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    • 5. 发明专利
    • Method of connecting printed circuit
    • 连接打印电路的方法
    • JP2005057172A
    • 2005-03-03
    • JP2003288709
    • 2003-08-07
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • YOSHIDA HISAHIKOTANI YOSHIYUKI
    • H05K1/14
    • PROBLEM TO BE SOLVED: To solve the problem wherein the packing density is raised to result in that heating a rigid wiring board and a flexible wiring board to connect both, damages neighboring components, or otherwise if a connector is used, it needs a considerable space, and the flexible rigid wiring board is hard to ensure the mounting accuracy.
      SOLUTION: A fitting recess is formed into the peripheral end face of a rigid wiring board, a flexible wiring board is inserted and held in the fitting recess to electrically connect it with an inner layer pattern having bumps which are fitted into through-holes formed in the flexible printed wiring board to prevent this board from dropping off, thereby forming a connection without needing the heating process. Thus, an advantageous method of connecting the printed wiring boards is obtained for realizing a high packing density and a high mounting accuracy of components mounted on the wiring board surface.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题为了解决堆积密度升高的问题,导致加热刚性布线板和柔性布线板以连接两者,损坏相邻部件,或者如果使用连接器则需要 相当的空间,柔性刚性布线板难以确保安装精度。 解决方案:在刚性布线板的周边端面形成嵌合凹部,将柔性布线板插入并保持在嵌合凹部中,将其与具有凸点的内层图案电连接, 形成在柔性印刷电路板中的孔,以防止该板脱落,从而形成连接而不需要加热过程。 因此,为了实现安装在布线板表面上的部件的高封装密度和高安装精度,获得了连接印刷电路板的有利方法。 版权所有(C)2005,JPO&NCIPI
    • 6. 发明专利
    • FORMATION OF PATTERN
    • JPH03223858A
    • 1991-10-02
    • JP1953090
    • 1990-01-30
    • MATSUSHITA ELECTRIC IND CO LTD
    • TANI YOSHIYUKISASAKO MASARU
    • G03F7/039G03F7/26H01L21/027
    • PURPOSE:To form fine pattern shaving high dimensional accuracy by using a tertiary butoxy group as a functional group exhibiting alkaline solubility in an acid atmosphere to a resin. CONSTITUTION:A pattern forming material film 2 consisting of resin having the tertiary butoxy group in the molecule, a photosensitive compd. which generates an acid by exposing, and a solvent which can dissolve the resin and compd. is formed on a substrate 1. The material film 2 is subjected to selective exposing with far UV rays and developing to form the patterns. The functional group of the resin receives a chemical change by an acid and becomes soluble in the alkalis when subjected to a heat treatment in succession to the exposing stage in this case. This functional group elutes into the developing soln. at the time of development. On the other hand, the acid is not generated in the unexposed pars and, therefore, the chemical change does not arise in spite of the heat treatment and there is no development of the alkaline soluble group. The patterns 2a of the positive type having the high dimensional accuracy and a good contrast are formed in this way.
    • 9. 发明专利
    • Inclusion determination method of specific material and device therefor
    • 包含特定材料及其装置的确定方法
    • JP2007057314A
    • 2007-03-08
    • JP2005241153
    • 2005-08-23
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • TANI YOSHIYUKIIWAMOTO HIROSHIHISAKADO TAKAOIWATA YUKIHIRO
    • G01N23/223
    • G01N23/223G01N2223/076
    • PROBLEM TO BE SOLVED: To shorten a time required for processing, to facilitate a working process, and to improve the processing amount of a determination object, in X-ray analysis of a specific material included in the determination object. SOLUTION: This method for determining inclusion of the specific material in the determination object 106 has: a measuring process S3 for irradiating the determination object 106 with an X-ray, and measuring a spectrum of the determination object 106; and a determination process S4 for comparing each component of the specific material between the spectrum of the determination object 106 and a reference spectrum stored beforehand corresponding to the determination object 106, and determining whether the specific material is included as much as a prescribed value or more in the determination object 106. COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:在包括在确定对象中的特定材料的X射线分析中,缩短处理所需的时间,便于加工过程和改善确定对象的处理量。 解决方案:用于确定确定对象106中的特定材料的包含的方法具有:用X射线照射确定对象106并测量确定对象106的光谱的测量处理S3; 以及确定处理S4,用于比较确定对象106的频谱和预先存储的与确定对象106相对应的参考频谱之间的特定材料的各个分量,并确定特定材料是否包括在规定值以上 在决定对象106中。版权所有(C)2007,JPO&INPIT