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1. 发明专利

JP2009038366A Heat radiating component for semiconductor, case for semiconductor and carrier for semiconductor with the same attached, and package with the same as base 有权
标题翻译：用于半导体的热辐射元件，用于半导体的半导体和载体与其相连的半导体器件，以及作为基底的封装
公开(公告)号：JP2009038366A
公开(公告)日：2009-02-19
申请号：JP2008178758
申请日：2008-07-09
申请人： Jfe Seimitsu Kk , Jfe Steel Kk , Jfeスチール株式会社 , Jfe精密株式会社
发明人： TERAO SEIMEI , OTA HIROKI , KOHIKI HIDEAKI , SAWAI TAKASHI , ABUMITA TETSUO
IPC分类号： H01L23/373 , H01L23/36
CPC分类号： H01L23/3736 , B22F3/24 , B22F3/26 , B22F2003/248 , B22F2998/00 , B22F2998/10 , C22C1/0425 , C22C1/045 , C22C9/00 , C22C27/06 , H01L23/057 , H01L23/08 , H01L2224/48091 , H01L2224/48227 , H01L2924/01079 , B22F3/17 , B22F3/18 , B22F3/20 , B22F3/02 , B22F3/10 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a high-precision heat radiating component for a semiconductor which has a small thermal expansion and uses a Cr-Cu alloy having a large thermal conductivity for preventing the degradation of characteristics of a semiconductor element by rapidly radiating heat generated from the semiconductor element and the like, and is stably supplied with high economic efficiency and productivity by simplifying the manufacturing process including as a main process a press work even for a complicated shape; and to provide a semiconductor case, a semiconductor carrier and a package with the radiating component attached.
SOLUTION: The heat radiating component is a molded product produced by cold pressing a Cr-Cu alloy plate produced by subjecting a Cr-Cu alloy to powder metallurgy. The molded product comprises more than 30% by mass and not more than 80% by mass of Cr with the balance consisting of Cu and unavoidable impurities. The unavoidable impurities are O: not more than 0.15% by mass, N: not more than 0.1% by mass, C: not more than 0.1% by mass, Al: not more than 0.05% by mass, and Si: not more than 0.10% by mass.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种具有较小热膨胀的半导体的高精度散热元件，并且使用具有大导热性的Cr-Cu合金来快速地防止半导体元件的特性劣化散发由半导体元件等产生的热量，并且通过简化包括作为主要工艺的制造工艺，即使是复杂形状的冲压加工也可以稳定地提供高经济效率和生产率; 并且提供半导体壳体，半导体载体和附接有辐射部件的封装。解决方案：散热部件是通过对Cr-Cu合金进行粉末冶金制造的Cr-Cu合金板的冷压制成的成型体。成型体含有超过30质量％且80质量％以下的Cr，余量由Cu和不可避免的杂质构成。不可避免的杂质为O：不大于0.15质量％，N：不大于0.1质量％，C：不大于0.1质量％，Al：不大于0.05质量％，Si：不大于 0.10质量％。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2007242891A Heat radiator plate of copper or copper-contained alloy, and its joining method 有权
标题翻译：铜或铜合金的散热板及其接合方法
公开(公告)号：JP2007242891A
公开(公告)日：2007-09-20
申请号：JP2006063187
申请日：2006-03-08
申请人： Jfe Seimitsu Kk , Jfe Steel Kk , Jfeスチール株式会社 , Jfe精密株式会社
发明人： TERAO SEIMEI , OTA HIROKI , KOHIKI HIDEAKI
IPC分类号： H01L23/40
摘要： PROBLEM TO BE SOLVED: To provide a method of joining a DBA substrate and a heat radiating member by brazing or by soldering, and also a heat radiator plate manufactured by the joining method. SOLUTION: A Cu plate or a Cu-contained alloy is joined to a foil or a particle-like Sn-based alloy by inserting the foil or the particle-like Sn-based alloy between the Cu or the Cu-contained alloy, and heating the alloys at a temperature not lower than the melting point of the Sn-based alloy. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供通过钎焊或焊接将DBA基板和散热构件接合的方法，以及通过接合方法制造的散热板。解决方案：通过将箔或粒状Sn基合金插入Cu或含Cu的合金中，将Cu板或含Cu合金结合到箔或粒状的Sn基合金上在不低于Sn系合金的熔点的温度下加热合金。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2007035985A Heat sink used by electronic apparatus, and its manufacturing method 有权
标题翻译：电子设备使用的散热器及其制造方法
公开(公告)号：JP2007035985A
公开(公告)日：2007-02-08
申请号：JP2005218248
申请日：2005-07-28
申请人： Jfe Seimitsu Kk , Jfe Steel Kk , Jfeスチール株式会社 , Jfe精密株式会社
发明人： TERAO SEIMEI , KOHIKI HIDEAKI , OTA HIROKI , UENOSONO SATOSHI
IPC分类号： H01L23/373
摘要： PROBLEM TO BE SOLVED: To provide a heat sink and its method for manufacturing, in which no problem due to thermal distortion occurs even if an electronic part having different thermal expansion coefficient and a heat dissipation member are jointed, because heat generated from electronic parts such as semiconductors etc. is diffused more efficiently than before.
SOLUTION: In a heatsink for semiconductor devices, the thermal expansion coefficient of the opposed faces are different, and further, the thermal expansion coefficient of one face is 4-14×10
-6 /K, and that of another face is 10-24×10
-6 /K.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种散热器及其制造方法，其中即使将具有不同热膨胀系数的电子部件和散热构件接合，也不会发生由于热变形引起的问题，因为由电子部件如半导体等比以前更有效地扩散。解决方案：在半导体器件的散热器中，相对面的热膨胀系数不同，一面的热膨胀系数为4-14×10 -6 / K ，另一面为10-24×10 -6 / K。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2008142761A Cold temper rolling method for copper alloy sheet 有权
标题翻译：铜合金薄板冷轧轧制方法
公开(公告)号：JP2008142761A
公开(公告)日：2008-06-26
申请号：JP2006335552
申请日：2006-12-13
申请人： Jfe Seimitsu Kk , Jfe Steel Kk , Jfeスチール株式会社 , Jfe精密株式会社
发明人： TERAO SEIMEI , OTA HIROKI , KOHIKI HIDEAKI
IPC分类号： B21B1/22 , B21B3/00 , C22C9/00 , C22C27/06 , C22F1/00 , C22F1/08
摘要： PROBLEM TO BE SOLVED: To provide a method for inexpensively producing a copper alloy having a satisfactory flatness which is suitable as the stock for a heat radiation sheet having compatibility between a low thermal expansion coefficient and a high thermal conductivity rate, and also having excellent workability.
SOLUTION: First cold rolling where the roll spacing between rolling rolls is set to a prescribed value, and a copper alloy sheet is subjected to thickness reduction is performed one time, and thereafter, first temper rolling is performed one or more times at the roll spacing same as that in the first cold rolling, and next, second cold rolling where the roll spacing is reduced and the copper alloy sheet is subjected to thickness reduction is performed for one time, and subsequently, second temper rolling is performed one or more times at the roll spacing same as that in the second cold rolling.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供一种廉价地制造具有令人满意的平坦度的铜合金的方法，其适合作为具有低热膨胀系数和高热导率之间相容性的散热片的原料，以及具有优异的可加工性。＆lt; P＆gt;解决方案：将轧制辊之间的辊间距设定为规定值，并对铜合金板进行厚度还原的第一次冷轧进行一次，然后在第一次轧制中进行一次或多次辊间隔与第一次冷轧相同，接下来，进行辊间隔减小的第二次冷轧，并且对铜合金板进行厚度还原，进行一次，然后进行第二次轧制，在与第二次冷轧相同的轧辊间距下更多次。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2008057032A Cr-Cu ALLOY, MANUFACTURING METHOD THEREFOR, RADIATION PLATE FOR SEMICONDUCTOR AND RADIATION PARTS FOR SEMICONDUCTOR 有权
标题翻译： Cr-Cu合金及其制造方法，半导体辐射板和半导体辐射部件
公开(公告)号：JP2008057032A
公开(公告)日：2008-03-13
申请号：JP2007034405
申请日：2007-02-15
申请人： Jfe Seimitsu Kk , Jfe Steel Kk , Jfeスチール株式会社 , Jfe精密株式会社
发明人： TERAO SEIMEI , OTA HIROKI , KOHIKI HIDEAKI
IPC分类号： C22C9/00 , B22F3/26 , C22C1/04 , C22C27/06 , C22F1/00 , C22F1/08 , C22F1/11
摘要： PROBLEM TO BE SOLVED: To provide a Cr-Cu alloy which has a small coefficient of thermal expansion in a surface direction, has a large coefficient of thermal conductivity, further keeps a low coefficient of thermal expansion even after having been heated to a high temperature for bonding, and besides, has superior workability; a manufacturing method therefor; further a radiation plate with the use of the Cr-Cu alloy for a semiconductor; and radiation parts with the use of the Cr-Cu alloy for a semiconductor.
SOLUTION: The Cr-Cu alloy comprises a Cu matrix and flat Cr phases; is obtained by powder metallurgy; and includes Cr of more than 30 mass% but 80 mass% or less. The flat Cr phases have an average aspect ratio of more than 1.0 but less than 100.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供在表面方向上具有小的热膨胀系数的Cr-Cu合金，具有大的导热系数，即使在被加热之后也保持低的热膨胀系数用于粘合的高温，此外，具有优异的加工性; 其制造方法; 进一步使用Cr-Cu合金用于半导体的辐射板; 以及使用Cr-Cu合金用于半导体的辐射部件。解决方案：Cr-Cu合金包含Cu基体和平坦的Cr相; 通过粉末冶金获得; 并且包含大于30质量％但为80质量％以下的Cr。平坦的Cr相具有大于1.0但小于100的平均纵横比。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2005330583A Cu-Cr ALLOY AND Cu-Cr ALLOY PRODUCTION METHOD 有权
标题翻译： Cu-Cr合金和Cu-Cr合金生产方法
公开(公告)号：JP2005330583A
公开(公告)日：2005-12-02
申请号：JP2005119104
申请日：2005-04-15
申请人： Jfe Seimitsu Kk , Jfe Steel Kk , Jfeスチール株式会社 , Jfe精密株式会社
发明人： TERAO SEIMEI , KOHIKI HIDEAKI , UENOSONO SATOSHI
IPC分类号： C22F1/08 , B22F3/26 , C22C1/04 , C22C9/00 , C22C27/06 , C22F1/00 , C22F1/11 , H01L23/373
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive alloy material for heat radiation having a coefficient of thermal expansion similar to that of composite material, high thermal conductivity similar to that of pure copper, and also having excellent machinability, to provide a production method therefor, and further to provide a production method using a powder sintering process, in addition to the conventional dissolution process, by which alloy materials for heat radiation with various shapes can be supplied at a low production cost in order to meet particularly the need of various shapes as those of alloy materials for heat radiation.
SOLUTION: The Cu-Cr alloy comprises, by mass, 0.3 to 80% C, and the balance Cu with inevitable impurities, and has a structure where a granular Cr phase having a major axis of ≤100 nm and an aspect ratio of 2 .
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种廉价的热辐射合金材料，其热膨胀系数类似于复合材料的热膨胀系数，与纯铜相似的高热导率，并且还具有优异的机械加工性，以提供生产并且进一步提供使用粉末烧结工艺的生产方法，除了传统的溶解过程之外，可以以低的生产成本提供具有各种形状的用于散热的合金材料，以便特别地满足各种形状，如用于散热的合金材料。解决方案：Cu-Cr合金的质量含量为0.3〜80％，余量为不可避免的杂质，Cu具有长径为100nm以上的粒状Cr相和纵横比小于10的析出物以≥20个/μm 2 的密度析出为≥100nm的Cr相以外的Cu基质。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2008240007A Cr-Cu ALLOY SHEET, HEAT SINK FOR SEMICONDUCTOR, AND HEAT DISSIPATING COMPONENT FOR SEMICONDUCTOR 有权
标题翻译： Cr-Cu合金薄片，半导体用散热片，半导体热分散组件
公开(公告)号：JP2008240007A
公开(公告)日：2008-10-09
申请号：JP2007078178
申请日：2007-03-26
申请人： Jfe Seimitsu Kk , Jfe Steel Kk , Jfeスチール株式会社 , Jfe精密株式会社
发明人： TERAO SEIMEI , OTA HIROKI , KOHIKI HIDEAKI
IPC分类号： C22C9/00 , B22F3/26 , C22C1/04 , C22C27/06 , C22F1/00 , C22F1/08 , C22F1/11 , H01L23/373
摘要： PROBLEM TO BE SOLVED: To provide a Cr-Cu alloy sheet having a low coefficient of thermal expansion in an in-plane direction and a high thermal conductivity, maintaining a low coefficient of thermal expansion even after bonding by heating to high temperature, and also having excellent workability and improved plating property and further to provide a heat sink for semiconductors and a heat dissipating component for semiconductors using the Cr-Cu alloy sheet.
SOLUTION: The Cr-Cu alloy sheet having the following characteristics is manufactured: a surface layer composed substantially of Cu is formed at least on one side of a Cr-Cu alloy sheet composed of a Cu matrix and a flat Cr phase and produced by powder metallurgy; Cr content in the Cr-Cu alloy sheet excluding the surface layer composed of Cu ranges from >30 to 80 mass%; and the average aspect ratio of the flat Cr phase ranges from >1.0 to
摘要翻译：要解决的问题：为了提供在面内方向上具有低热膨胀系数和高导热性的Cr-Cu合金板，即使在通过加热到高温之后也保持低的热膨胀系数并且还具有优异的可加工性和改善的电镀性能，并进一步提供半导体散热器和使用Cr-Cu合金板的半导体散热元件。解决方案：制造具有以下特性的Cr-Cu合金板：在由Cu基体和平坦Cr相构成的Cr-Cu合金板的至少一侧上形成基本上由Cu构成的表面层，粉末冶金生产; 除了由Cu组成的表面层以外的Cr-Cu合金板中的Cr含量为> 30〜80质量％平均Cr相的平均纵横比为> 1.0〜<100。使用Cr-Cu合金板制造半导体用散热器和半导体用散热部件。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2011129880A Heat sink for electronic device, and process for production thereof 有权
标题翻译：电子设备用热水器及其制造方法
公开(公告)号：JP2011129880A
公开(公告)日：2011-06-30
申请号：JP2010224217
申请日：2010-10-01
申请人： Jfe Seimitsu Kk , Jfe Steel Corp , Jfeスチール株式会社 , Jfe精密株式会社
发明人： TERAO SEIMEI , KOHIKI HIDEAKI
IPC分类号： H01L23/373 , B22F7/08 , C22C9/00 , C22C27/06 , C22F1/00 , C22F1/08 , C22F1/11
CPC分类号： H01L23/3735 , B22F3/26 , B22F7/04 , B22F2007/045 , B32B15/01 , C22C1/0425 , C22C1/045 , C22C9/00 , C22C27/06 , C22C30/02 , C22F1/08 , C22F1/11 , C22F1/18 , H01L23/3736 , H01L23/473 , H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To provide a heat sink for an electronic device that has low heat expansion properties, excellent heat conductivity particularly in the direction of thickness, and a reduced entire thickness.
SOLUTION: The heat sink for the electronic device is produced by joining a Cr-Cu alloy sheet comprising a Cu matrix and more than 30 mass% and not more than 80 mass% of Cr to a Cu sheet, and rolling the joined product, thereby producing a laminate having a Cr-Cu alloy layer and a Cu layer.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有低热膨胀性，优异的导热性，特别是在厚度方向上的电子器件的散热器，以及减小的整体厚度。解决方案：电子器件的散热器是通过将包含Cu基体的Cr-Cu合金板和大于30质量％且不大于80质量％的Cr的Cr-Cu合金片材接合到Cu片材上而制成的，从而制备具有Cr-Cu合金层和Cu层的层压体。版权所有（C）2011，JPO＆INPIT

9. 发明专利

JP2012216844A Heat radiating component for semiconductor, case for semiconductor with the same, and carrier for semiconductor 审中-公开
标题翻译：用于半导体的半导体放热元件及其半导体用半导体器件
公开(公告)号：JP2012216844A
公开(公告)日：2012-11-08
申请号：JP2012105709
申请日：2012-05-07
申请人： Jfe Seimitsu Kk , Jfe Steel Corp , Jfeスチール株式会社 , Jfe精密株式会社
发明人： TERAO SEIMEI , OTA HIROKI , KOHIKI HIDEAKI , SAWAI TAKASHI , ABUMITA TETSUO
IPC分类号： H01L23/373 , B22F3/24 , B22F3/26 , C22C1/04 , C22C9/00 , C22C27/06 , H01L23/02 , H01L23/12 , H01L23/14 , H01L23/36
CPC分类号： H01L23/3736 , B22F3/24 , B22F3/26 , B22F2003/248 , B22F2998/00 , B22F2998/10 , C22C1/0425 , C22C1/045 , C22C9/00 , C22C27/06 , H01L23/057 , H01L23/08 , H01L2224/48091 , H01L2224/48227 , H01L2924/01079 , B22F3/17 , B22F3/18 , B22F3/20 , B22F3/02 , B22F3/10 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a high-precision heat radiating component for a semiconductor in which a manufacturing process is simple, and which is economical and has high productivity by using a Cr-Cu alloy which has a small coefficient of thermal expansion and large coefficient of thermal conductivity, and to provide a semiconductor case, a semiconductor carrier and a package.SOLUTION: A heat radiating component for a semiconductor is a molded product produced by cold pressing a Cr-Cu alloy plate obtained by processing a Cr-Cu alloy which is produced by applying powder metallurgy. The molded product comprises more than 30 mass% and less than or equal to 80 mass% of Cr content with the balance consisting of Cu and unavoidable impurities. The unavoidable impurities are less than or equal to 0.15 mass% of O, less than or equal to 0.1 mass% of N, less than or equal to 0.1 mass% of C, less than or equal to 0.05 mass% of Al, and less than or equal to 0.10 mass% of Si.
摘要翻译：要解决的问题：为了提供一种用于制造工艺简单的半导体的高精度散热部件，并且通过使用具有小的热系数的Cr-Cu合金是经济的并且具有高生产率膨胀和大的导热系数，并提供半导体外壳，半导体载体和封装。解决方案：半导体用散热构件是通过对通过施加粉末冶金制造的Cr-Cu合金进行加工而得到的Cr-Cu合金板进行冷压而制造的成型体。成型体含有大于30质量％且小于等于80质量％的Cr含量，余量由Cu和不可避免的杂质构成。不可避免的杂质小于或等于0.15质量％，小于或等于0.1质量％的N，小于或等于0.1质量％的C，小于或等于0.05质量％的Al和更少的大于等于0.10质量％的Si。版权所有（C）2013，JPO＆INPIT

10. 发明专利

JP2009149966A METHOD FOR PRODUCING Cr-Cu ALLOY SHEET 有权
标题翻译：生产Cr-Cu合金薄片的方法
公开(公告)号：JP2009149966A
公开(公告)日：2009-07-09
申请号：JP2008066675
申请日：2008-03-14
申请人： Jfe Seimitsu Kk , Jfe Steel Corp , Jfeスチール株式会社 , Jfe精密株式会社
发明人： KOHIKI HIDEAKI , TERAO SEIMEI , OTA HIROKI , HIRUTA TOSHIKI
IPC分类号： C22F1/11 , B21B1/22 , B21B3/00 , B22D19/00 , B22F3/18 , B22F3/24 , B22F3/26 , C22C1/04 , C22C9/00 , C22C27/06 , C22F1/00 , C22F1/08
摘要： PROBLEM TO BE SOLVED: To provide a production method which can prevent edge cracks of a Cr-Cu alloy sheet having characteristics such that the coefficient of thermal expansion is low and also thermal conductivity is high. SOLUTION: In the method for producing a Cr-Cu alloy sheet, a Cr-Cu alloy stock comprising, by mass, >30 to ≤80% Cr, and the balance Cu with inevitable impurities is subjected to warm rolling in the temperature range of 40 to 300°C. Alternatively, in the production method, Cu is infiltrated into a porous body obtained by sintering Cr powder and Cu powder to make a Cr-Cu alloy stock, and it is subjected to warm rolling to obtain a Cr-Cu alloy sheet. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：提供一种能够防止具有使热膨胀系数低，导热性高的特性的Cr-Cu合金板的边缘裂纹的制造方法。解决方案：在Cr-Cu合金板的制造方法中，将Cr含量为> 30〜≤80％的Cr和余量为不可避免的杂质的Cr-Cu合金原料在温度范围为40〜300℃。或者，在制造方法中，将Cu浸渍到通过烧结Cr粉末和Cu粉末而获得的多孔体中，制成Cr-Cu合金原料，并进行温轧以获得Cr-Cu合金板。版权所有（C）2009，JPO＆INPIT

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