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1. 发明专利

JPH03217078A SURFACE TREATMENT OF INTERNAL-LAYER BASE MATERIAL FOR MULTILAYER COPPER-CLAD LAMINATED BOARD 失效
公开(公告)号：JPH03217078A
公开(公告)日：1991-09-24
申请号：JP1205890
申请日：1990-01-22
申请人： MITSUBISHI ELECTRIC CORP
发明人： KIMURA MINORU , FUTAKUCHI MICHIO , KAIZUMI YUTAKA , NAGATA SHOICHI
IPC分类号： H05K3/46 , H05K3/38
摘要： PURPOSE:To enable a surface treatment film to be formed uniformly on an internal-layer base surface for stabilizing and improving adhesion force with the internal-layer base material of a multilayer substrate and for enhancing the reliability by performing surface treatment of the internal-layer base material by using a surface treatment liquid which is obtained by mixing an interface activator where a specific amount of interface activator is mixed into a surface treatment liquid including a specific amount of coupling agent. CONSTITUTION:In a method for performing surface treatment onto an oxidized film surface of a copper foil of an internal-layer base material for forming a multilayer copper-clad laminated board, surface treatment of the internal-layer base material is performed and a surface treatment film is formed by using an interface activator mixed surface treatment liquid which is obtained by mixing a 0.05-3wt.% interface activator into a surface treatment liquid which includes 0.3-5wt.% coupling agent. For example, a surface treatment liquid including an interface activator where a 0.05wt.% fluorine interface activator is added to a coupling treatment liquid (beta-(3,4-epoxycyclohexyl)ethyltrimethoxysilane 2wt.%, an acetic acid 0.5wt.%, an ethanol 60wt.%, a water 37.5wt.%) is used as a surface treatment process g for dipping the internal-layer base material where patterning and an oxide film are formed. After that, the surface treatment film is formed after drying at room temperature and further drying h at 110 deg.C.

2. 发明专利

JPH03217076A SURFACE TREATMENT OF INTERNAL-LAYER BASE MATERIAL FOR MULTILAYER COPPER-CLAD LAMINATED BOARD 失效
公开(公告)号：JPH03217076A
公开(公告)日：1991-09-24
申请号：JP1205690
申请日：1990-01-22
申请人： MITSUBISHI ELECTRIC CORP
发明人： KIMURA MINORU , FUTAKUCHI MICHIO , KAIZUMI YUTAKA , NAGATA SHOICHI
IPC分类号： H05K3/46
摘要： PURPOSE:To enable a surface treatment film to be formed uniformly on an internal-layer base surface for stabilizing and improving contact with the internal-layer base material of a multilayer substrate and for enhancing the reliability by allowing a surface treatment liquid to be transferred onto the surface of the internal-layer base material by a transfer roller where the surface roughness is adjusted within a specific range for uniform adhesion, etc. CONSTITUTION:In a method for performing surface treatment onto an oxidized film surface of a copper foil 2 of an internal-layer base material 1 for forming a multilayer copper-clad laminated board, a surface treatment liquid 3 is transferred to the surface of the internal-layer base material for uniform adhesion by a transfer roller 6 where the surface roughness is adjusted to 5-150mum, thus forming a surface treatment film. For example, the internal-layer base material 1 which is suspended by a suspension tool 7 is allowed to pass through the transfer roller 6 while a draw-up roller 5 and the transfer roller 6 are rotated to enable the surface treatment liquid 3 which is drawn up by the draw-up roller 5 to be transferred to the internal-layer base material 1 by the transfer roller 6 and the surface treatment liquid 3 to be uniformly adhered onto the surface of the internal-layer base material 1. It is possible to use a metal whose surface roughness is adjusted to the above value, a hard roller such as a hard plastic, and a soft roller such as a soft plastic and a rubber as the transfer roller 6.

3. 发明专利

JPH036087A METAL-BASE PRINTED WIRING BOARD 失效
公开(公告)号：JPH036087A
公开(公告)日：1991-01-11
申请号：JP14042889
申请日：1989-06-02
申请人： MITSUBISHI ELECTRIC CORP
发明人： KIMURA MINORU , ADACHI KYOKO , YAIZUMI YUTAKA
IPC分类号： B32B15/08 , H01B3/52 , H01B17/62 , H05K1/05
摘要： PURPOSE:To obtain excellent heat conductivity and voltage resistance by forming an insulating layer using as a base material yield by impregnating with thermoset resin alumina paper including by a specific amount alumina short fibers with specific fiber diameters and having specific bulk density. CONSTITUTION:There are integrally laminated, pressurized, and heated an alumina plate as a base metal 1, a copper foil as a conductor 3, and a base material as an insulating layer 5 yielded by impregnating alumina paper 7 with epoxy resin as thermoset resin. The alumina paper 7 involves 90% by weight alumina short fibers of 1-5mum diameters and has 0.25g/cm bulk density. Accordingly, there are assured excellent workability where predetermined thickness is yielded only with one layer, and excellent thickness and uniformity. Hereby, excellent heat conductivity and voltage resistance characteristic are obtained.

4. 发明专利

JPH036086A METAL-BASED PRINTED WIRING BOARD 失效
公开(公告)号：JPH036086A
公开(公告)日：1991-01-11
申请号：JP14042789
申请日：1989-06-02
申请人： MITSUBISHI ELECTRIC CORP
发明人： ADACHI KYOKO , KIMURA MINORU , YAIZUMI YUTAKA
IPC分类号： B32B15/08 , H01B3/52 , H01B17/62 , H05K1/05
摘要： PURPOSE:To assure excellent heat conductivity and electric insulating properties by forming an insulating layer using a base material yielded by impregnating ceramics paper of a mixture of alumina fibers and silicon carbide fibers with thermoset resin. CONSTITUTION:There are integrally laminated and formed on a base metal 4 a conductor 6 and an insulating layer 11 using highly heat dissipative ceramics paper 10 formed by mixing alumina fibers 2 and silicon carbide fibers 9. The insulating layer 11 is formed using as a base material a semi-hardened prepreg by mixing the 5-50% by weight silicon carbide fibers 9 to the alumina fibers 2 to form the ceramics paper 10 and impregnating the ceramics paper 10 with thermoset resin 7 such as epoxy resin, and drying the same. Excellent heat conductivity and electric insulating properties an obtained.

5. 发明专利

JPH02133991A MANUFACTURE OF PRINTED-WIRING BOARD WITH COMPOUND METAL FOIL CONDUCTOR 失效
公开(公告)号：JPH02133991A
公开(公告)日：1990-05-23
申请号：JP28804588
申请日：1988-11-15
申请人： MITSUBISHI ELECTRIC CORP
发明人： KIMURA MINORU , MARUYAMA YOSHIHIRO , ADACHI KYOKO , YAIZUMI YUTAKA
IPC分类号： H05K3/20
摘要： PURPOSE:To obtain a method for achieving patterning easily by forming a second type metal foil by plating with a single body metal foil of a first type metal foil being as a metal foil and by forming a second type metal foil by plating for reducing material loss of a conductor and minimizing etching machining. CONSTITUTION:With a first type metal foil 5a with a plating resist 7 as a plating electrode (-), it is mounted to a plating tank having a plating liquid of sulfuric acid copper prepared separately and a copper plate (+) and a second type metal foil pattern 4 is formed at a specified part of an electrode plate by the first type metal foil 5a and the plating resist 7. A prepreg consisting of epoxy resin treated glass cloth is laminated on it as an insulation layer 3, an aluminum plate is laminated on it as a base metal 2, and press molding is made to form one piece. Thus. without using an expensive compound metal foil conductor with a compound metal foil conductor previously, a second type metal foil can be formed at a required part by required amount by plating.

6. 发明专利

JPH01268182A METAL BASE BOARD 失效
公开(公告)号：JPH01268182A
公开(公告)日：1989-10-25
申请号：JP9717488
申请日：1988-04-20
申请人： MITSUBISHI ELECTRIC CORP
发明人： MARUYAMA YOSHIHIRO , KIMURA MINORU , ADACHI KYOKO , KOGURE NAOYUKI , IEIZUMI YUTAKA
IPC分类号： H05K1/05
摘要： PURPOSE:To obtain a metal board A in which an irregularity of a pattern forming accuracy, an improper contact of a mounting component, an improper soldering in a soldering step, etc., can be reduced by forming the metal plate of a base board of a shape memory alloy for storing a shape having no deformation such as a warpage, a twist, etc. CONSTITUTION:A shape memory alloy using Ni-Ti alloy or Cu-Zn-A alloy is set to a jig or a die in a shape having no deformation such as a warpage, a twist, etc., and a metal plate 2a of the shape memory alloy storing by heating at +300 to 850 deg.C and recovering a memorized shape at 140-160 deg.C of transformed point is prepared. A metal board in which an insulator 2, a conductor 3 are laminated on the plate 1a is thermally pressed by a hot board press 4 at 80-130 deg.C to be brought into close contact and cured. Then, the board A in which the warpage, the twist, etc., is generated is heated by a heater 5 to 140-160 deg.C of its transformation point without applying an external force thereto, thereby causing a shape memory effect, and reducing the deformation such as the warpage, the twist, etc., generated at the board A. A metal board of the shape in which the deformation such as the twist or the like is reduced is obtained through the above manufacturing steps.

7. 发明专利

JPS63274197A METAL CORE PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPS63274197A
公开(公告)日：1988-11-11
申请号：JP11001787
申请日：1987-05-06
申请人： MITSUBISHI ELECTRIC CORP
发明人： HANI KIYOSHI , HAYAMA MUTSUKO , NISHIMOTO YOSHIO , HISHIKI HIROSHI , KIMURA MINORU , NAKAI TATSUJI
IPC分类号： H05K3/44
摘要： PURPOSE:To improve the heat cycle resistance and the soldering thermal resistance of a base material by providing a laminated structure which is formed by the steps of applying anodic oxidation over the surface of an aluminum plate provided with through holes, treating the anodic oxide with a primer or coupling agent, and supperposing prepreg sheets of a specific ceramic and them a metal foil. CONSTITUTION:A through hole 1a is opened in an aluminum plate 1, then treated with anode oxidation by sulfuric acid, chromic acid, etc., and an oxide film layer 2 is formed. Then, a primer treatment is carried out with a direct resin dilute solution or an electrodeposition coating material and a surface treated layer 3 which also seals a hole with a synthetic resin is provided. Then, a laminated board can be obtained by superposing an aluminum plate 1 and a metal foil 5 by using a plurality of prepreg sheets 4 manufactured with ceramic paper and a synthetic resin and by pressurizing, heating and forming. The ceramic paper uses a main raw material of a ceramic short fiber which has a diameter of 5 mum or less and the distribution of a fiber length within the range of 5-500 mum.

8. 发明专利

JPS63274196A METAL CORE PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPS63274196A
公开(公告)日：1988-11-11
申请号：JP11001687
申请日：1987-05-06
申请人： MITSUBISHI ELECTRIC CORP
发明人： HANI KIYOSHI , HAYAMA MUTSUKO , NISHIMOTO YOSHIO , HISHIKI HIROSHI , KIMURA MINORU , NAKAI TATSUJI
IPC分类号： B32B15/14 , H05K1/03 , H05K1/05 , H05K3/42 , H05K3/44
摘要： PURPOSE:To improve the heat dissipation from a through hole and heat cycle resistance by forming an excellent heat conductivity insulating layer on both the surfaces of a metal plate and by filling a through hole with a synthetic resin which contains many ceramic short fibers. CONSTITUTION:Prepreg sheets 2, 3 using ceramic paper are superposed on the top and the bottom of a metal plate 1 provided with a through hole 1a, a metal foil 4 is superposed on both surfaces and these are processed, heated and formed by a press. The through hole has an insulating layer 6 formed by destroying the ceramic paper by the flow pressure of a resin. A metal core printed circuit board can be obtained by plating the through hole and by forming a wiring circuit pattern 7 after opening a small hole in the through hole 1a of the obtained metal plate 1. The ceramic paper used for the prepreg sheet 2 uses a ceramic short fiber which has a diameter of 5 mum or less and the distribution of a fiber length within the range of 5-500 mum.

9. 发明专利

JPS61248893A METHOD OF MARKING HANDRAIL 失效
公开(公告)号：JPS61248893A
公开(公告)日：1986-11-06
申请号：JP8696285
申请日：1985-04-23
申请人： MITSUBISHI ELECTRIC CORP
发明人： KIMURA MINORU
IPC分类号： B29C39/10 , B05D5/06 , B29C39/12 , B29C59/00 , B29L29/00 , B66B23/24

10. 发明专利

JPH0271583A PRINTED WIRING BOARD 失效
公开(公告)号：JPH0271583A
公开(公告)日：1990-03-12
申请号：JP22278788
申请日：1988-09-06
申请人： MITSUBISHI ELECTRIC CORP
发明人： MARUYAMA YOSHIHIRO , KIMURA MINORU , ODERA SUSUMU
IPC分类号： H05K3/20 , H05K3/38
摘要： PURPOSE:To obtain a printed wiring board provided wit a pattern which is hard to separate from the wiring board, and high in reliability and adhesion by a method wherein a protrudent part is brought into close contact with an insulating layer by biting into it. CONSTITUTION:A photosensitive dry film is pasted on a side of an electrode 6 of stainless steel, which is exposed to light to form a linear pattern conductor 2, and the photosensitive dry film is left unremoved on the part other than the pattern section as a plating resist 7, and the conductor 2 is successively formed through plating, and the conductor 2 is formed even on the plating resist 7 through plating for the formation of a protruded part 3 on the conductor 2. On the other hand, the prepreg of glass cloth-epoxy resin, which is to be an insulating layer 4, is deposited on a base metal 5, and an integral piece 9 is placed on the prepreg and pressed to form a laminated body. After the laminated body is cooled down, an electrode plate 6 and the plating resist 7 are removed to obtain a printed wiring board 1 provided with the conductor 2 which serves as a pattern section embedded with a protruded part 3.

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