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1. 发明专利

JP2014166665A Multi-directional working method and multi-directional working wire saw 有权
标题翻译：多方向工作方法和多方向工作线
公开(公告)号：JP2014166665A
公开(公告)日：2014-09-11
申请号：JP2013039307
申请日：2013-02-28
申请人： Komatsu Ntc Ltd , コマツNtc株式会社
发明人： TANIZAKI HIROSHI , KAWAZU TOMOYUKI , MATSUDA AKIHIRO
IPC分类号： B24B27/06
摘要： PROBLEM TO BE SOLVED: To enable a wire to be supported by a plurality of guide rollers with the direction of a pair of wire-supporting guide rollers unchanged when the machine-feeding direction of a workpiece is to be changed.SOLUTION: In a wire saw 2 that machine-feeds a workpiece 6 on an XY table 5 in the X direction and Y direction with respect to a running wire 4 that spans a pair of guide rollers 3 to cut the workpiece 6 with the wire 4, a plurality of guide rollers 17 are arranged for back and forth movements around the wire 4 at each position for clamping the workpiece 6 to make the guide rollers 17 facing the machine-feeding direction move to a position of circumscription with the wire 4 in accordance with changes in the machine-feeding direction of the workpiece 6 when machine-working to cut the workpiece 6, so that the wire 4 is supported with the post-movement guide rollers 17 from a direction facing the machine-feeding direction.
摘要翻译：要解决的问题：当要改变工件的进给方向时，可以使多个导辊的导线由一对导丝支承导辊的方向保持不变而变化。锯机2相对于跨过一对导辊3的行进线4在X方向和Y方向上将工件6机械馈送在XY工作台5上，以用线4切割工件6，多个导向件辊17布置用于在每个位置围绕线4进行往复运动，用于夹紧工件6，使得面向机器进给方向的导辊17根据机器的变化移动到与线4相隔的位置在切割工件6的机器加工时，工件6的进给方向，使得线4由与移动机构相对的方向的方向由后移动导辊17支撑。

2. 发明专利

JP2014113643A Workpiece table for wire saw, and workpiece-slicing method 审中-公开
标题翻译：电线表工作台和工件切片方法
公开(公告)号：JP2014113643A
公开(公告)日：2014-06-26
申请号：JP2012266973
申请日：2012-12-06
申请人： Komatsu Ntc Ltd , コマツNtc株式会社
发明人： TAKAHASHI MASAAKI , KAWAZU TOMOYUKI
IPC分类号： B24B27/06 , B28D5/04 , B28D7/04
摘要： PROBLEM TO BE SOLVED: To provide a workpiece table for a wire saw and a workpiece-slicing method, in which wafers sliced from a workpiece can be properly made into sheets.SOLUTION: A workpiece table 29 is mounted in a wire saw while being adhered to a workpiece 28, for slicing the workpiece 28 consisting of an ingot. An end surface 321 directed to a direction different from a slice plane 292 is formed on a workpiece adhering surface 291. When the workpiece 28 is sliced, the workpiece table 29 is mounted in the wire saw while being adhered to the workpiece 28, and the workpiece 28 is cut up to a portion of the end surface 321 of the workpiece table 29 by a wire 22 of the wire saw. Then, after the cutting, the workpiece table 29 is cut in a direction different from the workpiece cutting direction.
摘要翻译：要解决的问题：提供一种用于线锯的工作台和工件切片方法，其中从工件切片的晶片可以适当地制成片材。解决方案：工件台29在粘合时安装在线锯中到工件28，用于切割由锭组成的工件28。在工件附着面291上形成有朝向与切片面292不同的方向的端面321.当工件28切片时，工件台29被粘接在工件28上而安装在线锯上，工件28通过线锯的导线22被切割成工件台29的端面321的一部分。然后，在切割之后，沿与工件切割方向不同的方向切割工件台29。

3. 发明专利

JP2014042956A Method of reducing undulation on wafer surface and device thereof 有权
标题翻译：减少对表面的影响的方法及其装置
公开(公告)号：JP2014042956A
公开(公告)日：2014-03-13
申请号：JP2012186301
申请日：2012-08-27
申请人： Komatsu Ntc Ltd , コマツNtc株式会社
发明人： TAMAKI KOJI , KAWAZU TOMOYUKI , TANIZAKI HIROSHI
IPC分类号： B24B27/06 , B24B47/20 , B28D5/04
摘要： PROBLEM TO BE SOLVED: To positively reduce surface waviness of a wafer after the cutting, by using a wire with the bonded abrasive of a wire saw.SOLUTION: A wire saw 2 is provided for cutting a semiconductor ingot 6 as a large number of wafers, by feeding and moving the semiconductor ingot 6 in the cut direction to a row of wire 3 with bonded abrasives. In a process for extracting the wafers from the wire row of the wire 3 with the bonded abrasives after completion of cutting the wafers, a top portion of waviness of the wafer surface is scraped off by providing a relative rocking motion between the wafers and the wire 3 with the bonded abrasives, while providing a traveling motion to the wire 3 with the bonded abrasives.
摘要翻译：要解决的问题：通过使用具有线锯的粘合磨料的线来积极地减少切割后的晶片的表面波纹。解决方案：提供线锯2，用于切割作为大量晶片的半导体锭6 通过将半导体锭6沿切割方向进给并移动到具有粘合磨料的一排丝线3上。在完成切割晶片之后用粘合的研磨剂从线材3的线列提取晶片的过程中，通过在晶片和线之间提供相对的摆动来刮除晶片表面波纹的顶部， 3与粘合的研磨剂一起，同时使用粘结的研磨剂向丝线3提供行进运动。

4. 发明专利

JP2014188649A Pallet for wire saw 审中-公开
标题翻译：钢丝绳
公开(公告)号：JP2014188649A
公开(公告)日：2014-10-06
申请号：JP2013068457
申请日：2013-03-28
申请人： Komatsu Ntc Ltd , コマツNtc株式会社
发明人： TANIZAKI HIROSHI , MATSUDA AKIHIRO , KAWAZU TOMOYUKI
IPC分类号： B24B27/06
摘要： PROBLEM TO BE SOLVED: To provide a pallet for a wire saw, which enables a workpiece to be conveyed depending on each processing step in the state of being loaded on the pallet, when the workpiece is processed by the wire saw.SOLUTION: A pallet for a wire saw includes a plurality of workpiece holding parts 21, a pallet base 22 for supporting the plurality of workpiece holding parts 21 in the state of laying them out in a line, and a connection part 23 for connecting the adjacent workpiece holding parts 21 together. The pallet base 22 allows movement of the workpiece holding part 21 in the direction of arrangement of the plurality of workpiece holding parts 21, and the connection part 23 is configured to be capable of changing a distance between the adjacent workpiece holding parts 21.
摘要翻译：要解决的问题：提供一种用于线锯的托盘，该托盘能够在加工在托盘上的状态下根据加工步骤进行运输，当工件被线锯加工时。托盘线锯包括多个工件保持部21，用于将多个工件保持部21以线状布置的状态支撑的托板基座22以及用于连接相邻的工件保持部21的连接部23 一起。托盘基座22允许工件保持部件21沿着多个工件保持部件21的布置方向移动，并且连接部件23构造成能够改变相邻的工件保持部件21之间的距离。

5. 发明专利

JP2014133273A Multi-spindle processing wire saw system 有权
标题翻译：多主轴处理线系统
公开(公告)号：JP2014133273A
公开(公告)日：2014-07-24
申请号：JP2013001640
申请日：2013-01-09
申请人： Komatsu Ntc Ltd , コマツNtc株式会社
发明人： TAKAHASHI MASAAKI , SHIMADA HITOSHI , MAGOTA SEIICHI , KAWAZU TOMOYUKI
IPC分类号： B24B27/06 , B28D5/04
摘要： PROBLEM TO BE SOLVED: To make it possible to flexibly deal with setting of a workpiece processing direction, a workpiece type, and various processing methods in wire saw processing.SOLUTION: A multi-spindle wire saw system 1 includes: an industrial robot 2 including a chuck 11 holding a workpiece 6 by tip ends of robot arms 7, 8, 9, and 10, and capable of multi-spindle controlling the chuck 11 movably and rotatably depending on motions of the robot arms 7, 8, 9, and 10; a wire saw 3 provided within an operating range of the industrial robot 2, and processing the workpiece 6 by running of a wire 26; a measuring instrument 4 provided within the operating range of the industrial robot 2, and measuring an azimuth/direction of the workpiece 6; and a robot control device 5 controlling a motion of the industrial robot 2, and identifying the azimuth/direction of the workpiece 6 on the basis of an output signal from the measuring instrument 4.
摘要翻译：要解决的问题：使得可以灵活地处理线锯加工中的工件加工方向，工件类型和各种加工方法的设置。解决方案：多主轴线锯系统1包括：工业机器人2，包括夹具11，其通过机器人手臂7,8,9,10的末端保持工件6，并且能够根据机器人手臂7,8,9,10的运动可移动地和可旋转地多轴地控制卡盘11 ; 设置在工业机器人2的工作范围内的线锯3，通过线26的运转来处理工件6; 设置在工业机器人2的工作范围内的测量仪器4，测量工件6的方位/方向; 以及控制工业机器人2的运动的机器人控制装置5，并且基于来自测量仪器4的输出信号来识别工件6的方位/方向。

6. 发明专利

JP2014087911A Workpiece cutting method by wire saw 有权
标题翻译：通过线锯工件切割方法
公开(公告)号：JP2014087911A
公开(公告)日：2014-05-15
申请号：JP2012240463
申请日：2012-10-31
申请人： Komatsu Ntc Ltd , コマツNtc株式会社
发明人： KAWAZU TOMOYUKI , TANIZAKI HIROSHI , MATSUDA AKIHIRO
IPC分类号： B24B27/06 , B28D5/04 , B28D7/04 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a workpiece cutting method by wire saw which can prevent generation of breakage or crack to a wafer.SOLUTION: A wire 12 is wound by plural cycles between plural rollers for processing 11. By rotation of the rollers for processing 11, by the wire 12 running between the rollers for processing 11, a workpiece 15 supported on a support plate 14 is cut. On an outside surface of a cutting completion side of the workpiece 15, a hard outside layer 17 is provided. The hard outside layer 17 is harder than adhesive.
摘要翻译：要解决的问题：提供一种能够防止产生断裂或裂纹的线锯的工件切割方法。解决方案：线12在多个加工辊11之间以多个循环缠绕。通过旋转辊进行加工如图11所示，通过在处理用辊11之间延伸的线12，切断支撑在支撑板14上的工件15。在工件15的切割完成侧的外表面上设置硬质外层17。硬外层17比粘合剂硬。

7. 发明专利

JP2014060295A Processing method of wafer surface and wire saw capable of processing wafer surface 有权
标题翻译：加工表面的表面和线表面处理方法
公开(公告)号：JP2014060295A
公开(公告)日：2014-04-03
申请号：JP2012204952
申请日：2012-09-18
申请人： Komatsu Ntc Ltd , コマツNtc株式会社
发明人： TAKAHASHI MASAAKI , TANIZAKI HIROSHI , KAWAZU TOMOYUKI , TAMAKI KOJI
IPC分类号： H01L21/304 , B24B27/06 , B28D5/04
摘要： PROBLEM TO BE SOLVED: To improve the quality of wafer surface by processing the cut surface of a wafer positively by using a wire of fixed abrasive system, after cutting a semiconductor ingot as a large number of wafers.SOLUTION: By utilizing a traveling motion of a wire of fixed abrasive system, a semiconductor ingot 11 is fed in the cutting direction for a cutting area 2c of the wire 2, and the semiconductor ingot 11 is cut as a large number of wafers 11a by a wire saw 1. In a step of pulling out the wafer 11 from the wire 2, the griding zone 2b of the wire 2 is guided to the cutting area 2c, the wafer 11a is pulled out from the wire 2 while giving traveling motion to the wire 2, and a crack layer or the protrusion 11b of undulation in a cutting mark on the wafer surface are removed by the grinding action of the griding zone 2b of the wire 2.
摘要翻译：要解决的问题：通过使用固定研磨系统的丝线，在切割半导体晶锭作为大量晶片之后，通过使用固定研磨系统的线来正确地加工晶片的切割表面来提高晶片表面的质量。解决方案：通过利用固定研磨系统的线，半导体锭11沿着切割方向被供给到线2的切割区域2c，并且通过线锯1将半导体锭11切割成大量的晶片11a。在步骤从导线2拉出晶片11，将导线2的磨削区域2b引导到切割区域2c，同时向线材2提供行进运动的同时将晶片11a从线材2拉出，并且将裂纹层或者通过线2的磨削区域2b的磨削动作来除去晶片表面上的切割标记中的起伏突起11b。

8. 发明专利

JP2014188650A Wire saw and processing method of using wire saw 审中-公开
标题翻译：使用线锯的线锯和加工方法
公开(公告)号：JP2014188650A
公开(公告)日：2014-10-06
申请号：JP2013068458
申请日：2013-03-28
申请人： Komatsu Ntc Ltd , コマツNtc株式会社
发明人： TANIZAKI HIROSHI , MATSUDA AKIHIRO , KAWAZU TOMOYUKI
IPC分类号： B24B27/06
摘要： PROBLEM TO BE SOLVED: To provide a wire saw and a processing method of using the wire saw, capable of efficiently processing a work into a plurality of predetermined shaped works by dividing and cutting a work, while maintaining wire tension required for processing.SOLUTION: A wire saw 10 comprises: a first cutting part 50 for simultaneously cutting and dividing a work W into a plurality of primary cutting works 15 by dividing it in one direction; and a second cutting part 70 for providing a plurality of secondary cutting works 16 by simultaneously cutting two sides of an angle different from two sides cut by the first cutting part 50 so that the plurality of primary cutting works 15 become a predetermined shape by oppositely arranging a pair of tension rollers 72A and 72B for supporting a second wire 75 at respective intervals by expanding a distance between the plurality of primary cutting works 15.
摘要翻译：要解决的问题：提供一种线锯和使用该线锯的加工方法，其能够通过分割和切割加工而有效地将工件加工成多个预定的成形工件，同时保持加工所需的线张力。解决方案：线锯10包括：第一切割部50，用于通过在一个方向上分割工件W同时切割并分割成多个主切割工件15; 以及第二切割部70，用于通过同时切割与第一切割部50切割的两侧不同的角度的两侧来提供多个次切割工件16，以使得多个主切割工件15通过相对布置成为预定形状一对张紧辊72A和72B，用于通过扩大多个主切割工件15之间的距离来以相应的间隔支撑第二线75。

9. 发明专利

JP2014087902A Method for processing grooves for roller with grooves for wire saw 有权
标题翻译：用于处理用于钢丝绳的滚子的滚轮的方法
公开(公告)号：JP2014087902A
公开(公告)日：2014-05-15
申请号：JP2012240210
申请日：2012-10-31
申请人： Komatsu Ntc Ltd , コマツNtc株式会社
发明人： KAWAZU TOMOYUKI , ITO MASANORI
IPC分类号： B24B27/06
摘要： PROBLEM TO BE SOLVED: To realize machining of grooves having an ideal configuration by accurately adjusting grooves on a roller with grooves to a wire with fixed abrasive grain used in a wire saw without using a specific device for machining grooves.SOLUTION: Machining objects are a plurality of rollers 6, 7 with grooves which have been subjected to machining of V-grooves. The rollers 6, 7 with grooves are attached to a wire saw 1. A wire 10 with fixed abrasive grain is wound in a spiral at a low tension between the rollers 6, 7 with grooves along with a large number of V-grooves 8, 9 on each of the rollers 6, 7 with grooves. The rollers 6, 7 with grooves are rotated at different speed of rotation so that difference in speed occurs between the rotation speed of each of the rollers 6, 7 with grooves and traveling speed of the wire 10 with the fixed abrasive grain, resulting in formation of U-grooves 12, 13 on V-grooves 8, 9 due to grinding action by the wire 10 with the fixed abrasive grain.
摘要翻译：要解决的问题：通过在具有凹槽的滚子上精确调节具有凹槽的凹槽的槽来实现对具有理想结构的凹槽的加工，该线材具有用于线锯中的固定磨粒，而不使用用于加工凹槽的特定装置。解决方案：加工对象是多个辊6,7具有已经经过V槽加工的槽。具有槽的辊6,7连接到线锯1.具有固定磨粒的线10在辊6,7之间以低张力卷绕成螺旋形，并带有大量V形槽8，在每个具有凹槽的辊6,7上。具有凹槽的滚子6,7以不同的转速旋转，使得每个滚筒6,7的旋转速度与槽之间出现差异，并且导线10与固定的磨料颗粒的移动速度发生差异，导致形成的U形槽12,13在V形槽8,9上，由于线10与固定的磨料颗粒的磨削作用。

10. 发明专利

JP2012236259A Machining condition setting method of wire saw 有权
标题翻译：线锯加工条件设定方法
公开(公告)号：JP2012236259A
公开(公告)日：2012-12-06
申请号：JP2011107143
申请日：2011-05-12
申请人： Komatsu Ntc Ltd , コマツNtc株式会社
发明人： ITO MASANORI , KAWAZU TOMOYUKI
IPC分类号： B24B27/06
摘要： PROBLEM TO BE SOLVED: To automatically set numerical data suited to a machining condition, in a control device by automatic calculation by reducing operator's input work and inputting numerical values of basic machining conditions when determining machining conditions.SOLUTION: The wire saw 1 winds a wire 2 among a plurality of main rollers 6 in a multiple manner, presses a workpiece 14 to the wire 2 in a reciprocating state to cut the workpiece 14 into many plate-like bodies having predetermined thicknesses, and forms a wafer. Necessary machining conditions are input, and the feeding distance and returning distance of the wire 2 at one cycle are calculated based on the machining conditions by a plurality of calculating formulas. The input machining conditions and the calculated feeding distance and returning distance are automatically set in the control device.
摘要翻译：要解决的问题：在确定加工条件时，通过减少操作人员的输入工作和输入基本加工条件的数值，自动设定适合于加工条件的数值数据，在控制装置中进行自动计算。解决方案：线锯1以多个方式在多个主辊6之间缠绕线材2，以往复状态将工件14按压到线材2上，将工件14切割成具有预定的多个板状体厚度并形成晶片。输入必要的加工条件，并且通过多个计算公式，基于加工条件计算一个周期的线2的进给距离和返回距离。输入加工条件和计算的进给距离和返回距离在控制装置中自动设置。版权所有（C）2013，JPO＆INPIT

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