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1. 发明专利

JP2005139633A Growth base material and seeding and planting method 有权
标题翻译：生长基地材料和种子和种植方法
公开(公告)号：JP2005139633A
公开(公告)日：2005-06-02
申请号：JP2003374346
申请日：2003-11-04
申请人： Japan Found Eng Co Ltd , Tsurumi Soda Co Ltd , 日本基礎技術株式会社 , 鶴見曹達株式会社
发明人： NAGAMI AKIRA , DAIJO YUTAKA , MAKINO SUMIO
IPC分类号： A01G1/00 , E02D17/20
摘要： PROBLEM TO BE SOLVED: To provide a soft growth base material having the small grain size of a ligneous chip, and having high water absorptivity; and a seeding and planting method using this growth base material, for reducing a germination/growth hindering substance having fear of having adverse influence on germination/growth of a plant included in the ligneous chip.
SOLUTION: This growth base material is the ligneous chip of applying expanding softening treatment or a material of mixing at least one kind selected from earth, bark compost, a fertilizer, a soil improver, cement or mortar with this chip, or the ligneous chip composted by applying the expanding softening treatment or a material of mixing at least one kind of material selected from earth, a fertilizer, cement or mortar with this chip. The seeding and planting method sprays a spraying material mixed with the growth base material on a seeding and planting object.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供具有木质芯片的小晶粒尺寸并且具有高吸水率的软生长基材; 以及使用这种生长基材的种子和种植方法，用于减少害怕对木质片中包含的植物的萌发/生长产生不利影响的发芽/生长阻碍物质。解决方案：该生长基材是应用膨胀软化处理的木质芯片，或用该芯片混合选自土，树皮堆肥，肥料，土壤改良剂，水泥或砂浆中的至少一种的材料，或通过应用膨胀的软化处理而堆肥的木质芯片或者将选自土，肥料，水泥或砂浆的至少一种材料与该芯片混合的材料。播种和播种方法将与生长基质混合的喷涂材料喷洒在播种和种植对象上。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2005290833A Intrusive body feed device to sub-grade etc 审中-公开
标题翻译：引导身体进给装置到等级等级
公开(公告)号：JP2005290833A
公开(公告)日：2005-10-20
申请号：JP2004107169
申请日：2004-03-31
申请人： Anderson Technology Kk , Japan Found Eng Co Ltd , Sato Kogyo Co Ltd , アンダーソンテクノロジー株式会社 , 佐藤工業株式会社 , 日本基礎技術株式会社
发明人： MURAMOTO TOSHIYUKI , IMAOKA HIKOZO , SUZUKI TETSUO , TSUJINO SHUICHI , MORISHITA MASATO , HONJO YOSHINARI , KUROMATSU KATSURO , NAGAMI AKIRA , SHINMACHI SHUICHI
IPC分类号： E21B3/02 , E02D7/26
摘要： PROBLEM TO BE SOLVED: To provide a feed device of a sub-grade intrusive body capable of making the occurrence of vibration of high frequency with small amplitude, contemplating the efficiency of boring efficiency and a pile intrusion efficiency, at the same time, lightening the burden imposed on bit to obtain long bit life, furthermore eliminating damage, etc. in a bearing part and, at the same time, substantially minimizing the occurrence of noises caused by the vibration.
SOLUTION: In the feed device 3 for penetrating into a sub-grade while giving torque and vibration together with driving force to a boring rod R to be held and mounted along a guide cell 2 in a forward and backward moveable manner, as a vibrating means in the feed device 3, a linear motor system is adopted, and a vibration driving body 16 connected to the sub-grade intrusive body R in the feed device through an intermediate member is reciprocated in the direction of the axis with the minute amplitude to make the occurrence of vibration.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供能够以小幅度发生高频振动的次级侵入体的进料装置，考虑到镗孔效率和桩侵入效率的同时，减轻施加在钻头上的负担以获得长时间的使用寿命，同时消除轴承部件中的损坏等，同时基本上最小化由振动引起的噪声的发生。解决方案：在进给装置3中，用于在向向前和向后移动的方向上沿导向单元2保持并安装的镗杆R的驱动力同时施加扭矩和振动的同时进入副档，作为进给装置3中的振动装置，采用线性马达系统，并且通过中间构件连接到进给装置中的次级侵入体R的振动驱动体16在轴线方向上以分钟振幅使振动发生。版权所有（C）2006，JPO＆NCIPI

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