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1. 发明专利

JPH1144624A HOLDING METHOD IN CASE OF TENSIONING METAL THIN PLATE 失效
公开(公告)号：JPH1144624A
公开(公告)日：1999-02-16
申请号：JP20366597
申请日：1997-07-30
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ISHIKAWA TORU , FUNEMI KOJI , IHARA KIYOTAKA
IPC分类号： G01N3/04
摘要： PROBLEM TO BE SOLVED: To prevent breakage of a metal thin plate by slipping of a holding member by providing a gap between the end face of the metal thin plate and the holding member to hold the inside part of the metal thin plate when the metal thin plate is tensioned through the holding member in a prescribed direction. SOLUTION: The holding device 3 of a tension test device 1 is composed of e.g. right and left holding members (pushing member) 4, a receiving member provided downward thereof corresponding to the holding member 4, and a tension drive device pushing the holding member downward and moving outward. The holding member 4 is constituted of an elongated angular column and the like along the end face of a metal thin plate, and when the metal thin plate 2 of thickness of 50 μm or thinner is pulled outward, the end face of the holding member 4 is matched inwardly by a prescribed width (gap) (b) from the end face of the thin plate 2 to be held. Thereby even if tension is performed by force of 1/2 or larger of rupture stress of the metal thin plate 2, because large friction resistance force is developed between the corner C of the outside of the holding member 4 and the surface of the thin plate 2, a slip between the thin plate 2 and the holding member 4 does not occur and rupture does not occur. Thus, tension test can be surely performed.

2. 发明专利

JPH1071552A MINUTE PROJECTION GRINDING METHOD AND DEVICE 失效
公开(公告)号：JPH1071552A
公开(公告)日：1998-03-17
申请号：JP22527496
申请日：1996-08-27
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ISHIKAWA TORU , SHINGU KATSUKI , YASUHIRA NOBUO , ISHIMARU HIDEYUKI
IPC分类号： B24B21/00
摘要： PROBLEM TO BE SOLVED: To carry out the grinding of a minute projection surely, by preventing the remaining of the projection owing to the reduction of the sharpness of a grinding tape, in a minute projection grinding method to grind a minute projection on the surface of a substrate by contacting the grinding tape. SOLUTION: A minute projection 10 on the surface of a substrate 2 is detected in noncontacting condition, the unused part of a grinding tape 11 is fed to the grinding position of a grinding head 9, and at the same time, the grinding head 9 is moved to the position of the minute projection, and it is reciprocated to grind the minute projection 10, while the grinding resistance in the grinding operation is measured by an elasticity maintaining means 16 and a displacement gage 15. When the grinding resistance is large, the feeding of the grinding tape 11 and the process of grinding are repeated, so as to carry out the grinding surely without making the reduction of the sharpness owing to a clogging of the grinding tape 11, and the generation of a residual projection is prevented.

3. 发明专利

JP2005340502A Method for manufacturing composite substrate 审中-公开
标题翻译：制造复合基板的方法
公开(公告)号：JP2005340502A
公开(公告)日：2005-12-08
申请号：JP2004157406
申请日：2004-05-27
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： ISHIKAWA TORU
IPC分类号： H05K1/02 , H05K3/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a composite substrate for easily and precisely dividing the substrate.
SOLUTION: This method for manufacturing a composite substrate is provided with a lamination process 13 for laminating a ceramic wiring board 11 where a plurality of electronic circuits are formed, and a resin substrate 12 where a plurality of electronic circuits are formed at the lower part of the ceramic wiring board; an integration process 14 for bonding and integrating the ceramic wiring board 11 and the resin board 12 by heating/pressurizing them posterior to the lamination process 13; and a division auxiliary means formation process 16 for dividing the composite substrate into a plurality of electronic circuits posterior to the integration process 14. The division auxiliary means formation process 16 makes it easy to divide the composite substrate by a division auxiliary part 17 installed in the ceramic wiring board 11, and a division auxiliary part 18 installed on a resin substrate 12 at the lower part of the division auxiliary part 17, which is smaller than the division auxiliary part 17.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于制造复合基板的方法，用于容易且精确地分割基板。＆lt; P＆gt;解决方案：这种复合基板的制造方法具备层压用于层叠形成有多个电子电路的陶瓷配线基板11的层叠工序13，在该多个电子电路形成有多个电子电路的树脂基板12 下部陶瓷线路板; 用于通过在层压工艺13之后加热/加压陶瓷布线板11和树脂板12来结合和集成陶瓷布线板11的一体化工艺14; 以及分割辅助装置形成处理16，用于将复合基板分割成集成处理14之后的多个电子电路。分割辅助装置形成处理16使得容易地通过安装在所述复合基板中的分割辅助部分17来分割复合基板陶瓷配线基板11和分割辅助部18，分割辅助部18安装在分割辅助部17的下部的树脂基板12上，该分割辅助部18小于分割辅助部分17.版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2003179349A METHOD OF FORMING CONDUCTOR PATTERN ON MULTILAYER BOARD 审中-公开
公开(公告)号：JP2003179349A
公开(公告)日：2003-06-27
申请号：JP2001378338
申请日：2001-12-12
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ISHIKAWA TORU
IPC分类号： H05K3/10 , H05K3/22 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To obtain a multilayer board in which a conductor pattern formed between layers and an upper insulating layer and a lower insulating layer sandwiching the conductor pattern are not deformed even when a lamination treatment, a firing treatment or the like is applied. SOLUTION: In the multilayer board, a conducive layer is not arranged between a first upper insulating layer and a second lower insulating layer, and also a third insulating layer is arranged between the first upper insulating layer and the second lower insulating layer in such a way that the concentration of a pressure from the first and second insulating layers is relaxed and that the conductor layer is not deformed. COPYRIGHT: (C)2003,JPO

5. 发明专利

JPH10180769A MOLDING DIE FOR DISCONTINUOUS SURFACE LENS 失效
公开(公告)号：JPH10180769A
公开(公告)日：1998-07-07
申请号：JP34921796
申请日：1996-12-27
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ISHIKAWA TORU , SHINGU KATSUKI , YASUHIRA NOBUO
IPC分类号： B29C33/76 , B29L11/00
摘要： PROBLEM TO BE SOLVED: To provide a molding die for a discontinuous surface lens wherein all die split blocks can be held so as to be combined with one another at set positions with a high degree of a accuracy, eliminating completely the influence due to burrs, dusts, and inferior perpendicularly of end surfaces of the blocks themselves. SOLUTION: The molding die for a discontinuous surface lens includes a main die part 22 for forming the surface of a lens and an auxiliary die part 9 which is coupled with the part 22 to form a molding space therebetween. The main die part 22 is formed to have such construction that a plurality of spherical height adjusting spacers 27 are disposed on the inner bottom surface of a stationary frame 10 for assembling and a plurality of die split blocks 11, in each of which a small molding plane 11a so formed as to be opposed to each mirror surface of a lens is formed on one end surface of an axial body, are inserted into the frame 10, in a predetermined arrangement, so as to be mounted individually on the spacers 27. Each of the blocks 11 is supported by the spacer 27 having a diameter corresponding to dimensional error in axial length of each of the blocks to hold each plane 11a at a predetermined relative position.

6. 发明专利

JP2003131256A MANUFACTURING METHOD FOR ACTIVE MATRIX SUBSTRATE 审中-公开
公开(公告)号：JP2003131256A
公开(公告)日：2003-05-08
申请号：JP2001324716
申请日：2001-10-23
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： OKA HITOSHI , ISHIKAWA TORU , IWASAKI KATSUO
IPC分类号： G02F1/1368
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method for forming a plurality of contact holes having depths different from each other efficiently and with good reproducibility. SOLUTION: The contact holes having depths different from each other are simultaneously formed by etching utilizing the differences between etching speeds of insulating films 3 and 5 to be etched films and base conductive body films 2 and 4 of the contact holes, respectively.

7. 发明专利

JPH10217089A GRINDING HEIGHT POSITION SETTING METHOD FOR GRINDING DEVICE 失效
公开(公告)号：JPH10217089A
公开(公告)日：1998-08-18
申请号：JP1693797
申请日：1997-01-30
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ISHIKAWA TORU , ISHIMARU HIDEYUKI , YASUHIRA NOBUO , UCHIDA HARUTO , KASAI KENJI
IPC分类号： B24B49/08 , B24B21/00
摘要： PROBLEM TO BE SOLVED: To provide a grinding height position setting method for grinding device capable of performing correct setting by preventing damage to a grinding head when a sensor height original point to determine a grinding height position is set. SOLUTION: Before starting a grinding operation, a contact rod 10 provided with a grinding tape 8 is brought in contact with a correction table 15 so as to set a height of sensors 3a and 3b to detect the surface of the correction table 15 as a height original point. Also, because the correction table 15 is formed so that a table 16 comprising a rigid body is supported by an elastic supporting body 14, it is sunk according to a pressing force at the time of contact with the contact rod 10. As a result, the contact rod 10 is not damaged. In addition, because it is brought in contact by point contact with the top end of the contact rod 10, accurate height original point can be set.

8. 发明专利

JP2008141082A Manufacturing method of ceramic multilayer substrate 有权
标题翻译：陶瓷多层基板的制造方法
公开(公告)号：JP2008141082A
公开(公告)日：2008-06-19
申请号：JP2006327744
申请日：2006-12-05
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： ISHIKAWA TORU , SHIGEMI ATSUSHI
IPC分类号： H05K3/46 , H05K1/02 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a ceramic substrate capable of reducing chipping of child substrates when dividing the ceramic substrate by dicing.
SOLUTION: The manufacturing method of a ceramic multilayer substrate includes a process for preparing a ceramic green sheet, a process for forming a via hole in which a conductive paste is injected and for forming a plurality of holes on a dicing division line for dividing the ceramic green sheet, a process for forming a via by injecting conductive paste into the via hole, a process for forming a specified conductor pattern on the ceramic green sheet using the conductive paste, a process for forming a laminate by stacking a plurality of ceramic green sheets, a process for baking the laminate to obtain a ceramic multilayer substrate assembly, and a process for dividing the ceramic multilayer substrate assembly into a plurality of ceramic multilayer substrates by dicing.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够通过切割来分割陶瓷基板时能够减少儿童基板的碎裂的陶瓷基板的制造方法。＆lt; P＆gt;解决方案：陶瓷多层基板的制造方法包括制备陶瓷生片的方法，形成通孔的方法，其中注入导电浆料并在切割分割线上形成多个孔分割陶瓷生片，通过将导电膏注入到通孔中形成通孔的方法，使用导电膏在陶瓷生片上形成规定的导体图案的工序，通过层叠多个陶瓷生片，用于烘烤层压体以获得陶瓷多层基板组件的方法，以及通过切割将陶瓷多层基板组件分割成多个陶瓷多层基板的工艺。版权所有（C）2008，JPO＆INPIT

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