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1. 发明专利

JPH07176839A CERAMICS INSULATING SUBSTRATE 失效
公开(公告)号：JPH07176839A
公开(公告)日：1995-07-14
申请号：JP31866993
申请日：1993-12-17
申请人： KAWASAKI STEEL CO , KAWASAKI REFRACTORIES CO LTD
发明人： KANAMARU TAKAO , IIDA MASAKAZU , KUMAGAI MASATO
IPC分类号： H05K1/02 , H05K1/03
摘要： PURPOSE:To provide a ceramics insulating substrate having an excellent heat resistant cycling efficiency, capable of simultaneously suppressing the cracking and warping in the ceramics insulating substrate applicable to a power semiconductor module. CONSTITUTION:Within the ceramics insulating substrate wherein a circuit side copper plate 2 comprising an electronic circuit in a specific pattern, and a sink side copper plate 3 dissipating heat generated in the circuit copper plate 2 are junctioned on the surface and rear surface of a ceramics base material 1 comprising e.g. an aluminum nitride material or alumina material, zirconium content of the sink side copper plate 3 is specified to at least 0.01wt.%, while zirconium content of the circuit side copper plate 2 is specified less than 0.01wt.%.

2. 发明专利

JPH07172961A SINTERED ALUMINUM NITRIDE HAVING METALLIZED LAYER AND ITS PRODUCTION 失效
公开(公告)号：JPH07172961A
公开(公告)日：1995-07-11
申请号：JP31867093
申请日：1993-12-17
申请人： KAWASAKI STEEL CO , KAWASAKI REFRACTORIES CO LTD
发明人： KANAMARU TAKAO , IIDA MASAKAZU , KUMAGAI MASATO
IPC分类号： H05K1/09 , C04B37/02 , C04B41/51 , C04B41/88 , H05K1/03
摘要： PURPOSE:To obtain a metallized product of sintered aluminum nitride having high reliability and practical bonding strength and exhibiting high reliability in soldering and high-temperature soldering. CONSTITUTION:This invention relates to a sintered aluminum nitride having a metallized layer formed by using a high-melting metal paste composed mainly of tungsten and/or molybdenum and a process for the production of the metallized product. The sum of the aluminum, yttrium and oxygen in the high-melting metal paste is adjusted to 0.1-20wt.% and the total content of the group IVa elements of the Periodic Table (titanium, zirconium and hafnium) is 0.1-50wt.%. The post-baking of the high-melting metal paste is carried out in a non-oxidizing atmosphere, more preferably in a non-oxidizing atmosphere containing >=5mol% of nitrogen gas.

3. 发明专利

JPH02275765A PRODUCTION OF SINTERED ALUMINUM NITRIDE 失效
公开(公告)号：JPH02275765A
公开(公告)日：1990-11-09
申请号：JP9538589
申请日：1989-04-17
申请人： KAWASAKI STEEL CO
发明人： NAKANO TADASHI , YOKOI MAKOTO , KANAMARU TAKAO , MEGA TETSUYA , YAMAMURA TAKU , FUNABASHI TOSHIHIKO , KUMAGAI MASATO
IPC分类号： C04B35/581 , C04B35/58
摘要： PURPOSE:To produce a sintered AIN having dense texture and high thermal conductivity and electrical resistance and suitable as an insulation substrate, at a low cost, by adding a specific sintering assistant to AIN powder, forming the mixture and calcining in a non-oxidizing atmosphere. CONSTITUTION:The objective sintered AIN is produced by mixing 100 pts.wt. of AIN powder with (A) 0.05-5 pts.wt. (in terms of oxide) of one or more components selected from Y, Sc and lanthanoid and (B) 0.01 to 5 pts.wt. of one or more elements selected from metallic Li, metallic Be, metallic Mg, B, Si, S, P, As and metallic Zn, forming the mixture and calcining at 1400 to 2000 deg.C in a non-oxidizing atmosphere.

4. 发明专利

JPH0288467A ALUMINUM NITRIDE SINTERED BODY AND PRODUCTION THEREOF 失效
公开(公告)号：JPH0288467A
公开(公告)日：1990-03-28
申请号：JP23651388
申请日：1988-09-22
申请人： KAWASAKI STEEL CO
发明人： YOKOI MAKOTO , KANAMARU TAKAO , KUMAGAI MASATO , UCHIMURA RYOJI
IPC分类号： C04B35/581 , C04B35/58
摘要： PURPOSE:To obtain an AlN sintered body having a flat, smooth surface and high heat conductivity by packing a green sheet of AlN contg. a specified amt. of Y2O3 into a vessel and sintering the sheet under circulating gaseous N2. CONSTITUTION:Y2O3 is added to AlN powder having >0-2wt.% oxygen content [O] by an amt. (wt.%) within the range of 3[O]-1.5

5. 发明专利

JPS63201071A METHOD OF JOINING CERAMIC TO METAL 失效
公开(公告)号：JPS63201071A
公开(公告)日：1988-08-19
申请号：JP3287087
申请日：1987-02-16
申请人： KAWASAKI STEEL CO
发明人： KANAMARU TAKAO , FUNABASHI TOSHIHIKO , UCHIMURA RYOJI
IPC分类号： B23K1/19 , C04B37/02

6. 发明专利

JPH05170563A BONDING OF COPPER PLATE AND CERAMICS 失效
公开(公告)号：JPH05170563A
公开(公告)日：1993-07-09
申请号：JP34321691
申请日：1991-12-25
申请人： KAWASAKI STEEL CO
发明人： KANAMARU TAKAO , FUKUDA KENJI , NAKANO TADASHI , KUMAGAI MASATO
IPC分类号： B23K1/19 , B23K35/30 , C04B37/02
摘要： PURPOSE:To improve the bonding strength, circuit pattern accuracy, breakdown strength, insulation resistance and thermal cycling resistance by restricting an oxygen content of a soldering material and the addition amount of group IVa metal or its hydride within respective specific ranges, applying a paste containing the above components and degreasing the product. CONSTITUTION:A ceramic material (e.g. aluminum nitride) is bonded to a copper plate (e.g. Class-1 oxygen-free copper) by the following procedures. An organic binder and an organic solvent are added to a mixture of powder of a silver soldering having an oxygen content of 0.05-0.5wt.% (e.g. a eutectic composition having the lowest melting point and composed of 72% silver and 28% copper) and one or more kinds of a group IV metal (e.g. Ti) or its hydride (the total amount of the additives is 0.020-0.090mol% based on the silver soldering in terms of metal). The obtained paste is applied to a copper plate and/or a ceramic material and degreased in an inert atmosphere to adjust the carbon content of the paste to 0.05-0.7%. Both members are superposed one upon another and bonded by heating in an inert atmosphere at a temperature above the melting point of the silver soldering and below the melting point of the copper plate.

7. 发明专利

JPH05170564A COPPER PLATE-JOINED ALN SUBSTRATE 失效
公开(公告)号：JPH05170564A
公开(公告)日：1993-07-09
申请号：JP34321991
申请日：1991-12-25
申请人： KAWASAKI STEEL CO
发明人： FUKUDA KENJI , NAKANO TADASHI , KANAMARU TAKAO , KUMAGAI MASATO
IPC分类号： C04B35/581 , C04B35/58 , C04B37/02 , H05K1/05
摘要： PURPOSE:To obtain the subject substrate having excellent heat cycle property by joining a copper plate on the circuit side to one side of an AlN substrate and joining a copper plate on the heat releasing side to other side of the AlN substrate using an alloy brazing material containing an active metal and keeping thickness of the copper plate on the heat releasing side in prescribed value of that of a copper plate on the circuit side. CONSTITUTION:In a substrate in which a copper plate on the circuit side is joined to one surface of an AlN substrate and a copper plate on the heat releasing side is joined to the other surface of the AlN substrate using a brazing material of an alloy containing an active metal (e.g. Ti), the thickness of a copper plate on the heat releasing side is kept to

8. 发明专利

JPH04292471A PRODUCTION OF ALN-BASED SINTERED COMPACT 失效
公开(公告)号：JPH04292471A
公开(公告)日：1992-10-16
申请号：JP5234491
申请日：1991-03-18
申请人： KAWASAKI STEEL CO
发明人： MAEDA EIZO , UENOSONO SATOSHI , UDAGAWA ETSURO , KANAMARU TAKAO , YAMAMURA TAKU , YOKOI MAKOTO , KUMAGAI MASATO
IPC分类号： C04B35/581 , C04B35/58 , C04B35/638 , C04B35/64
摘要： PURPOSE:To obtain an AlN sintered compact having a high thermal conductivity and a smooth surface by increasing temperature at a heating rate so as to provide the oxygen content in the AlN sintered compact within a desired range and degreasing the aforementioned sintered compact. CONSTITUTION:A sintering assistant such as Y2O3 and a binder are added to AlN powder and kneading and forming of the prepared mixture are carried out. The temperature of the resultant compact is subsequently increased at a desired heating rate (A) in an atmosphere of N2 to produce a decreased compact (B). In the process, the relation between the rate (A) and the residual carbon content (C) in the component (B) is predetermined and the oxygen content (D) of the AlN sintered compact obtained by degreasing is obtained. Heating, degreasing and sintering are then performed at the rate (A) so as to provide the component (D) within a desired range. Thereby, the objective AlN sintered compact, having 1.8-3.2 wt.% content of Y2O3 and the grain boundary phase composition other than inevitably contained impurities exhibiting a relation expressed by the formula [the molar ratio of (x/y) is 0.08 =150 W/mK, a low surface roughness and a smooth and homogeneous surface is produced.

9. 发明专利

JPH04292470A PRODUCTION OF ALN-BASED SINTERED COMPACT 失效
公开(公告)号：JPH04292470A
公开(公告)日：1992-10-16
申请号：JP5234791
申请日：1991-03-18
申请人： KAWASAKI STEEL CO
发明人： MAEDA EIZO , UENOSONO SATOSHI , UDAGAWA ETSURO , KANAMARU TAKAO , YAMAMURA TAKU , YOKOI MAKOTO , KUMAGAI MASATO
IPC分类号： C04B35/581 , C04B35/58
摘要： PURPOSE:To obtain an AlN sintered compact having a high thermal conductivity and a smooth and homogeneous surface by determining the oxygen content in a produced AlN sintered compact and adding Al2O3 in an amount corresponding to the extent of deviation to a raw material before the next forming if the content is deviated to the side of a low oxygen content. CONSTITUTION:A sintering assistant and a binder are added to AlN powder and disintegration, kneading and forming of the prepared mixture are carried out. The resultant compact is subsequently degreased in an atmosphere of N2 to produce a decreased compact, which is then burned in an N2 gas stream to produce the objective AlN sintered compact. The oxygen content in the produced AlN sintered compact is subsequently measured. If the measured oxygen content is deviated to the side of a lower value than a desired oxygen content, Al2O3 in an amount corresponding to the above-mentioned extent of deviation is added to the aforementioned raw material before forming in the next production. Treatment is then carried out in the same manner as that in the preceding time to afford the AlN sintered compact having the desired oxygen content. The resultant AlN sintered compact is preferably used as substrates, etc., for loading IC.

10. 发明专利

JPH0248469A PRODUCTION OF CALCINED ALUMINUM NITRIDE COMPACT 失效
公开(公告)号：JPH0248469A
公开(公告)日：1990-02-19
申请号：JP19454688
申请日：1988-08-05
申请人： KAWASAKI STEEL CO
发明人： YOKOI MAKOTO , KANAMARU TAKAO , KUMAGAI MASATO , UCHIMURA RYOJI
IPC分类号： C04B35/581 , C04B35/58 , C04B41/80
摘要： PURPOSE:To improve thermal conductivity of a calcined compact by sandwiching an AlN calcined compact having a specific density between graphite plates with a specific ash content and heat-treating the afore-mentioned calcined compact within a specific temperature range. CONSTITUTION:An AlN calcined compact having 90-100% ratio of apparent density to true density is sandwiched between graphite plates with

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