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1. 发明专利

JP2006012954A Method for manufacturing wiring board and manufacturing facility used therefor 审中-公开
标题翻译：制造接线板的方法及其使用的制造设备
公开(公告)号：JP2006012954A
公开(公告)日：2006-01-12
申请号：JP2004184726
申请日：2004-06-23
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MAEDA TADAYOSHI , OISHI JUNJI , ENDO KENJI
IPC分类号： H05K3/22 , H05K3/40
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board by which shortcircuiting between terminals becomes hard to be generated during baking of an insulating film.
SOLUTION: In a baking step 14, terminals 4 and 5 are electrically connected with a silver foil 9 and they are baked, and they are electrically isolated with each other after the baking step 14. Thus, the terminals 4 and 5 become nearly the same in potential during the baking step 14, so that shortcircuiting between the terminals 4 and 5 may be hard to be generated during the baking step 14 of the insulating layer.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于制造在绝缘膜烘烤期间端子之间短路难以产生的布线板的方法。解决方案：在烘烤步骤14中，端子4和5与银箔9电连接，并且它们被烘烤，并且在烘烤步骤14之后它们彼此电隔离。因此，端子4和5变成在烘烤步骤14期间几乎相同的电位，使得在绝缘层的烘烤步骤14期间端子4和5之间的短路可能难以产生。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2005217005A Resin applying device 有权
标题翻译：树脂应用设备
公开(公告)号：JP2005217005A
公开(公告)日：2005-08-11
申请号：JP2004019595
申请日：2004-01-28
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OISHI JUNJI
IPC分类号： B05C5/00 , B05C9/12 , B05C9/14 , H01L21/56
摘要： PROBLEM TO BE SOLVED: To uniformly apply resin on a whole semiconductor chip in short time in a resin applying device where underfill resin is applied to a gap between a substrate and the semiconductor chip which is mounted in phase down manner.
SOLUTION: Resin 4 is injected between the semiconductor chip 1 and the substrate 2, and a whole anchor block 7 rocks in cooperation with movement of a nozzle 3 by a nozzle moving means. Since capillarity can be promoted much more with the moving operation of the nozzle 3 after injection of resin 4 as a trigger by such constitution, resin 4 can uniformly be applied to the whole semiconductor chip 1 in short time.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了在基板和以相位下降的方式安装的半导体芯片之间的间隙中将树脂施加到底部填充树脂的树脂施加装置中，在短时间内将树脂均匀地涂覆在整个半导体芯片上。解决方案：在半导体芯片1和基板2之间注入树脂4，整个锚块7通过喷嘴移动装置与喷嘴3的移动配合而摇摆。由于通过这种结构注入树脂4作为触发器之后喷嘴3的移动操作可以促进毛细作用，所以树脂4可以在短时间内均匀地施加到整个半导体芯片1上。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2004342795A Light-emitting element module and its manufacturing method 审中-公开
公开(公告)号：JP2004342795A
公开(公告)日：2004-12-02
申请号：JP2003136965
申请日：2003-05-15
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KAWABE KAZUNARI , OISHI JUNJI
IPC分类号： H01L33/58 , H01L33/60 , H01L33/62 , H01L33/00
摘要： PROBLEM TO BE SOLVED: To realize light-emitting element modules in which the dispersion of places where an LED element and a spherical lens are joined, is reduced and an optic axis displacement is difficult to occur by an extremely simple constitution, and also to provide a manufacturing method for the module.
SOLUTION: When the spherical lens 3 is inserted into a circuit board 1 to which a through-hole 2 having a taper is formed, the light-emitting element module is constituted so that the optic axis of the lens 3 and the optic axis of the LED element 5 coincide while the lens 3 is fixed through a cured resin 6.
COPYRIGHT: (C)2005,JPO&NCIPI

4. 发明专利

JP2004228350A Modular component with lead 有权
标题翻译：模块化元件与引线
公开(公告)号：JP2004228350A
公开(公告)日：2004-08-12
申请号：JP2003014557
申请日：2003-01-23
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OSHIMA SHIGENORI , OISHI JUNJI , URA AKIHIKO
IPC分类号： H01L23/50
摘要： PROBLEM TO BE SOLVED: To realize a modular component with leads having a sufficient self-standing property due to its simple constitution even when the size of the component is increased.
SOLUTION: This modular component has a group of leads 4. Of the leads 4, at least two leads 4 at prescribed spots respectively have bent parts 4a and 4b formed by bending the leads 4 into chevron-like forms at their midpoints. One 4a of the bent parts 4a and 4b comes into contact with the inner peripheral wall of a substrate mounting hole 6 in a direction which is almost perpendicular to the arranging direction of the leads 4 when the part 4a is inserted into the hole 6. In addition, the other bent part 4b comes into contact with the inner peripheral wall of the substrate mounting hole 6 on the opposite side when the part 4b is inserted into the hole 6. In addition, the bent parts 4a and 4b are disposed in a vertically deviated state.
COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：即使当部件的尺寸增加时，由于其简单的结构，实现具有足够的自立性能的引线的模块化部件。解决方案：该模块化组件具有一组引线4.在引线4中，在规定点处的至少两个引线4分别具有通过在其中点处将引线4弯曲成人字形形状而形成的弯曲部分4a和4b。当部分4a插入孔6中时，弯曲部分4a和4b的一个4a与衬底安装孔6的内周壁在几乎垂直于引线4的排列方向的方向上接触。此外，当部分4b插入孔6中时，另一个弯曲部分4b在相对侧的基板安装孔6的内周壁上接触。此外，弯曲部分4a和4b布置成垂直偏离状态版权所有（C）2004，JPO＆NCIPI

5. 发明专利

JP2004111916A Packaging module, manufacturing method thereof, and electronic equipment using the same 审中-公开
公开(公告)号：JP2004111916A
公开(公告)日：2004-04-08
申请号：JP2003190934
申请日：2003-07-03
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OISHI JUNJI
IPC分类号： H05K1/02 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To miniaturize with respect to a packaging module and a manufacturing method thereof.
SOLUTION: The packaging module includes a resin main body 1 and a plurality of electronic parts 2 having a part thereof are buried. The electronic parts 2 comprises an electrode 3 exposed outside of the main body 1, and the part of this electrode 3 exposed outside the main body 1 has a connection electrode 4 by a conductive paste. Consequently, electrical and mechanical connection with the electrode of the packaging module surely done by additionally bonding the conductive paste on the electrode of a board side with easily miniaturizing without the need of a drawing electrode to be placed separately.
COPYRIGHT: (C)2004,JPO

6. 发明专利

JPH10242757A OSCILLATOR AND ITS MANUFACTURE 失效
公开(公告)号：JPH10242757A
公开(公告)日：1998-09-11
申请号：JP4192997
申请日：1997-02-26
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： OISHI JUNJI , NAGAI TAKEOCHI
IPC分类号： H03H9/02 , H03B5/32 , H03H3/02
摘要： PROBLEM TO BE SOLVED: To prevent improper oscillation. SOLUTION: The oscillator is provided with a board 1, a vibrator 2 supported to one side of the board 1, a cover 3 covering the vibrator 2 and a control element 4 that is mounted to the other side of the board 1 and controls the vibrator 2, a 1st electrode 6 is provided to one side of the board 1 and connected electrically to the vibrator 2, a 2nd electrode 8 is provided to the other side of the board 1 opposite to the 1st electrode 6 and connected electrically to the control element 4. Then a recess 9 is provided to at least one side and the other side of the board 1 on which the 1st and 2nd electrodes 6, 8 are provided and the 1st electrode 6 or the 2nd electrode 8 is provided in the recess 9.

7. 发明专利

JPH10126185A MANUFACTURE OF VIBRATOR 失效
公开(公告)号：JPH10126185A
公开(公告)日：1998-05-15
申请号：JP28049996
申请日：1996-10-23
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YAGI YUJI , OISHI JUNJI , FURUKAWA MITSUHIRO
IPC分类号： H03H9/19 , H03H3/02
摘要： PROBLEM TO BE SOLVED: To simplify the positioning of electrodes and to improve the reliability in the forming process of exciting electrodes of the vibrator used for various electric devices. SOLUTION: A recessed part 1c is formed around each vibrating part 1a of a diaphragm 1, projections 2b each having the same shape as each recessed part 1c are provided to a mask 2 for forming a pattern of exciting electrodes and they are fitted respectively together to position a mask pattern 2a of the exciting electrodes is positioned to a regular position of the vibration parts 1a. Since the patterns are positioned only with fitting of the recessed parts and the projections, positioning work is simplified, generation of dust during the work is prevented, and the yield is improved.

8. 发明专利

JPH07106905A OSCILLATOR 失效
公开(公告)号：JPH07106905A
公开(公告)日：1995-04-21
申请号：JP25045793
申请日：1993-10-06
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TSURU ZENICHI , ITAMOCHI SHINJI , OISHI JUNJI , SHIMAMURA TETSUO , TAWARA HIROSHI
IPC分类号： H03H9/10 , H03H9/05 , H03H9/13 , H03H9/19
摘要： PURPOSE:To stabilize the vibrations of a vibrator plate and also to simplify the electrode extracting configuration. CONSTITUTION:This oscillator is provided with an upper case 9 and a lower case 6 of plate shapes, and a vibrator plate 10 which is held between both cases 9 and 6. The plate 10 has a cut groove at the inside of the case holding part and on the outer circumference of the plate 10. Thus a tongue-shaped vibrating part 12 is formed and a vibrating electrode 15 is provided on the rear face side of the part 12. At the same time, the through holes 19A and 18 are formed to the case 9 or 6 corresponding to an electrode 17 which is led from the electrode 15. Then a lead-out electrode 19 is formed on the inner surfaces of both holes 19A and 18 and on the electrode 17 by the vapor deposition or sputtering through the outer surface of the case.

9. 发明专利

JPH05191144A PIEZO-OSCILLATING CIRCUIT 失效
公开(公告)号：JPH05191144A
公开(公告)日：1993-07-30
申请号：JP1952592
申请日：1992-01-08
申请人： MATSUSHITA ELECTRIC IND CO LTD , KOYO PRECISION CO LTD
发明人： KAWABE KAZUNARI , OISHI JUNJI , SAKURADA HIROTSUGU
IPC分类号： H03B5/32
摘要： PURPOSE:To perform the fine adjustment of frequency in a wide range without using a trimmer capacitor by putting a parallel circuit consisting of a variable resistor and a capacitor between the input terminal of an inverter and the capacitor. CONSTITUTION:The subject oscillating circuit consists of a feedback resistor 3 connected in parallel between the input terminals of a CMOS inverter 2, a piezoelectric vibrator 1, a stabilizing resistor 4 connected between the vibrator 1 and the inverter 2, and the oscillating capacitors 5 and 7 which are connected between the earth and the vibrator 1. The inverter 2 and the resistor 3 serve as an amplifier, and the capacitors 5 and 7 and the vibrator 1 form a feedback circuit which prescribes the oscillation frequency. Then a capacitor 8 and a variable resistor 9 which are connected between the capacitor 7 and the input terminal of the inverter 2 function as a frequency fine adjusting element respectively. The capacity varies between the input terminal of the inverter 2 and the earth with change of the resistance value of the resistor 9. Then the fine adjustment of the oscillation frequency is attained like a trimmer capacitor.

10. 发明专利

JPH0352288A PORCELAIN SUBSTRATE 失效
公开(公告)号：JPH0352288A
公开(公告)日：1991-03-06
申请号：JP18782689
申请日：1989-07-20
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： OISHI JUNJI
IPC分类号： H05K1/11 , H05K1/02 , H05K1/05
摘要： PURPOSE:To made it possible to connect the electrodes on both sides of a substrate surely as well as prevent disconnection, by providing a substrate with through-holes whose diameters change with the distance from the surface of the substrate, and making through-holes having no edge sections. CONSTITUTION:The diameter of a through hole 2 at the surface and the back of a substrate 1 is made larger than that at the center section. On this occasion, as the pressure by vacuum becomes high at the center section of the thickness of the board 1, power which absorbs conductor material becomes strong and it creeps into the inside wall section of the through-hole 2 sufficiently. This makes it possible to obtain an effect that the connection of the electrodes on both sides of the substrate is surely performed. Besides, it becomes difficult for disconnection to occur as edge sections are obtuse surfaces.

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