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    • 4. 发明专利
    • Light-resistant polyamide molding
    • 耐光聚酰胺模塑
    • JPS619457A
    • 1986-01-17
    • JP12988284
    • 1984-06-22
    • Kanebo LtdKanebo Synthetic Fibers Ltd
    • YAMANAKA TAKAOITONAGA KOUJIICHIHASHI KUNIOMURATA TAROUNOHARA SABUROU
    • C08L77/00C08K3/34C08K5/10C08K13/02C08L71/02
    • PURPOSE:A polyamide molding which maintains light resistance persistently for a long time and comprises solid particles of a zeolite retaining copper ions, a vehicle, and a polyamide. CONSTITUTION:0.005-10wt% solid particles of a zeolite (a) consisting of, for example, a powdered A-type zeolite having a specific surface of 150m /g or greater, a mol ratio SiO2/Al2O3 of 14 or greater, and the particle diameter of 20mum or smaller are allowed to undergo ion exchange with a solution of CuSO4, etc. (b) to produce a copper-zeolite (A) retaining 0.001-0.5wt%, based on a molding, copper ions. Component A is kneaded with a vehicle (B) having a viscosity of 500-900cP (at 75 deg.C) and little reactivity with component C (e.g. diethylene glycol adipate) to give a slurry, which is added to a melted polyamide (C) (e.g. nylon 6) and mixed to disperse uniformly. This mixture is molded to give the titled molding in the form of particle, film, fiber, pipe, etc.
    • 目的:长时间保持耐光性的聚酰胺成型体,其包含保持铜离子,载体和聚酰胺的固体颗粒。 构成:0.005〜10重量%的由例如比表面积为150m 2 / g以上的粉末状A型沸石,SiO 2 / Al 2 O 3的摩尔比为14以上的沸石(a)的固体颗粒 ,并使20μm以下的粒径与CuSO 4等的溶液进行离子交换。(b)以铜离子为基准制备保持0.001-0.5重量%的铜 - 沸石(A)。 将组分A与粘度为500-900cP(75℃)的载体(B)捏合,与组分C(例如二甘醇己二酸酯)几乎没有反应性,得到浆料,将其加入熔融的聚酰胺(C )(例如尼龙6)并混合均匀分散。 将该混合物成型为以颗粒,膜,纤维,管等形式的标题模制品