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1. 发明专利

JPS62162323A ELECTRONIC PARTS 失效
公开(公告)号：JPS62162323A
公开(公告)日：1987-07-18
申请号：JP457186
申请日：1986-01-13
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： OMOTEYAMA SHIGERU , IWAMOTO SHIGEYOSHI , KOTANI KAZUHIRO , IOKA MASAKAZU
IPC分类号： H01G9/004 , H01G9/04

2. 发明专利

JPH0338013A ELECTRONIC COMPONENT 失效
公开(公告)号：JPH0338013A
公开(公告)日：1991-02-19
申请号：JP17447689
申请日：1989-07-05
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KIN YASUO , IWAMOTO SHIGEYOSHI , NAKAJIMA HIDEO , OMOTEYAMA SHIGERU , SEKIYA KAZUO , SHINETSU MASAO
IPC分类号： H01G9/004 , H01G9/10 , H05K3/30 , H05K3/34
摘要： PURPOSE:To realize effective soldering by bending a pair of lead wires along the bottom surface of an insulating plate, and making tip parts protrude longer than the end surface of the insulating plate. CONSTITUTION:An insulating plate 15 is provided with a through hole 17, and a pair of lead wires 16 is inserted into said hole 17; the end portions of the wires are bent along the bottom surface of the insulating plate 15, and the tip parts 16a are made to protrude longer than the end surface of the insulating plate 15. That is, since the tips 16a of a pair of the lead wires 16 bent along the bottom surface of the insulating plate 15 are made to protrude longer than the end surface of the insulating plate 15, the temperature rise of the tips of a pair of the lead wires 16 protruding extensively becomes rapid. The temperature of pair of the lead wires 16 effectively rises, so that soldering onto a printed board can be effectively performed.

3. 发明专利

JPS62186518A ELECTRONIC PARTS 失效
公开(公告)号：JPS62186518A
公开(公告)日：1987-08-14
申请号：JP2920786
申请日：1986-02-13
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： IWAMOTO SHIGEYOSHI , OMOTEYAMA SHIGERU , IOKA MASAKAZU , KOTANI KAZUHIRO
IPC分类号： H01G9/004 , H01G9/04

4. 发明专利

JPH0338014A ELECTRONIC COMPONENT 失效
公开(公告)号：JPH0338014A
公开(公告)日：1991-02-19
申请号：JP17447789
申请日：1989-07-05
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： OMOTEYAMA SHIGERU , IWAMOTO SHIGEYOSHI , NAKAJIMA HIDEO , SEKIYA KAZUO , KIN YASUO , SHINETSU MASAO
IPC分类号： H01G9/004 , H01G9/10 , H05K3/30 , H05K3/34
摘要： PURPOSE:To realize effective soldering by making a pair of lead wires protrude outward from the bottom surface of an insulating film, and bending the lead wires along the bottom surface of an insulating plate in a state that a gap is formed between the leads and the bottom surface of the insulating plate. CONSTITUTION:A pair of leads 16 is inserted into a through-hole 18, and protrudes outward from a protruding part 17 of an insulating plate 15; the tips of the wires are bent along the bottom surface of the protruding part 17. A gap 19 is formed between the bottom surface of the insulating plate 15 and a bending part 16a of a pair of the lead wires 16. That is, a pair of the lead wires 16 and a capacitor main body 11 side are completely isolated by the gap 19. Hence the heat transmitted to a pair of the lead wires 16 is not taken away by the capacitor main body 11. Thereby the temperature of a pair of the lead wires 16 effectively rises, so that soldering onto a printed board can be effectively performed.

5. 发明专利

JPH0338012A ELECTRONIC COMPONENT 失效
公开(公告)号：JPH0338012A
公开(公告)日：1991-02-19
申请号：JP17447589
申请日：1989-07-05
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KIN YASUO , IWAMOTO SHIGEYOSHI , NAKAJIMA HIDEO , OMOTEYAMA SHIGERU , SEKIYA KAZUO , SHINETSU MASAO
IPC分类号： H01G9/004 , H01G9/10 , H05K3/30 , H05K3/34
摘要： PURPOSE:To realize effective soldering by forming a pair of lead wires inserted into a through-hole in the wavy type, and bending it along the bottom surface of an insulating plate. CONSTITUTION:An insulating plate is provided with a through-hole 17; a pair of lead wires 16 is inserted into the through-hole 17; the tips are formed in the wavy type and bent along the bottom surface of the insulating plate 15. That is, when a pair of the lead wires 16 is mounted on a printed board in order to surface-mount this electronic component 11 on the printed board, the area where the bottom of the insulating plate 15 comes into contact with a pair of the lead wires 16 becomes only a part of a pair of the lead wires. Heat transmitted to a pair of the lead wires 16 becomes difficult to be taken away by the main body of the electronic component 11. Thereby the temperature rise of a pair of the lead wires 16 becomes rapid, and effective soldering on the printed board can be realized.

6. 发明专利

JPH02263425A AL ELECTROLYTIC CAPACITOR 失效
公开(公告)号：JPH02263425A
公开(公告)日：1990-10-26
申请号：JP8544989
申请日：1989-04-04
申请人： MATSUSHITA ELECTRIC IND CO LTD , MITSUBISHI PLASTICS IND
发明人： IWAMOTO SHIGEYOSHI , OMOTEYAMA SHIGERU , YOSHIGA NORIO , WAKAYAMA YOSHIO
IPC分类号： H01G9/035 , H01G9/02 , H01G9/08
摘要： PURPOSE:To obtain a stable Al electrolytic capacitor, in which the deterioration of the efficiency of the capacitor and an internal short-circuit are not generated, even it a soldering temperature using a reflow method is a high temperature of 200 deg.C or higher by a method wherein a synthetic resin layer of a specified composition is provided on the inner surface of a metal case. CONSTITUTION:The side of the inner surface of a metal case 1 is covered with a denatured polyolefine resin layer 1' graft-copolymerized with an unsaturated carboxylic acid or its derivative through a chemical conversion treatment layer in the range of the amount of a chromate film of 5 to 150mg/m or the range of the amount of an organic titanate film of 3 to 200mg/cm . Thereby, even if the case is soldered at high temperatures of 200 deg.C or higher by a reflow method, the efficiency of a capacitor is never deteriorated at all, it becomes possible to insulate completely the inner surface of the bottomed metal case 1 and the generation of a short-circuit and a leakage current, which are caused by the shift of an electrolytic foil of a capacitor element 2 and the shift of extraction lead terminals, can be prevented.

7. 发明专利

JPS60201700A ELECTRONIC PART SERIES 失效
公开(公告)号：JPS60201700A
公开(公告)日：1985-10-12
申请号：JP5874684
申请日：1984-03-27
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： IWAMOTO SHIGEYOSHI , KURIBAYASHI TAKASHI , OMOTEYAMA SHIGERU , IOKA MASAKAZU , SAEKI KINBUN
IPC分类号： B65D73/02 , H05K13/00

8. 发明专利

JPH051970B2 失效
公开(公告)号：JPH051970B2
公开(公告)日：1993-01-11
申请号：JP2920886
申请日：1986-02-13
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KOTANI KAZUHIRO , IWAMOTO SHIGEYOSHI , OMOTEYAMA SHIGERU , IOKA MASAKAZU
IPC分类号： H01G9/004 , H01G9/04 , H01G9/08 , H01G9/10

9. 发明专利

JPH0310220B2 失效
公开(公告)号：JPH0310220B2
公开(公告)日：1991-02-13
申请号：JP2755784
申请日：1984-02-16
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MORIKAWA TAKAHIRO , NAKAJIMA HIDEO , USHIO NORIKI , OMOTEYAMA SHIGERU
IPC分类号： H01G9/10 , H01G9/00 , H01G9/004

10. 发明专利

JPH0217624A ELECTRONIC COMPONENT 失效
公开(公告)号：JPH0217624A
公开(公告)日：1990-01-22
申请号：JP16825088
申请日：1988-07-06
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： IWAMOTO SHIGEYOSHI , OGINO OSAKUNI , OMOTEYAMA SHIGERU
IPC分类号： H01G9/004 , H01G9/04 , H01G9/10
摘要： PURPOSE:To make first insertion easy and the folded tip be retained positively by making a recessed groove to be wider at the center and to be shallow in taper shape toward the outside when inserting a lead wire of electronic component in the recessed groove of an insulator provided to the upper surface of a capacitor main body. CONSTITUTION:An insulator 2 is mounted to the upper edge surface of an aluminum electrolytic capacitor main body 1 and a lead wire 3 of the main body 1 is taken out through a pair of recessed grooves 2b provided at the insulator 2. In this configuration, at the opposing tip part of the recessed groove 2, the groove width is wide and is penetrated and then the lead wire 3 can be easily inserted. Also, the groove width for enabling an inserted lead wire 3 to be folded and taken out toward the outside is made narrower gradually in taper shape and the bottom part is kept within the thickness of the insulator 2, thus gear-locking the edge part of the lead wire 3 here. In this manner, backlash and deviation in rotational direction of the capacitor main body and the insulator can be securely prevented, packaging can be made accurately, and production can be made easily and at low cost.

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