专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2005081602A Molding method of highly transparent acrylic resin product 审中-公开
标题翻译：高透明丙烯酸树脂产品的成型方法
公开(公告)号：JP2005081602A
公开(公告)日：2005-03-31
申请号：JP2003314065
申请日：2003-09-05
申请人： Japan U-Pica Co Ltd , 日本ユピカ株式会社
发明人： NAKABAYASHI TAKASHI , FURUYA HIDEKI , TAJIMA HIROYUKI , MURAO MASAYOSHI
IPC分类号： B29C43/20 , B29K33/00
摘要： PROBLEM TO BE SOLVED: To provide a molding method of a highly transparent acrylic resin product for obtaining a molded product having high mechanical strength, transparency and gloss and excellent in weatherability and boiling resistance. SOLUTION: A mixture, which is obtained by compounding 50-300 pts.wt. of an acrylic resin powder (B) and 1-50 pts.wt. of a crosslinking monomer (C) with 100 pts.wt. of an acrylic resin syrup (A), which is composed of 100-20 wt.% of a (meth)acrylic monomer (A1) consisting mainly of methyl (meth)acrylate and 0-80 wt.% of a (meth)acrylic polymer (A2), is aged under a temperature condition of 10-60°C to obtain an acrylic resin molding material (D1). This acrylic resin molding material (D1) and an acrylic resin molding material (D2) obtained by compounding 0.1-5.0 pts.wt. of a polymerization initiator (E) with the mixture comprising the components (A), (B) and (C) are together used in a weight ratio: the material (D1): the material (D2)=30:70-60:40 and the material (D1) and the material (D2) are superposed one upon another to be heated, pressed and molded at a temperature of 40-150°C under a pressure of 1-10 MPa. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种高透明度丙烯酸树脂产品的模塑方法，用于获得具有高机械强度，透明度和光泽以及耐候性和耐沸腾性优异的成型产品。解决方案：将混合物通过混合50-300重量份的丙烯酸树脂粉末（B）和1-50重量份的交联单体（C）与100重量份的丙烯酸树脂浆（A），其由100〜20重量％的主要由（甲基）丙烯酸甲酯组成的（甲基）丙烯酸单体（A1）和0〜80重量％的（甲基）丙烯酸聚合物（A2）在10-60℃的温度条件下老化，得到丙烯酸树脂成型材料（D1）。该丙烯酸树脂成型材料（D1）和通过配合0.1-5.0重量份得到的丙烯酸树脂成型材料（D2）聚合引发剂（E）与包含组分（A），（B）和（C）的混合物一起以重量比进行使用：材料（D1）：材料（D2）= 30:70-60： 40，将材料（D1）和材料（D2）彼此重叠以在1-10MPa的压力下在40-150℃的温度下加热，压制和模制。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2005041747A Curable resin composition for injecting into laminated glass 审中-公开
标题翻译：可固化树脂组合物注入层压玻璃
公开(公告)号：JP2005041747A
公开(公告)日：2005-02-17
申请号：JP2003279007
申请日：2003-07-24
申请人： Japan U-Pica Co Ltd , 日本ユピカ株式会社
发明人： FURUYA HIDEKI , NAKABAYASHI TAKASHI , TAJIMA HIROYUKI , MURAO MASAYOSHI
IPC分类号： C03C27/12 , C08F265/06 , C08F290/00
摘要： PROBLEM TO BE SOLVED: To provide a curable resin composition giving laminated glass having excellent breaking and penetrating resistance that can not be easily broken or can not be easily holed due to breaking by hitting or prying.
SOLUTION: The curable resin composition contains a compound having at least two hydroxy groups within a molecule, a urethane (meth)acrylate reactive oligomer obtained by the condensation reaction between an aliphatic and/or alicyclic polyvalent isocyanate and a hydroxy(meth)acrylate compound, a (meth)acrylic monomer and a radical polymerization initiator as essential components.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种具有优异的耐破碎性和耐穿透性的夹层玻璃的固化性树脂组合物，其不能容易地破裂或由于打击或撬裂而不能容易地打孔。解决方案：固化性树脂组合物含有分子中具有至少两个羟基的化合物，通过脂族和/或脂环族多价异氰酸酯与羟基（甲基）丙烯酸酯之间的缩合反应获得的氨基甲酸酯（甲基）丙烯酸酯反应性低聚物，丙烯酸酯化合物，（甲基）丙烯酸系单体和自由基聚合引发剂作为必要成分。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2005298556A Low odorous curable resin composition 审中-公开
标题翻译：低气味可固化树脂组合物
公开(公告)号：JP2005298556A
公开(公告)日：2005-10-27
申请号：JP2004112787
申请日：2004-04-07
申请人： Japan U-Pica Co Ltd , 日本ユピカ株式会社
发明人： TAJIMA HIROYUKI , NAKABAYASHI TAKASHI
IPC分类号： C08F290/06 , C08G59/16
摘要： PROBLEM TO BE SOLVED: To provide a low odorous curable resin composition which gives a cured product which is low odorous, exhibits an excellent air-drying property and good curability, is strong, water-resistant and chemical-resistant and has an excellent balance between the elongation ratio and strength.
SOLUTION: The low odorous curable resin composition is obtained by dissolving an epoxy-modified resin (E), obtained by reacting a long chain unsaturated monobasic acid (H), obtained by a reaction of a monofunctional (meth)acrylate (A-1) having a weight-average molecular weight of 150-500 and bearing one hydroxyl group in the molecule and/or an allyl ether compound (A-2) bearing one hydroxyl group in the molecule and an unsaturated group at the molecular end with a saturated dibasic acid or an anhydride thereof (B), with a methacrylic acid (C) and/or a bisphenol epoxy compound (D) having an epoxy equivalent of at most 300, in a polymerizable monofunctional (meth)acrylate (F).
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种低气味固化性树脂组合物，其具有低气味的固化产物，具有优异的空气干燥性和良好的固化性，是强的，耐水和耐化学腐蚀的，并且具有伸长率和强度之间的极好的平衡。解决方案：低气味可固化树脂组合物是通过将通过单官能（甲基）丙烯酸酯（A）的反应获得的长链不饱和一元酸（H）反应得到的环氧改性树脂（E） -1），分子中具有一个羟基的分子中具有一个羟基，和/或分子中带有一个羟基的烯丙基醚化合物（A-2）和分子末端的不饱和基团，饱和二元酸或其酸酐（B）与环氧当量最多为300的甲基丙烯酸（C）和/或双酚环氧化合物（D）在可聚合的单官能（甲基）丙烯酸酯（F）中。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2005082612A Acrylic resin molding material 审中-公开
标题翻译：丙烯酸树脂模塑材料
公开(公告)号：JP2005082612A
公开(公告)日：2005-03-31
申请号：JP2003312711
申请日：2003-09-04
申请人： Japan U-Pica Co Ltd , 日本ユピカ株式会社
发明人： NAKABAYASHI TAKASHI , FURUYA HIDEKI , TAJIMA HIROYUKI , MURAO MASAYOSHI
IPC分类号： C08K7/02 , C08F20/10 , C08L33/06
摘要： PROBLEM TO BE SOLVED: To provide an acrylic resin molding material for an artificial marble which can provide a molded article excellent in mechanical strengths, transparency, weatherability and boiling resistance.
SOLUTION: This acrylic resin molding material can be obtained by covering a resin composition with a releasable film and aging it under a temperature condition of 10-60°C, wherein the resin composition comprises a mixture which contains, as essential ingredients, 100 pts.wt. of an acrylic syrup (A) comprising 100-20 wt.% of a (meth)acrylic monomer (A1) mainly composed of methyl (meth)acrylate and 0-80 wt.% of a (meth)acrylic polymer (A2), 50-300 pts.wt. of an acrylic powder (B); 1-50 pts.wt. of a crosslinking monomer (C); and 0.1-5.0 pts.wt. of a polymerization initiator (D).
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种人造大理石的丙烯酸树脂成型材料，其能够提供机械强度，透明性，耐候性和耐沸腾性优异的成型体。解决方案：该丙烯酸树脂成型材料可以通过用可剥离膜覆盖树脂组合物并在10-60℃的温度条件下老化来获得，其中树脂组合物包含含有作为必要成分的混合物， 100 pts.wt 的丙烯酸树脂浆（A），其包含100-20重量％的主要由（甲基）丙烯酸甲酯和（甲基）丙烯酸系聚合物（A2）组成的（甲基）丙烯酸系聚合物（A2）的（甲基）丙烯酸系单体 50-300 pts.wt 的丙烯酸粉末（B）; 1-50磅的交联单体（C）; 和0.1-5.0重量份的聚合引发剂（D）。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2004277538A Transparent molding material composition 审中-公开
标题翻译：透明成型材料组合物
公开(公告)号：JP2004277538A
公开(公告)日：2004-10-07
申请号：JP2003069675
申请日：2003-03-14
申请人： Japan U-Pica Co Ltd , 日本ユピカ株式会社
发明人： FURUYA HIDEKI , NAKABAYASHI TAKASHI
IPC分类号： C08F20/12
摘要： PROBLEM TO BE SOLVED: To provide a transparent molding material composition for artificial marble that is easily molded with commonly used conventional molding machines and yields a molding with excellent mechanical strength and high transparency.
SOLUTION: The transparent molding material composition is obtained by adding 50-300 pts.wt acrylic powder, 1.0-50 pts.wt. monomer for crosslinking and 0.1-10 pts.wt. polymerization initiator as indispensable ingredients to 100 pts.wt. (meth)acrylic monomer containing 0-50 wt.% (meth)acrylic polymer and kneading the mixture.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种透明的用于人造大理石的成型材料组合物，其通过常用的常规成型机容易地模塑，并产生具有优异的机械强度和高透明度的模制品。
解决方案：透明成型材料组合物通过加入50-300重量份丙烯酸粉末，1.0-50重量份用于交联的单体和0.1-10重量份聚合引发剂作为100重量份不可或缺的成分（甲基）丙烯酸单体，混合0-50重量％（甲基）丙烯酸聚合物，并捏合该混合物。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2005081603A Molding method of transparent acrylic resin product 审中-公开
标题翻译：透明丙烯酸树脂产品的成型方法
公开(公告)号：JP2005081603A
公开(公告)日：2005-03-31
申请号：JP2003314066
申请日：2003-09-05
申请人： Japan U-Pica Co Ltd , 日本ユピカ株式会社
发明人： NAKABAYASHI TAKASHI , FURUYA HIDEKI , TAJIMA HIROYUKI , MURAO MASAYOSHI
IPC分类号： B29C43/20 , B29K33/04
摘要： PROBLEM TO BE SOLVED: To provide a molding method of a transparent acrylic resin product for obtaining a molded product having high mechanical strength, transparency and gloss and excellent in weatherability and boiling resistance. SOLUTION: A mixture, which is obtained by compounding 50-300 pts.wt. of an acrylic resin powder (B) and 0.1-5.0 pts.wt. of a polymerization initiator (E) with 100 pts.wt. of an acrylic resin syrup (A), which is composed of 100-20 wt.% of a (meth)acrylic monomer (A1) consisting mainly of methyl (meth)acrylate and 0-80 wt.% of a (meth)acrylic polymer (A2), is aged under a temperature condition of 10-60°C to obtain an acrylic resin molding material (D1). The acrylic resin molding material (D1) and an acrylic resin molding material (D2) obtained by compounding 1-50 pts.wt. of a crosslinking monomer (C) with the mixture comprising the components (A), (B) and (C) are together used in a weight ratio: the material (D1): the material (D2)=60:40-20:80 and the material (D1) and the material (D2) are superposed one upon another to be heated, pressed and molded at a mold temperature of 110-140°C under a pressure of 1-10 MPa. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种透明丙烯酸树脂产品的模塑方法，用于获得具有高机械强度，透明度和光泽以及优异的耐候性和耐沸性的模塑产品。解决方案：将混合物通过混合50-300重量份的丙烯酸树脂粉末（B）和0.1-5.0重量份的聚合引发剂（E）与100重量份的丙烯酸树脂浆（A），其由100〜20重量％的主要由（甲基）丙烯酸甲酯组成的（甲基）丙烯酸单体（A1）和0〜80重量％的（甲基）丙烯酸聚合物（A2）在10-60℃的温度条件下老化，得到丙烯酸树脂成型材料（D1）。丙烯酸树脂成型材料（D1）和通过配混1-50重量份得到的丙烯酸树脂成型材料（D2）（A），（B）和（C）的混合物与交联单体（C）的重量比一起使用：材料（D1）：材料（D2）= 60:40-20:20 80和材料（D1）和材料（D2）彼此重叠以在1-10-140℃的模具温度下在1-10MPa的压力下加热，压制和模制。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2004115573A Unsaturated polyester resin and its resin composition 审中-公开
公开(公告)号：JP2004115573A
公开(公告)日：2004-04-15
申请号：JP2002277101
申请日：2002-09-24
申请人： Japan U-Pica Co Ltd , 日本ユピカ株式会社
发明人： NAKABAYASHI TAKASHI , KOIZUMI YUSUKE
IPC分类号： C08L67/06 , C08G63/52
摘要： PROBLEM TO BE SOLVED: To provide a low-shrinkable unsaturated polyester resin affording a molded product having an excellent appearance such as transparency or gloss and excellent heat resistance and mechanical strength without using a low shrinkage agent.
SOLUTION: The unsaturated polyester resin is obtained as follows. A polycondensation reaction of an unsaturated dibasic acid or its acid anhydride with a saturated dibasic acid or its acid anhydride and a polyhydric alcohol in (50:50:100) to (80:20:100) molar ratio is carried out. The polyhydric alcohol consists essentially of neopentyl glycol and 2,2-bis(4-hydroxypropoxyphenyl)propane. The resultant unsaturated polyester having 1,500-3,000 number-average molecular weight in an amount of 65-80 pts. wt. is dissolved in 35-20 pts. wt. of a polymerizable monomer.
COPYRIGHT: (C)2004,JPO

8. 发明专利

JP2001220500A RESIN COMPOSITION FOR PRESS MOLDING AND MOLDED PRODUCT OF ARTIFICIAL MARBLE USING THE SAME RESIN COMPOSITION 失效
公开(公告)号：JP2001220500A
公开(公告)日：2001-08-14
申请号：JP2000029962
申请日：2000-02-08
申请人： JAPAN U PICA CO LTD
发明人： FURUYA HIDEKI , NAKABAYASHI TAKASHI , TAKAYANAGI TAKASHI
IPC分类号： C08J5/04 , C08F2/44 , C08F220/14 , C08F290/06 , C08L33/00 , C08L33/12 , C08L63/10
摘要： PROBLEM TO BE SOLVED: To obtain an acrylic resin composition for press molding which is excellent in moldability, mechanical properties of a molded product and heat resistance and moreover imparts excellent resistance to boiling water and impact resistance without losing the excellent characteristics of acrylic syrup, and to provide artificial marble obtained by the press molding of the above resin composition for press molding. SOLUTION: The resin composition for press molding comprises (A) a carboxyl group-containing acrylic polymer (B) an epoxy acrylate and (C) methyl methacrylate as essential ingredients. An artificial marble molded product excellent in moldability, an outward appearance and dimensional accuracy all of which cannot be attained by conventional technology and having resistance to boiling water, high strength and high impact resistance the shortcomings of which are conventional defects is obtained by using the above resin composition for press molding.

9. 发明专利

JP2001064518A PRESS MOLDING MATERIAL COMPOSITION AND ARTIFICIAL MARBLE MADE BY MOLDING THE SAME 失效
公开(公告)号：JP2001064518A
公开(公告)日：2001-03-13
申请号：JP23826899
申请日：1999-08-25
申请人： JAPAN U PICA CO LTD
发明人： FURUYA HIDEKI , NAKABAYASHI TAKASHI , TAKAYANAGI TAKASHI
IPC分类号： B29B13/02 , B29C43/02 , C04B26/02 , C04B111/54 , C08K3/20 , C08K7/02 , C08L101/00 , C08L101/16
摘要： PROBLEM TO BE SOLVED: To provide a press molding material composition having good flowability and moldability by specifying a compound amount of a filler, its viscosity and an exponent, with regard to a compound having no tack obtained by mixing, compounding and aging a thermosetting resin, a thermoplastic polymer, a thickening agent, a filler and a curing agent as essential components. SOLUTION: A temperature at aging is a room temperature to 50 deg.C. A compounding amount of a filler is V2/V1=0.5-1.0 (wherein V1 is a volume concentration of the filler at the maximum resin absorption amount of a thermosetting resin to the filler; and V2 is a volume concentration of the filler in an actual compounding). A viscosity of a compound is 5.0 E+6 to 1.0 E+9 mPa.s/20-30 deg.C. An exponent of the compound is 0.2-0.8/65 deg.C in measuring with an elevated flow tester. The thermosetting resin is an epoxy acrylate resin or the like. A thermoplastic resin is a polystyrene or the like. A thickening agent is a metallic oxide or the like. The filler is silica or the like. A curing agent is benzol peroxide or the like.

10. 发明专利

JP2000053731A DAMPING RESIN COMPOSITION AND DAMPING RESIN MOLDING PRODUCT FOR STRUCTURE USING THE SAME 失效
公开(公告)号：JP2000053731A
公开(公告)日：2000-02-22
申请号：JP13683399
申请日：1999-05-18
申请人： MITSUBISHI MOTORS CORP , JAPAN U PICA CO LTD
发明人： YAMAMURA HARUSHIGE , URUJI YASUSHI , IIZUKA SHINTARO , HONJO TAKESHI , YAMAGUCHI MASAKAZU , KOIZUMI YUSUKE , HAYASHI HIROSHI , ITO NAOHISA , NAKABAYASHI TAKASHI
IPC分类号： G10K11/162 , C08F283/01 , C08F290/06 , C08J5/10 , F16F15/02 , F16F15/08 , G10K11/16
摘要： PROBLEM TO BE SOLVED: To obtain a damping resin composition having higher damping characteristics in a wider temperature range and excellent moldability and a damping resin molding product for structure using the composition. SOLUTION: This resin composition is a resin obtained by mixing a bifunctional di(meth)acrylate (A) of the formula CH2=CR2CO-(R1O)n-OCOCR2= CH2 ((n) is >=2; R1 is a 2-13C alkylene or a polymethylene chain; R2 is hydrogen or a methyl group) with an unsaturated polyester resin (B+C) composed of an unsaturated polyester (B) and a cross-linkable monomer (C) and an epoxy acrylate resin (B'+C) composed of an epoxy acrylate (B') and the cross-linkable monomer (C) in the ratio of 5-95 wt.% of the components (B+C) and 95-5 wt.% of the components (B'+C) and 15-85 wt.% of the component A and 85-15 wt.% of the components (B+C) or (B'+C) or (B"+C).

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式