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1. 发明专利

JP2004237311A Heat exchanger and method for manufacturing it 审中-公开
公开(公告)号：JP2004237311A
公开(公告)日：2004-08-26
申请号：JP2003028562
申请日：2003-02-05
申请人： Komatsu Ltd , 株式会社小松製作所
发明人： OKUBO HIDEAKI , NISHIDE TAKESHI , TAKECHI HIROAKI , TAKAHASHI NORIO
IPC分类号： F28F1/00 , B21D53/06 , F28F1/02
摘要： PROBLEM TO BE SOLVED: To provide a pipe for providing a heat exchanger excellent in heat exchange efficiency from a different viewpoint from a conventional method.
SOLUTION: A heat exchanging pipe 1 is substantially constituted into a planar shape by bending a pipe consisting of a specified material ( the metal of aluminum, for example, or the like ) into a serpentine shape ( concretely a meandered shape ). The heat exchanging pipe 1 has main parts 3 and bending parts 5 alternately and continuously and is flattened so that a clearance generated between at least one main part 3 and an other main part 3 adjacent in the direction across the longitudinal direction is reduced.
COPYRIGHT: (C)2004,JPO&NCIPI

2. 发明专利

JP2004020007A Electronic temperature control cabinet 审中-公开
公开(公告)号：JP2004020007A
公开(公告)日：2004-01-22
申请号：JP2002173831
申请日：2002-06-14
申请人： Komatsu Ltd , 株式会社小松製作所
发明人： OKUBO HIDEAKI , ONISHI TETSUO , TACHIBANA HIDEAKI , SUGIHARA TAKUMI
IPC分类号： F25D11/00 , F25D11/02 , H01L23/36 , H01L23/38 , H01L23/427 , H01L35/28
CPC分类号： F28D15/0266
摘要： PROBLEM TO BE SOLVED: To provide an electronic refrigerator capable of efficient cooling by a thermoelectric conversion element. SOLUTION: This electronic refrigerator cools the inside of a chamber by at least one thermoelectric conversion element module 19. The electronic refrigerator has first and second thermal equalizer plates 15, 16. The first thermal equalizer plate 15 and the second thermal equalizer plate 16 have larger areas than electrode faces of the thermoelectric conversion element module 19. One end part of the second thermal equalizer plate 16 is disposed opposite to a heat radiation part 17 of the refrigerator, while a heat radiation side electrode 19a of the thermoelectric conversion element module 19 is fixedly provided in the other end part. The first soaking plate 15 is connected to a heat absorption side electrode face 19b of the thermoelectric conversion element module 19 in a heat transfer state, and at least one part is faced to a cooling air introduction part 12 inside the chamber. Preferably, at least the first thermal equalizer plate 16 has a heat pipe structure. COPYRIGHT: (C)2004,JPO

3. 发明专利

JP2003337626A Fluid temperature adjusting device 有权
标题翻译：流体温度调节装置
公开(公告)号：JP2003337626A
公开(公告)日：2003-11-28
申请号：JP2003040492
申请日：2003-02-19
申请人： Komatsu Ltd , 株式会社小松製作所
发明人： OKUBO HIDEAKI , KUBOTA KAZUHIKO
IPC分类号： F16B5/02 , G05D23/00 , H01L21/306
CPC分类号： F28F3/12 , F28D2021/0077
摘要： PROBLEM TO BE SOLVED: To provide a fluid temperature adjusting device for fluid which maintains high sealing performance in a heat transfer chamber and accurately controls the fluid temperature, even in an environment which temperature cycle is repeated by cooling and heating. SOLUTION: The device includes a heat transfer block 1, which prepares at least one inflow opening and one outflow opening of fluid and a concave part, that forms a part of the heat transfer room 10 adjusting the temperature of the fluid buy passing of the fluid; a heat transfer block 2 which forms the heat transfer room by covering the concave part of the heat transfer block; a holding part 60 which is a holding part for holding so that a point of contact between the heat transfer block and a heat transfer board is stuck tightly, and which holds the heat transfer block and the heat transfer board using an elastic body so as to prevent plastic deformation of the heat transfer block by the expansion and contraction of the elastic body, following thermal expansion or contraction of the heat transfer block; and a temperature-adjusting part 50, which conduct heat exchange between the fluid passing the heat transfer room via the heat transfer board. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：即使在通过冷却和加热重复该温度循环的环境中，提供一种用于流体的流体温度调节装置，其在传热室中保持高密封性能并精确地控制流体温度。解决方案：该装置包括传热块1，该传热块1准备流体和至少一个流入开口和一个流出开口以及凹入部分，其形成传热室10的一部分，以调节流体通过的温度的流体; 传热块2，其通过覆盖传热块的凹部形成传热室; 作为用于保持传热块和传热板之间的接触点的保持部的保持部60紧贴，并且使用弹性体保持传热块和传热板，从而通过弹性体的膨胀和收缩，传热块的热膨胀或收缩后，防止传热块的塑性变形; 以及温度调节部件50，其通过传热板在通过传热室的流体之间进行热交换。版权所有（C）2004，JPO

4. 发明专利

JP2006053075A Temperature measuring device and substrate for temperature measurement 有权
标题翻译：温度测量装置和温度测量用基板
公开(公告)号：JP2006053075A
公开(公告)日：2006-02-23
申请号：JP2004235499
申请日：2004-08-12
申请人： Komatsu Ltd , 株式会社小松製作所
发明人： SAIBI KATSUO , OSAWA AKIHIRO , WAKAI HIDEYUKI , OKUBO HIDEAKI
IPC分类号： G01K7/18 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To precisely measure the temperature of a semiconductor wafer on a temperature adjustment stage.
SOLUTION: A film temperature sensor 600 is stuck on the surface of the semiconductor wafer 601 for the temperature measurement placed on the temperature adjustment stage 400. The film temperature sensor 600 is formed of a film made of an insulation material, wherein a thin film-like sensor part for measuring the temperature, a thin film-like lead part for transmitting the temperature information sensed by the sensor part to the outside, and a terminal part for connecting the lead part with an external device are integrally formed on the film or therein.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：精确测量温度调节级上的半导体晶片的温度。解决方案：薄膜温度传感器600粘附在半导体晶片601的表面上，用于放置在温度调节台400上的温度测量。薄膜温度传感器600由绝缘材料制成的薄膜形成，其中用于测量温度的薄膜状传感器部分，用于将由传感器部分感测的温度信息传递到外部的薄膜状引线部分和用于将引线部分与外部装置连接的端子部分一体地形成在电影或其中。版权所有（C）2006，JPO＆NCIPI

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