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    • 6. 发明专利
    • PRODUCTION OF SPUTTERING TARGET
    • JPS63312974A
    • 1988-12-21
    • JP14956087
    • 1987-06-16
    • MITSUBISHI ELECTRIC CORP
    • UMEMURA TOSHIOMURAKAMI SHOJIWATANABE MIKIO
    • C23C14/34
    • PURPOSE:To produce the title sputtering target without any crack and having a low content of the contained oxygen by placing the powder of a sputtering target material on a substrate, and carrying out heat treatment under pressure to the extent that the interface between the substrate and the powder is fused. CONSTITUTION:The powder of the sputtering target material is placed on the substrate. The substrate is appropriately made of one kind among W, Ta, Mo, Ni, and stainless steel. A soft magnetic material such as 'Sendust(R)' and alperm, a high magneto-striction material such as alfer, and ceramics such as Si3N4, AlN, SiO2, SiC, etc., can be used for the powder. The substrate carrying the powder is placed in a vacuum vessel, hermetically sealed, and hot-pressed by a hydrostatic pressure, or the powder is filled in a press die and hot-pressed. The heat treatment under pressure is carried out to the extent that the interface between the substrate and the powder is fused. By this method, a large-bore target made of a material exhibiting high brittleness can be obtained without generating cracking, and an economical sputtering target capable of being thermally, electrically, and excellently bonded to an electrode part can be obtained.
    • 8. 发明专利
    • PRODUCTION OF AMORPHOUS MAGNETIC MATERIAL
    • JPS6311654A
    • 1988-01-19
    • JP15340186
    • 1986-06-30
    • MITSUBISHI ELECTRIC CORP
    • MURASE HIROYASUMURAKAMI SHOJIOKUMURA HIROSHI
    • C22F1/00C22F1/10H01F1/153
    • PURPOSE:To obtain an amorphous magnetic material which is improved in magnetic permeability particularly in a high-frequency region by subjecting a thin sheet-like Co amorphous alloy having a specific component compsn. to a heat treatment at the temp. below the Curie temp. of said alloy and below the crystallization temp. thereof while impressing a magnetic field thereto in the direction perpendicular to the thin sheet surface. CONSTITUTION:The Co amorphous alloy having the compsn. expressed by the formula I is subjected to the heat treatment in the perpendicular magnetic field under the above-mentioned temp. conditions, by which the magnetic anisotropy is induced into the amorphous magnetic material. The magnitude and direction of the induced magnetic anisotropy in the magnetic field can be variously changed by changing the treatment conditions. On the other hand, the magnetic permeability and loss coefft. are the constitutionally sensitive physical quantities to sensitively reflect the change of the magnetic anisotropy. The amorphous magnetic material which permits the improvement in the magnetic permeability and the control of the loss coefft. is, therefore, obtd. by subjecting the material to the adequate heat treatment as with this invention.
    • 9. 发明专利
    • PLATING TREATMENT EQUIPMENT
    • JPS62285454A
    • 1987-12-11
    • JP12859186
    • 1986-06-03
    • MITSUBISHI ELECTRIC CORP
    • SASAKI IKUOTACHIKAWA TORUKIMURA MICHITAKAMURAKAMI SHOJIWATABE TAKESHI
    • H01L23/50C25D7/00C25D7/12C25D17/00C25D17/08C25D17/10
    • PURPOSE:To obtain a small-sized full automatic plating treatment equipment by mounting a magazine housing a large number of semiconductor packages, which are aligned and brought to an adhesive state, a cathode bar, which is positioned in a plating tank and connects a frame to an external power supply when the magazine is placed, an anode bar on a tank bottom and a vertical shielding layer along the side wall of the magazine. CONSTITUTION:A magazine 3, a side wall 13 of which consists of an insulator, is arranged in a tank 2 filled with a plating solution 1, and a large number of frames 11 are housed while sealing bodies 12 are brought into contact. Sections except sections 5 brought into contact with the frames 11 in semiconductors 10 are insulated and coated 6 in cathode bars 4, and two cathode bars 4 are mounted in parallel. A soluble anode 7 is disposed faced oppositely to the magazine 3 on the bottom of the tank 2, and connected to an external power supply. Vertical shielding plates 8, 9 consisting of an insulator having the same size as a frame housing section are fitted to the upper and lower sections of the magazine, and the upper shielding plate 8 takes half size up to the surface of the plating solution from the upper end of the magazine. According to the constitution, plating treatment can be executed at magazine unit, and the frames can be taken in and out freely from the magazine, thus resulting in miniaturization, then equalizing plating-film thickness by a shielding wall.