED HEAT PIPE 失效
公开(公告)号：JP2002181469A
公开(公告)日：2002-06-26
申请号：JP2000379831
申请日：2000-12-14
申请人： MITSUBISHI ELECTRIC CORP
发明人： ISHIKAWA HIROAKI , YAO AKIRA , OGUSHI TETSURO , OZAKI EIICHI
IPC分类号： F28D15/02 , F28D15/06
摘要： PROBLEM TO BE SOLVED: To enable halt of the operation of a loped heat pipe. SOLUTION: On the occasion when a heating source is cooled excessively by an evaporator 1, a heater 50 is turned on. Consequently, a working fluid 13 of a vapor or liquid phase in a liquid reservoir chamber 6 is heated. Then evaporation of the working fluid 13 occurs also inside a wick 2 and a pressure difference between the outside and the inside of the wick 2 diminishes. Thus, a driving power lessens, circulation of the working fluid 13 stops and the operation of the looped heat pipe halts.

6. 发明专利

JP2000171181A HEAT PIPE 失效
公开(公告)号：JP2000171181A
公开(公告)日：2000-06-23
申请号：JP34217898
申请日：1998-12-01
申请人： MITSUBISHI ELECTRIC CORP
发明人： OGUSHI TETSURO , YAO AKIRA , YAMAKAGE HISAAKI , TSUJIMORI ATSUSHI
IPC分类号： F28D15/02
摘要： PROBLEM TO BE SOLVED: To decrease a pressure loss of a liquid fluid and to increase a heat transporting capability by forming an axial groove on an inner wall of a heat pipe container, bringing an outer periphery of a wick into close contact with an end of a ridge of the groove, inserting it into the container, sealing an operating liquid in the wick, and impregnating the liquid. SOLUTION: When an evaporator 8 of one axial end of a heat pipe container 2 is heated, its heat is transmitted from a ridge 11 of a groove 10 of the container 2 to a wick 3, an operating liquid 5 in the wick 3 absorbs a heat to evaporate, and hence vapor 6 is generated near the evaporator 8 in the groove 10. The vapor 6 axially flows in the groove 10 from the evaporator 8 side toward a condenser 9 side according to a temperature difference between the evaporator 8 and the condenser 9 of the container 2, and arrives at the condenser 9 as its vapor phase remains as it is. Thus, since the overall inner space can be used as a liquid channel 3a, a pressure loss of the channel 3a is reduced, and a heat transporting capability of the pipe 1 is increased.

7. 发明专利

JPH10246583A EVAPORATOR AND LOOP TYPE HEAT PIPE EMPLOYING IT 失效
公开(公告)号：JPH10246583A
公开(公告)日：1998-09-14
申请号：JP5316997
申请日：1997-03-07
申请人： MITSUBISHI ELECTRIC CORP
发明人： OGUSHI TETSURO , MURAKAMI MASAAKI , YAO AKIRA , OKAMOTO TAKEFUMI , MASUMOTO HIROMITSU , YAMAKAGE HISAAKI
IPC分类号： F28D15/02 , F28D15/04
摘要： PROBLEM TO BE SOLVED: To enhance heat-exchanging efficiency by forming a wick such that the hole diameter is varied when the number of holes per unit volume is constant or the number of holes is varied when the hole diameter is uniform. SOLUTION: Outer surface part 21 of a wick is formed of drawing porous polytetrafluoroethylene having pore diameter of 0.1-10μm being applied tightly to groove ridges 20 provided on the inner wall face of an evaporator vessel 3. Inner surface part 22 of the wick is formed of porous ceramic having a large pore diameter. A liquid phase working liquid 15 collected on the bottom of a liquid sump 5 permeates the inner surface part 22 of the wick made of a material having a large pore diameter than the outer surface part 21 and then permeates the outer surface part 21 of the wick. Since the pore diameter is not uniform, pressure drop due to flow through the wick 2 is reduced and the liquid phase working liquid 15 can permeates the wick entirely thus enhancing the heat transporting capacity while enhancing the reliability.

8. 发明专利

JPH10215093A HONEYCOMB SANDWICH PANEL WITH BURIED HEAT PIPE 失效
公开(公告)号：JPH10215093A
公开(公告)日：1998-08-11
申请号：JP1840197
申请日：1997-01-31
申请人： MITSUBISHI ELECTRIC CORP
发明人： YAO AKIRA
IPC分类号： B64G1/50 , B32B3/12 , F28D15/02 , H01L23/427 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To reduce a space required for a power supply line and a signal line and to mount an electronic equipment on a panel with a high density by providing the power supply line and the signal line for an electronic equipment mounted to a panel along a heat pipe and burying it into a honeycomb sandwich panel. SOLUTION: A panel has an electronic equipment 5 that is mounted inside the satellite body of the panel, a power supply line 6 for supplying power to the electronic equipment 5 along a heat pipe 3, and a signal line 7 of the electronic equipment 5. The heat pipes 3 are thermally connected and a network is formed so that heat can be carried to the entire panel surface. The power supply line 6 and the signal line 7 connected to each electronic equipment 5 are buried into the panel up to a position before an equipment-mounting position and a space for arranging the power supply line 5 and the signal line 6 is drastically reduced, thus narrowing the gap of the heat pipe and arranging a low heat-generating equipment at a reduced space and hence mounting the equipment to the panel with a high density.

9. 发明专利

JPH0490498A HEAT TRANSFER DEVICE 失效
公开(公告)号：JPH0490498A
公开(公告)日：1992-03-24
申请号：JP20728890
申请日：1990-08-03
申请人： MITSUBISHI ELECTRIC CORP
发明人： OGUSHI TETSURO , MURAKAMI MASAAKI , YAO AKIRA
IPC分类号： B64G1/50 , F25B23/00 , F28D15/02 , F28D15/04
摘要： PURPOSE:To provide a thermal transfer device which is operated under no gravity and which can be used in the space by a method wherein a capillary tube having a capillary action is disposed at least a thermal transfer surface within an evaporator and fluid placed in an accumulator is returned back to the evaporator with a capillary pressure of the capillary pipe material. CONSTITUTION:A capillary material 21 disposed at a thermal transfer surface of an evaporator 1 is composed of a continuous groove with a groove pitch of 0.5mm, for example. The capillary material 21 communicates with an accumulator 3 by a liquid return pipe 8 through an opening or closing valve 11. In the case that the opening or closing valve 11 is opened and a three-way valve 7 communicates with an accumulator 3 through a communication pipe 4, liquid in the accumulator 3 passes through a liquid return pipe 8 via the opening or closing valve 11 under a capillary pressure of the capillary material 21 disposed at the thermal transfer surface of the evaporator 1. The capillary action may act even under no gravity, so that this device can be operated even under no gravity.

10. 发明专利

JPH0484087A CONDENSOR 失效
公开(公告)号：JPH0484087A
公开(公告)日：1992-03-17
申请号：JP20071090
申请日：1990-07-25
申请人： MITSUBISHI ELECTRIC CORP
发明人： OGUSHI TETSURO , MURAKAMI MASAAKI , YAO AKIRA
IPC分类号： F25D9/00 , F28D15/02
摘要： PURPOSE:To provide a condensor in which a liquid film within an entire condensing pipe can be made thin and a heat exchanging performance is high by a method wherein a liquid pipe communicating with a condensing pipe and having a smaller inner diameter than that of the condensing pipe is provided and then refrigerant liquid is flowed in the liquid pipe. CONSTITUTION:A liquid pipe 21 is disposed to communicate with a condensing pipe 9 and has a smaller inner diameter than that of the condensing pipe 9. A plurality of communication pipes 22 communicate with liquid pipe 21 and the condensing pipe 9. Refrigerant liquid generated in the condensing pipe 9 through its condensation passes through the communication pipes 22 in preference to the liquid pipe 21 having a smaller inner diameter than that of the condensing pipe 9 and immerses. The refrigerant liquid in the condensing pipe 9 is discharging into the liquid pipe 21, the liquid film 11 in the condensing pipe 9 is made thin and a heat exchanging performance in the condensing pipe 9 is increased. In addition, even under a heavy weight, if the liquid pipe 21 is positioned lower, the refrigerant liquid is discharged into the liquid pipe 21 through its gravity and the liquid film 11 in the condensing pipe 9 is made thin and a heat exchanging performance is increased.

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