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1. 发明专利

JP2012149392A Humidity conditioning building material 审中-公开
标题翻译： HUMIDITY CONDITIONING建筑材料
公开(公告)号：JP2012149392A
公开(公告)日：2012-08-09
申请号：JP2011007048
申请日：2011-01-17
申请人： Lixil Corp , 株式会社Lixil
发明人： IMURA TAKEO , TOBE SHINTARO , YOSHINAGA ISAO
IPC分类号： E04B1/64 , C04B41/83 , C04B41/85 , C04B41/86
摘要： PROBLEM TO BE SOLVED: To provide a humidity conditioning building material having excellent humidity conditioning performance and antifouling properties.SOLUTION: A humidity conditioning building material has a body with an antifouling surface layer containing a fluorine based oil-repellent agent and inorganic particulates. Preferably the inorganic particulates include at least one of colloidal silica, alumina sol, and fumed silica. The surface of the body of the humidity conditioning building material is thinly glazed, and the antifouling layer is formed thereon.
摘要翻译：要解决的问题：提供具有优异的调湿性能和防污性能的调湿建筑材料。调湿建筑材料具有包含氟基防油剂和无机颗粒的防污表面层的主体。优选地，无机颗粒包括胶体二氧化硅，氧化铝溶胶和煅制二氧化硅中的至少一种。调湿建筑材料的主体的表面是薄的，并且在其上形成防污层。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2011219578A Joint material for tile and tile panel 审中-公开
标题翻译：面板和面板的联合材料
公开(公告)号：JP2011219578A
公开(公告)日：2011-11-04
申请号：JP2010088692
申请日：2010-04-07
申请人： Lixil Corp , 株式会社Lixil
发明人： IMURA TAKEO , SAKAI KAZUKI
IPC分类号： C09K3/10 , E04F13/02
摘要： PROBLEM TO BE SOLVED: To provide a joint material for tile having tile-holding function in case of fire hazard and to provide a tile panel produced by using the joint material.SOLUTION: The joint material for tile contains a resin composition and aggregate, wherein at least a part of the aggregate is glass frit. Preferably, the glass frit has a softening point of 250-700°C and an average particle diameter of 1-100 μm. There is also provided the tile panel obtained by grouting the joint material for tile in a joint gap to a thickness of ≥3 mm.
摘要翻译：要解决的问题：提供一种在具有火灾危险的情况下具有瓦片保持功能的瓦片接头材料，并提供通过使用接头材料制造的瓦片板。解决方案：瓦片用接头材料含有树脂组合物和骨料，其中聚集体的至少一部分为玻璃料。优选玻璃料的软化点为250-700℃，平均粒径为1-100μm。还提供了通过在关节间隙中注入厚度≥3mm的瓷砖接合材料获得的瓦片板。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2011202066A Joint filling material for tile, and tile panel 审中-公开
标题翻译：联合填充材料，面板和面板
公开(公告)号：JP2011202066A
公开(公告)日：2011-10-13
申请号：JP2010071849
申请日：2010-03-26
申请人： Lixil Corp , 株式会社Lixil
发明人： IMURA TAKEO
IPC分类号： C09K3/10 , C08G59/42
摘要： PROBLEM TO BE SOLVED: To provide a joint filling material for a tile which is hard to generate nitrogen oxide and also has a small combustion heat quantity even in the event of fire; and to provide a tile panel prepared by using the material.SOLUTION: The joint filling material for a tile comprising an epoxy resin composition and a curing agent composition added to the epoxy resin composition is characterized in that the curing agent of the curing agent composition is at least one selected from methyltetrahydrophthalic acid anhydride, methylhexahydrophthalic anhydride, methylnadic acid anhydride, hydrogenated methylnadic acid anhydride and trialkyltetrahydrophtalic acid anhydride. The tile panel is prepared by filling a joint gap with a joint material containing the joint filling material.
摘要翻译：要解决的问题：提供一种难以产生氮氧化物的瓦片的接合填充材料，即使在发生火灾的情况下也具有小的燃烧热量; 并提供通过使用该材料制备的瓦片板。解决方案：包含环氧树脂组合物和加入到环氧树脂组合物中的固化剂组合物的瓦片接头填充材料的特征在于固化剂组合物的固化剂为选自甲基四氢邻苯二甲酸酐，甲基六氢邻苯二甲酸酐，甲基降冰片烯酸酐，氢化甲基牛磺酸酐和三烷基四氢邻苯二甲酸酐中的至少一种。通过用包含接合填充材料的接合材料填充接合间隙来制备瓦片板。

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