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1. 发明专利

JPS5841289B2 失效
公开(公告)号：JPS5841289B2
公开(公告)日：1983-09-10
申请号：JP3217380
申请日：1980-03-14
申请人： MITSUBISHI DENKI KK , RYODEN KASEI KK
发明人： ETO SHOHEI , MORIWAKI NORIMOTO , YAMAMOTO YASUSHI , CHIDAI HIDEKI , NAKAMURA TATSUHARU , SHINOZAKI NOBORU , MAKINO TOMOTAKA
IPC分类号： C08G59/00 , C08G59/14 , C08G59/18 , C08G59/40 , C08G63/00 , C08G63/685

2. 发明专利

JP2761092B2 失效
公开(公告)号：JP2761092B2
公开(公告)日：1998-06-04
申请号：JP27378490
申请日：1990-10-12
申请人： RYODEN KASEI KK , MITSUBISHI DENKI KK
发明人： SHINOZAKI NOBORU , NAKANO TOMOFUMI , YANAGIURA SATOSHI , YAMAMOTO YASUSHI
IPC分类号： G03F7/027 , C08F2/44 , C08F2/46 , C08F2/48 , C08F299/02 , C08G59/20 , C08G59/40

3. 发明专利

JPS5841290B2 失效
公开(公告)号：JPS5841290B2
公开(公告)日：1983-09-10
申请号：JP3217480
申请日：1980-03-14
申请人： MITSUBISHI DENKI KK , RYODEN KASEI KK
发明人： ETO SHOHEI , MORIWAKI NORIMOTO , YAMAMOTO YASUSHI , FUKAMI AKIRA , NAKAMURA TATSUHARU , SHINOZAKI NOBORU
IPC分类号： C08G59/00 , C08G59/14 , C08G59/18 , C08G59/40 , C08G63/00 , C08G63/685

4. 发明专利

JPH04149444A TWO-PACK MIXING TYPE HARDENABLE RESIN COMPOSITION 失效
公开(公告)号：JPH04149444A
公开(公告)日：1992-05-22
申请号：JP27378590
申请日：1990-10-12
申请人： RYODEN KASEI KK , MITSUBISHI ELECTRIC CORP
发明人： YANAGIURA SATOSHI , YAMAMOTO YASUSHI , SHINOZAKI NOBORU , NAKANO TOMOFUMI
IPC分类号： G03F7/027 , C08F2/46 , C08F2/48
摘要： PURPOSE:To improve long-term reliability and to improve thick film hardenability, surface hardenability, adhesion with a base material, environmental resistance, and electric insulation by forming a composition with two kinds of liquids, a specific main agent and a specific hardening agent, and making at least one of photopolymerization initiators out of a peroxide photopolymerization initiator. CONSTITUTION:A main agent liquid is made of such main ingredients as acrylic oligomer, epoxy oligomer, and a photopolymerization initiator, while a hardening liquid is made of an amine compound which is not aromatic. At least one of photopolymerization initiators is a peroxide photopolymerization initiator. In this case, an acrylic group which do not react in a temporary hardening stage reacts at room temperature. Therefore, the acrylic group which do not react do not remain in the system. Thus, it is possible to improve long-term reliability, thick film hardenability, surface hardenability, adhesion with a base material, environmental resistance, and electric resistance, thereby permitting automatic intermixing application.

5. 发明专利

JPH04149443A TWO PACK MIXING TYPE HARDENABLE RESIN COMPOSITION 失效
公开(公告)号：JPH04149443A
公开(公告)日：1992-05-22
申请号：JP27378490
申请日：1990-10-12
申请人： RYODEN KASEI KK , MITSUBISHI ELECTRIC CORP
发明人： SHINOZAKI NOBORU , NAKANO TOMOFUMI , YANAGIURA SATOSHI , YAMAMOTO YASUSHI
IPC分类号： G03F7/027 , C08F2/44 , C08F2/46 , C08F2/48 , C08F299/02 , C08G59/20 , C08G59/40
摘要： PURPOSE:To temporarily harden by photoirradiation, to completely harden by leaving to stand at ordinary temperature, and to improve adhesion with a base material, environmental resistance, and electric insulation by forming a composition with a specific main agent liquid and a specific hardening agent liquid. CONSTITUTION:This composition is formed by a main agent liquid, having such main ingredients as epoxy acrylete, part of whose epoxy group in a molecule is acrylic-denatured, urethane acrylate having at least two acryloyl groups in a molecule, bisphenol type epoxy oligomer, and a photopolymerization initiator, and a hardening agent liquid, having such main ingredients as 3, 9-bis (3- aminopropyl)-2, 4, 8, 10-tetraspiro [5, 5] undecane or its denatured substance. Thus, the composition becomes solid by photoirradiation and becomes a tough hardened substance at ordinary temperature. Further, thick film hardenability, surface hardenability, adhesion with a base material, environmental resistance, and electric insulation are improved, and automatic intermixing application is made possible.

6. 发明专利

JPS56129217A CURABLE RESIN COMPOSITION 失效
公开(公告)号：JPS56129217A
公开(公告)日：1981-10-09
申请号：JP3217380
申请日：1980-03-14
申请人： MITSUBISHI ELECTRIC CORP , RYODEN KASEI KK
发明人： ETOU SHIYOUHEI , MORIWAKI NORIMOTO , YAMAMOTO YASUSHI , CHITOMO HIDEKI , NAKAMURA TATSUHARU , SHINOZAKI NOBORU , MAKINO TOMOTAKA
IPC分类号： C08G59/00 , C08G59/14 , C08G59/18 , C08G59/40 , C08G63/00 , C08G63/685
摘要： PURPOSE:Titled composition having excellent heat resistance and mechanical properties and being useful as an electrical insulation mateial, which comprises a specified epoxy-modified unsaturated polyester, a radical-polymerizable monomer, a radical polymerization initiator and an epoxy ring-opening polymerization catalyst. CONSTITUTION:An epoxy-modified unsaturated polyester (A) is obtained by reacting 20-80pts.wt. epoxy resin with 100pts.wt. unsaturated polyester, acid value 20-150, obtained by reacting a monohydric imido-containing alcohol of formula I or II, wherein R1 is H or methyl and R2 is a C2-4 alkykene, an imido-containing hydroxy-carboxylic acid compound of formula III, wherein R3 is a C2-4 alkylene, an alpha,beta-unsaturated dicarboxylic acid or a mono- to polybasic carboxylic acid and a mono- to polyhydric alcohol. Next, to the resulting polyester are added a radical- polymerizable monomer such as styrene, a radical polymerization initiator such as benzoyl peroxide and an epoxy ring-opening polymerization catalyst such as zine caprylate.

7. 发明专利

JPH0683050A TWO PART SETTING-TYPE RESIN COMPOSITION 失效
公开(公告)号：JPH0683050A
公开(公告)日：1994-03-25
申请号：JP23575492
申请日：1992-09-03
申请人： RYODEN KASEI KK , MITSUBISHI ELECTRIC CORP
发明人： SHINOZAKI NOBORU , NAKANO TOMOFUMI , YANAGIURA SATOSHI , YAMAMOTO YASUSHI , BABA FUMIAKI
IPC分类号： G03F7/004 , C08F2/44 , C08F2/48 , G03F7/027 , G03F7/031 , H05K1/03 , H05K3/28
摘要： PURPOSE:To obtain a photosetting film which can be hardened with light, can be made thick, and has excellent surface hardening property by using tri- or higher functional urethane (meth)acrylate and glycol or glycol dimethacrylate as the photosetting component and using a compd. containing HOC(CH3)2CO- or HC(OC2H5)2CO-in the molecule as a photopolymn. initiator. CONSTITUTION:This two part photosetting resin compsn. consists of the principal liquid (A) and a hardening agent liquid (B). The principal liquid essentially consists of urethane (meth)acrylate having at least three (meth)acrylic groups in the molecule, glycol or glycerol dimethacrylate, bisphenol epoxy resin, compd. expressed by formula (I), and compd. expressed by formula (II). In formula, R is a hydrogen atom, or alkyl group of 1-15 carbon number. The hardening agent essentially consists of 3,9-bis(3-aminopropyl)-2,4,8,10-tetraoxa spiro[5, 5]undecane.

8. 发明专利

JPS62148764A CONCRETE MOLD FRAME MATERIAL 失效
公开(公告)号：JPS62148764A
公开(公告)日：1987-07-02
申请号：JP28801285
申请日：1985-12-23
申请人： RYODEN KASEI KK , OSHIKA SHINKO CO
发明人： HOSOMI KOICHI , HAYASHI SEIJIRO , OOTA TADAO , SHINOZAKI NOBORU , HIGUCHI SHOJI
IPC分类号： E04G9/08 , E04G9/05 , E04G9/10

9. 发明专利

JPS61222239A RESIN SEALED BODY 失效
公开(公告)号：JPS61222239A
公开(公告)日：1986-10-02
申请号：JP6447385
申请日：1985-03-28
申请人： MITSUBISHI ELECTRIC CORP , RYODEN KASEI KK
发明人： KOTAI SHOJIRO , INOUE MASAMI , SHINOZAKI NOBORU , SANEMITSU YOSHIKADO
IPC分类号： B29C39/10 , B29C39/22 , B29L31/34 , H01L23/29 , H01L23/31
摘要： PURPOSE:To obtain a resin sealed body, in which stress due to resin sealing of members to be sealed can be alleviated, by forming a buffer film by primer resin, whose thermal expansion coefficient is larger than that of sealing resin and elastic modulus is smaller, on the outer surfaces of the bodies to be sealed, and thereafter performing the sealing. CONSTITUTION:On the outer surfaces of bodies to be sealed 2 and 3, a buffer film 5 is formed by primer resin, whose thermal expansion coefficient is larger than that of sealing resin 4 and elastic modulus is smaller. Thereafter, the films is sealed by the sealing resin 4. For example, after the buffer coat 5 is deposited and formed on the outer surfaces of the IC module and the gold wire 3, the film is sealed by the precoat resin 4, which is an epoxy resin. At this time, the thermal expansion coefficient of the buffer coat 5 is about three times that of the precoat resin; and the elastic modulus of the buffer coat 5 is about 1/4 times that of the precoat resin. When the precoat resin is hardened and cooled, the buffer coat 5 is contracted larger than the precoat resin 4. Therefore, the contracting force of the precoat resin is sufficiently allevaited by the buffer coat 5. The contracting force does not act on the IC module 2.

10. 发明专利

JPS61222794A INTEGRATED CIRCUIT CARD 失效
公开(公告)号：JPS61222794A
公开(公告)日：1986-10-03
申请号：JP6447985
申请日：1985-03-28
申请人： MITSUBISHI ELECTRIC CORP , RYODEN KASEI KK
发明人： KOTAI SHOJIRO , SHINOZAKI NOBORU
IPC分类号： G06K19/077 , B42D15/02 , B42D15/10 , G06K19/00 , H05K1/18 , H05K3/28

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