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    • 1. 发明专利
    • Film bulk acoustic resonator, filter, and fabrication method thereof
    • 电影大容量声学谐振器,滤波器及其制造方法
    • JP2008034925A
    • 2008-02-14
    • JP2006203023
    • 2006-07-26
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • UNO TAKASHITSURUMI NAOHIROHACHIMAN KAZUHIROSAKAI HIROYUKI
    • H03H9/17H03H3/02
    • PROBLEM TO BE SOLVED: To provide a fabrication method of a film bulk acoustic resonator that makes it possible to form a piezoelectric film which is formed on a smooth surface and has good crystallinity.
      SOLUTION: The film bulk acoustic resonator includes: a substrate 11; an acoustic reflector portion 14 formed on the substrate 11; and an acoustic resonator portion 18 stacked on the acoustic reflector portion 14. The acoustic resonator portion 18 includes a lower electrode 15, a piezoelectric film 16, and an upper electrode 17, which are sequentially stacked on the acoustic reflector portion 14. The acoustic reflector portion 14 includes a low acoustic impedance layer 13 comprising a material whose acoustic impedance value is lower than the acoustic impedance value of the lower electrode 15, and a layer of the acoustic reflector portion 14 in contact with the acoustic resonator portion 18 is a film formed by spin coating.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供一种膜体声波谐振器的制造方法,其可以形成形成在光滑表面上并且具有良好结晶度的压电膜。 薄膜体声波谐振器包括:基板11; 形成在基板11上的声反射部14; 以及叠层在声反射器部分14上的声谐振器部分18.声谐振器部分18包括依次堆叠在声反射器部分14上的下电极15,压电薄膜16和上电极17。 部分14包括低声阻抗层13,其包括声阻抗值低于下电极15的声阻抗值的材料,并且与声共振器部分18接触的声反射器部分14的层是成膜的 通过旋涂。 版权所有(C)2008,JPO&INPIT
    • 3. 发明专利
    • Thin film bulk sound resonator and its manufacturing method
    • 薄膜音箱谐振器及其制造方法
    • JP2007043498A
    • 2007-02-15
    • JP2005225686
    • 2005-08-03
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • UNO TAKASHITSURUMI NAOHIROHACHIMAN KAZUHIRO
    • H03H3/02H01L41/09H01L41/18H01L41/187H01L41/22H01L41/313H01L41/335H01L41/337H01L41/39H03H9/17
    • PROBLEM TO BE SOLVED: To improve flatness of a surface of a piezoelectric material film after a semiconductor film for crystal growth substrate of the piezoelectric material film is eliminated and to obtain stable resonance property in a thin film bulk sound resonator. SOLUTION: The semiconductor film 2 and the piezoelectric material film 3 are sequentially formed on the crystal growth substrate 1 by crystal growth. In a state that a layered product in which a lower part electrode 4 is formed on the piezoelectric material film and a supporting substrate 6 are connected via joint of a first metal film 5 with a second metal film 8, a laser beam of wavelength which is absorbed not by the crystal growth substrate but by the semiconductor film is irradiated from a back face of the crystal growth substrate and the crystal growth substrate and the semiconductor film are separated from each other at least at a part of an interface between the crystal growth substrate and the crystal growth substrate. Then, the crystal growth substrate is eliminated and a surface of the semiconductor film from which the crystal growth substrate has been eliminated is flattened by CMP (chemical mechanical polishing). Moreover, after the semiconductor film is eliminated by dry etching, the upper part electrode is formed on the piezoelectric substance film from which the semiconductor film has been eliminated. COPYRIGHT: (C)2007,JPO&INPIT
    • 解决的问题:为了提高在压电材料膜的晶体生长用基板的半导体膜被消除之后,为了提高压电材料膜的表面的平坦度,并且在薄膜体声共振器中获得稳定的共振性能。 解决方案:通过晶体生长,半导体膜2和压电材料膜3依次形成在晶体生长衬底1上。 在压电材料膜上形成下部电极4的层叠体和支撑基板6通过第一金属膜5与第二金属膜8的接合而连接的状态下, 至少在晶体生长衬底之间的界面的至少一部分处,从晶体生长衬底的不吸收而不是由晶体生长衬底吸收的半导体膜被从晶体生长衬底的背面照射并且晶体生长衬底和半导体膜彼此分离, 和晶体生长衬底。 然后,消除晶体生长衬底,并且通过CMP(化学机械抛光)使已经消除了晶体生长衬底的半导体膜的表面变平。 此外,在通过干蚀刻消除半导体膜之后,上部电极形成在已经从其去除了半导体膜的压电体膜上。 版权所有(C)2007,JPO&INPIT
    • 4. 发明专利
    • Manufacturing method of resonator
    • 谐振器的制造方法
    • JP2006148402A
    • 2006-06-08
    • JP2004334144
    • 2004-11-18
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • TSURUMI NAOHIROUNO TAKASHIUEMOTO YASUHIROTANAKA TAKESHI
    • H03H9/17H01L41/09H01L41/18H01L41/187H01L41/22H01L41/313H01L41/316H03H3/02
    • PROBLEM TO BE SOLVED: To provide a manufacturing method of manufacturing a resonator for realizing a "broadband Δf (a difference between the resonance frequency and the anti-resonance frequency of the resonator)" and a "high Q value". SOLUTION: A film of a piezoelectric layer is formed by the MOCVD method on a sacrificing piezoelectric layer formed by the PVD method. The film formed sacrificing piezoelectric layer formed by the PVD method is not affected by the lattice matching performance with a base film unlike the MOCVD method and has a high C axis orientation. Thus, the excellent piezoelectric layer can be obtained with high crystalinity without cracks because of the lattice matching by forming the film of the piezoelectric layer by the MOCVD method on the sacrificing piezoelectric layer film-formed by the PVD method. Thereafter the sacrificing piezoelectric layer film-formed by the PVD method is removed by a developing solution to use only the piezoelectric layer with high quality for the resonator. COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供一种用于实现“宽带Δf(谐振频率与谐振器的反谐振频率之间的差”)和“高Q值”的谐振器的制造方法。 解决方案:通过MOCVD方法在通过PVD方法形成的牺牲压电层上形成压电层的膜。 通过PVD法形成的牺牲压电层的成膜不受MOCVD法的影响,不受基膜的晶格匹配性能的影响,C轴取向较高。 因此,通过在通过PVD法形成的牺牲压电层上通过MOCVD方法形成压电层的膜的晶格匹配,可以获得具有高结晶度而没有裂纹的优异的压电层。 此后,通过PVD方法膜形成的牺牲压电层通过显影液除去,以仅使用用于谐振器的高质量的压电层。 版权所有(C)2006,JPO&NCIPI
    • 9. 发明专利
    • JPH05300738A
    • 1993-11-12
    • JP9923092
    • 1992-04-20
    • MATSUSHITA ELECTRIC IND CO LTD
    • UNO TAKASHI
    • G05F1/10H02M3/28
    • PURPOSE:To obtain the DC power supply apparatus of small size and high reliability, in which each output voltage can be controlled without requiring an element increasing a loss and the whole heat generation is reduced, in a DC power supply apparatus used as the power supply of various electronic equipments. CONSTITUTION:The series circuit of a switching element 22 and the primary winding N1 of a transformer 23 is connected with a DC power supply 21, a master output circuit composed of the rectifier and smoothing circuit of a diode 24 and capacitor 25 is connected with the secondary winding N2 of the transformer 23, and one or more auxiliary output circuits each composed of a rectifier and smoothing circuit for switching a diode 26, capacitor 27 and switching element 30 by the charge and discharge of a charge and discharge capacitor 39 are connected with the secondary winding or other winding N3. Further, when the title apparatus is constituted so that the switching element 22 on the primary side is controlled by a voltage detection circuit composed of the reference voltage source 31 and error amplifier 32 of the master output circuit, it is possible to control the voltage across the loads 35 and 36.