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1. 发明专利

JP2000043107A METHOD FOR MOLDING THERMOPLASTIC RESIN 失效
公开(公告)号：JP2000043107A
公开(公告)日：2000-02-15
申请号：JP21240198
申请日：1998-07-28
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： HASHIMOTO YOICHI , OHIRA TSUTOMU , SUZUKI TAKAHIDE
IPC分类号： B29C45/14 , B29C45/56 , B29K101/12 , B29L31/34 , H01L21/56
摘要： PROBLEM TO BE SOLVED: To provide a method for molding thermoplastic resin in which generation of a sink and a void in moldings is decreased. SOLUTION: In relation to the method for molding thermoplastic resin, thermoplastic resin 4 is filled into the cavity 2 of a die 1 through a gate 3. The gate 3 is closed. Coefficient of gate is set-up to >=0.023. After the gate 3 is closed, thermoplastic resin 4 filled in the cavity 2 is compressed. Fluidity of thermoplastic resin 4 filled in the cavity 2 is enhanced and also uniformity of the filling state of thermoplastic resin 4 in the cavity 2 can be contrived.

2. 发明专利

JP2002097252A RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE AND OPTICAL SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2002097252A
公开(公告)日：2002-04-02
申请号：JP2000293058
申请日：2000-09-26
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： WADA TATSUYOSHI , KIYOUGAKU MASAYUKI , OHIRA TSUTOMU
IPC分类号： C08K3/00 , C08G59/20 , C08G59/62 , C08L63/00 , H01L23/08 , H01L23/373 , H01L27/14 , H01L31/02 , H01L33/48 , H01L33/00
摘要： PROBLEM TO BE SOLVED: To provide a resin composition for an optical semiconductor with minimal dimensional change by moisture absorption and whose hygroscopicity is large and whose moisture permeability is low. SOLUTION: This resin composition contains an epoxy resin whose epoxy equivalent is 170 or less and a curing agent whose hydroxyl equivalent is 130 or less. And the dimensional change by moisture absorption can be reduced.

3. 发明专利

JP2000012583A METHOD FOR SEAL-MOLDING SEMICONDUCTOR 失效
公开(公告)号：JP2000012583A
公开(公告)日：2000-01-14
申请号：JP17833998
申请日：1998-06-25
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： HASHIMOTO YOICHI , OHIRA TSUTOMU
IPC分类号： B29C45/73 , B29C45/14 , B29K81/00 , B29K103/04 , B29L31/34 , H01L21/56 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To prevent occurrence of bending fails of a wire when seal-molded by use of a PPS(polyphenylene sulphite) resin. SOLUTION: In this seal-molding method, a PPS resin molding material 4 containing a PPS resin and an inactive filler and including the PPS resin of 30 to 99 wt.% is injected to a molding die set in the temperature range of a fusing point -50 deg.C to the fusing point of the PPS resin, so that a semiconductor element 1 is seal-molded. Next, after the molding die is cooled at a temperature that is lower by 80 deg.C or more than the fusing point of the PPS resin, the seal-molded product is fetched out from the molding die. When the PPS resin molding material is injected to the molding die, it is possible to prevent a reduction in a temperature of a fusing material of the PPS resin molding material and prevent a sweep of a wire 3 due to an increase in a fusing viscosity. Furthermore, when the seal-molded product is taken out, it is possible to prevent the occurrence of a change by setting forward sufficiently a cooling solidification of the seal-molded product.

4. 发明专利

JP2006041143A Optical semiconductor device 有权
标题翻译：光学半导体器件
公开(公告)号：JP2006041143A
公开(公告)日：2006-02-09
申请号：JP2004218147
申请日：2004-07-27
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： HIGASHINE MASAOKI , OHIRA TSUTOMU
IPC分类号： H01L31/02 , C09J163/00 , C09K3/10 , H01L23/02 , H01L27/14
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide an optical semiconductor device where excellent high adhesiveness between a seal and a lid of glass surface etc. through an adhesive layer is attained.
SOLUTION: In the optical semiconductor device which consists of the seal housing an optical semiconductor element and consisting of epoxy resin and the transparent lid connected with the seal through an adhesive; the adhesive is an epoxy-based adhesive, the seal consists of the hardened matter of an epoxy resin component, the resin component contains epoxy resin having biphenyl skeleton, the coefficients of the linear expansion of the hardened matter at 50 °C is 8 to 13 ppm, and the elastic modulus of the linear expansion of the hardened matter at 50 °C is 16 to 28 GPa. The optical semiconductor device has excellent high adhesiveness between the seal and the lid.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种通过粘合剂层获得密封件和玻璃表面的盖子之间的高密合性的光学半导体装置。解决方案：在由包含光学半导体元件并由环氧树脂组成的密封件和通过粘合剂与密封件连接的透明盖的光学半导体器件中; 粘合剂是环氧类粘合剂，密封由环氧树脂组分的硬化物组成，树脂组分含有具有联苯骨架的环氧树脂，硬化物在50℃下的线性膨胀系数为8至13 ppm，硬化物在50℃下的线膨胀的弹性模量为16〜28GPa。光学半导体器件在密封和盖子之间具有优异的高粘附性。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2002322345A RESIN COMPOSITION FOR PHOTOSEMICONDUCTOR DEVICE AND PHOTOSEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2002322345A
公开(公告)日：2002-11-08
申请号：JP2001125867
申请日：2001-04-24
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： OHIRA TSUTOMU , WADA TATSUYOSHI , KIYOUGAKU MASAYUKI
IPC分类号： C08L63/00 , C08K3/00 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To obtain a resin composition for photosemiconductor devices which prevents the generation of dewing and clouding on covers and prevents the covers from coming off from the photosemiconductor devices. SOLUTION: This invention relates to a resin composition for photosemiconductor devices containing as the essential components an epoxy resin, a curing agent, a curing accelerator, and an inorganic filler. The inorganic filler used has an average particle diameter of 10 μm or less and a specific surface area of 3.5 m /g or more. When the cured product of the above resin composition is exposed to moisture for 120 h under 85 deg.C and 85% RH, its moisture absorption ratio is 0.2 wt.% or more to the total amount of the cured product. The moisture permeability of the cured product can be lowered, and at the same time, its moisture absorption can be enhanced.

6. 发明专利

JP2002322242A RESIN COMPOSITION FOR PHOTO-SEMICONDUCTIVE DEVICE AND THE PHOTO-SEMICONDUCTIVE DEVICE 失效
公开(公告)号：JP2002322242A
公开(公告)日：2002-11-08
申请号：JP2001125873
申请日：2001-04-24
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： WADA TATSUYOSHI , OHIRA TSUTOMU
IPC分类号： C08K3/00 , C08G59/32 , C08G59/62 , C08L63/00 , H01L31/02
摘要： PROBLEM TO BE SOLVED: To provide a resin composition for a photo-semiconductive device, capable of preventing generation of moisture condensation and cloudiness on a cover and capable of preventing separation of the cover from the photo- semiconductive device. SOLUTION: This resin composition for the photo-semiconductive device contains an epoxy resin, a curing agent, a curing accelerator, and an inorganic filler as essential ingredients, wherein an epoxy resin having an epoxy equivalent of =0.3 wt.% based on the total amount of the cured product. The cured product is made to have the decreased rate of dimensional change and the increased coefficient of moisture absorption.

7. 发明专利

JP2003213088A RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR SEALING USE AND OPTICAL SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：JP2003213088A
公开(公告)日：2003-07-30
申请号：JP2002018857
申请日：2002-01-28
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： WADA TATSUYOSHI , KIYOUGAKU MASAYUKI , OHIRA TSUTOMU
IPC分类号： C08L63/00 , C08G59/40 , C08K5/1535 , C08K5/1545 , C08L91/06 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide a resin composition for optical semiconductor sealing use suppressed in wax bleedout so as not to cause wax fouling and/or wax unevenness and enabling its adhesion to lead frames to be increased. SOLUTION: This resin composition for optical semiconductor sealing use comprises an epoxy resin, a curing agent, an inorganic filler, a curing promoter, and wax which is prepared by melt blending two or more kinds of wax with a dispersant of structural formula (1) or (2). Use of the wax thus prepared suppresses the wax bleedout. COPYRIGHT: (C)2003,JPO

8. 发明专利

JP2003012774A Resin composition for photosemiconductor device and photosemiconductor device 有权
标题翻译：光电子器件和光电子器件的树脂组合物
公开(公告)号：JP2003012774A
公开(公告)日：2003-01-15
申请号：JP2001199829
申请日：2001-06-29
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： WADA TATSUYOSHI , KIYOUGAKU MASAYUKI , OHIRA TSUTOMU
IPC分类号： C08K3/00 , C08G59/62 , C08L63/00 , H01L23/08 , H01L31/02 , H01L33/62
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2924/16195 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To obtain a resin composition for photosemiconductor devices not generating dew condensation and cloudiness and having high dimensional stability. SOLUTION: This invention relates to the resin composition for photosemiconductors consisting essentially of an epoxy resin, a curing agent, an inorganic filler and a curing accelerator. An epoxy resin having a skeleton represented by formula (1) [wherein G is glycidyl group; (m) is an integer of 0-5; R is hydrogen atom or a 1-5C alkyl group] is used as the epoxy resin. A curing agent having a skeleton represented by formula (2) [wherein (n) is an integer of 0 to 5; R' is hydrogen atom or a 1-5C alkyl group] is used as the curing agent. Further, the glass transition temperature of its cured product is >=190 deg.C. As a result, moisture absorption of the cured product can be increased and the cured product having high dimensional stability can be obtained.
摘要翻译：要解决的问题：获得不产生结露和浑浊并具有高尺寸稳定性的光半导体器件用树脂组合物。解决方案：本发明涉及基本上由环氧树脂，固化剂，无机填料和固化促进剂组成的光电流体用树脂组合物。具有由式（1）表示的骨架的环氧树脂[其中G为缩水甘油基; （m）为0-5的整数; R是氢原子或1-5C烷基]用作环氧树脂。具有由式（2）表示的骨架的固化剂[其中（n）为0〜5的整数） R'为氢原子或1-5C烷基]用作固化剂。此外，其固化产物的玻璃化转变温度> 190℃。结果，可以提高固化产物的吸湿性，并且可以获得具有高尺寸稳定性的固化产物。

9. 发明专利

JP2000334781A PREPARATION OF SEMICONDUCTOR PACKAGE AND MOLD FOR PREPARING SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JP2000334781A
公开(公告)日：2000-12-05
申请号：JP14734099
申请日：1999-05-26
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： HASHIMOTO YOICHI , OHIRA TSUTOMU , SUZUKI TAKAHIDE
IPC分类号： H01L21/56 , B29C45/26
摘要： PROBLEM TO BE SOLVED: To provide a method for preparing a semiconductor package which can avoid deformation of a lead frame. SOLUTION: A lead frame 2 to which a semiconductor chip 1 is fixed is arranged in a cavity 3. In a method for preparing a semiconductor package wherein a thermoplastic resin material 4 is filled in the cavity 3 and the semiconductor 1 is encapsulated and molded with the thermoplastic resin material 4, the lead frame 2 is supported in the cavity 3 when filling of the thermoplastic resin material 4 is started and supporting of the lead frame 2 is released just before or after filling of the thermoplastic resin material 4 is completed. By supporting the lead frame 2 in the cavity 3 when filling of the thermoplastic resin material 4 is started, it is possible to prevent the lead frame from being bent by pressure of the thermoplastic resin material 4.

10. 发明专利

JP2000271968A METHOD AND MOLD FOR PRODUCING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JP2000271968A
公开(公告)日：2000-10-03
申请号：JP8410899
申请日：1999-03-26
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： HASHIMOTO YOICHI , OHIRA TSUTOMU , SUZUKI TAKAHIDE
IPC分类号： H01L21/56 , B29C45/14 , B29C45/26
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor package producing method capable of reducing the generation of a sink or voids in a sealing resin without lowering appearance. SOLUTION: A semiconductor is arranged in a cavity 2 and the cavity 2 is filled with a thermoplastic resin 4 through a gate 3 of which the gate coefficient is set to 0.023 or more. A semiconductor package is produced by compressing the thermoplastic resin 4 charged in the cavity 2 by a compression pin 6 to seal the semiconductor with the thermoplastic resin 4. A compression surface 8 having an area being 50% or more of that of the top surface of the semiconductor package is formed to the compression pin 6 and brought into contact with the thermoplastic resin 4 in the cavity at a place becoming the top surface of the semiconductor package to compress the thermoplastic resin. The deformation caused by the compression of the compression pin 6 is not locally generated in the top surface of the semiconductor package and the mark of the compression pin 6 becomes inconspicuous.

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