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JP2013225637A Wire bonding device and wire bonding method 有权
标题翻译：电线连接器件和线接法
公开(公告)号：JP2013225637A
公开(公告)日：2013-10-31
申请号：JP2012149444
申请日：2012-07-03
申请人： Kaijo Corp , 株式会社カイジョー
发明人： YASUDA TAMANARI , SHOJI HARUO
IPC分类号： H01L21/60
CPC分类号： H01L2224/48 , H01L2224/4848 , H01L2224/78 , H01L2224/78301 , H01L2224/85 , H01L2224/85045 , H01L2224/85051 , H01L2224/85205 , H01L2924/00014 , H01L2224/48465 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： PROBLEM TO BE SOLVED: To provide a wire bonding device and a wire bonding method in which reliability is improved by determining whether bonding of a wire on a bump is performed normally to detect a bonding defect such as non-bonding, in BSOB bonding.SOLUTION: A detection position of a bonding tool 6 in the state where a ball 41 in a distal end of the bonding tool 6 is being abutted onto a second bonding point in forming a bump 42, is defined as a tool height H1. A detection position of the bonding tool 6 in the state where a wire 40 is being abutted to the bump 42 on the second bonding point in wire connection, is defined as a tool height H2. In accordance with the tool heights H1 and H2 of the bonding tool 6 in the same position of the second bonding point, when a difference between the tool height H2 and the tool height H1 is out of a predetermined range, non-bonding at the second bonding point is determined.
摘要翻译：要解决的问题：提供一种引线接合装置和引线接合方法，其中通过确定是否正常地进行引线接合以检测诸如非接合之类的接合缺陷，从而提高可靠性。：在焊接工具6的前端中的球41与形成凸块42的第二接合点抵接的状态下的接合工具6的检测位置被定义为刀具高度H1。在线40与电线连接的第二接合点处的突起42抵接的状态下的接合工具6的检测位置被定义为工具高度H2。根据第二接合点的相同位置处的接合工具6的工具高度H1和H2，当工具高度H2和工具高度H1之间的差异超出预定范围时，在第二接合点处的非接合键合点被确定。

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