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1. 发明专利

JP2009117612A Circuit module and method of manufacturing the same 有权
标题翻译：电路模块及其制造方法
公开(公告)号：JP2009117612A
公开(公告)日：2009-05-28
申请号：JP2007288943
申请日：2007-11-06
申请人： Internatl Business Mach Corp , インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation
发明人： MATSUSHIBA TAKUJI , MINAMI AYA , MIWA YOICHI , YAMAMOTO MASATAKE , NOMURA TAICHIRO , WAGATSUMA SO , TSUBOI KENJI
IPC分类号： H01L23/40
CPC分类号： H01L23/3677 , H01L23/13 , H01L23/4006 , H01L23/433 , H01L2023/405 , H01L2023/4062 , H01L2023/4087 , H01L2224/16 , H01L2224/73253 , H01L2924/1433 , Y10T29/49117
摘要： PROBLEM TO BE SOLVED: To improve cooling effect of a semiconductor component on a circuit board. SOLUTION: A circuit module includes a thermally conductive board 30 which forms a part of a cabinet, a circuit board 32 on the thermally conductive board, which has openings 44, an upper face 50 having a plurality of electrode pads arranged to surround the opening and a lower face 52 positioned on an opposite side of the upper face, a semiconductor chip 34 connected to a plurality of the electrode pads on the upper face of the circuit board through solder 46, a heat sink 36 bonded to an upper face of the semiconductor chip, thermally conductive members 38, 40 and 42 which thermally connect the thermally conductive board and the semiconductor chip, have elasticity, pass through the openings of the circuit board, and each of which one face is brought into contact with a lower face of the semiconductor chip and other face to a surface of the thermally conductive board, and a plurality of clamping members 48 passing through the circuit board in a thickness direction at a periphery of the semiconductor chip and connecting the heat sink with the thermally conductive board so that they face each other. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提高半导体部件在电路板上的冷却效果。解决方案：电路模块包括形成机柜的一部分的导热板30，导热板上的电路板32，其具有开口44，上表面50具有布置成围绕的多个电极焊盘所述开口和位于所述上表面的相反侧的下表面52;半导体芯片34，其通过焊料46连接到所述电路板的上表面上的多个电极焊盘;散热器36，其结合到上表面半导体芯片的热传导部件38,40和42，热连接导热板和半导体芯片具有弹性，穿过电路板的开口，并且其中的每一个与下部的一个面接触半导体芯片的面和其他面朝向导热板的表面，以及多个夹持构件48，其在周边的厚度方向上穿过电路板 e半导体芯片，并将散热器与导热板连接，使得它们彼此面对。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2010182884A Semiconductor light-emitting device and wiring substrate for light-emitting chip mounting 审中-公开
标题翻译：用于发光芯片安装的半导体发光器件和布线基板
公开(公告)号：JP2010182884A
公开(公告)日：2010-08-19
申请号：JP2009025284
申请日：2009-02-05
申请人： Internatl Business Mach Corp , Sanesu:Kk , インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation , 株式会社サンエス
发明人： TANIYA HISAYUKI , IKEUCHI KEITO , YAMAMOTO YASUHIRO , TSUBOI KENJI
IPC分类号： H01L33/48
CPC分类号： H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device with improved practical luminance and light extraction efficiency; and to provide a wiring substrate for light-emitting chip mounting, applied to the semiconductor light-emitting device.
SOLUTION: The semiconductor light-emitting device 1 includes an insulating substrate 10 on which a semiconductor light-emitting element chip 2 has been mounted, and further includes, on a surface 10s of the insulating substrate 10, a chip arrangement region Ac where the semiconductor light-emitting element chip 2 has been arranged and an outer peripheral region Af enclosing the chip arrangement region Ac, and also includes a first resin film 21 laminated and formed on the outer peripheral region Af and containing dispersed rutile type titanium oxide particulates.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供具有改进的实际亮度和光提取效率的半导体发光器件; 并且提供应用于半导体发光器件的发光芯片安装用配线基板。解决方案：半导体发光器件1包括其上安装有半导体发光元件芯片2的绝缘基板10，并且在绝缘基板10的表面10s上还包括芯片布置区域Ac 其中已经布置了半导体发光元件芯片2和包围芯片布置区域Ac的外围区域Af，并且还包括层叠并形成在外周区域Af上并且包含分散的金红石型氧化钛微粒的第一树脂膜21 。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2004259473A Organic el display panel and manufacturing method of the same 有权
公开(公告)号：JP2004259473A
公开(公告)日：2004-09-16
申请号：JP2003045936
申请日：2003-02-24
申请人： Aitesu:Kk , Internatl Business Mach Corp , Micro Gijutsu Kenkyusho:Kk , インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation , 株式会社アイテス , 株式会社ミクロ技術研究所
发明人： NAGAI NAOMI , TSUBOI KENJI , NAKAMURA MAKOTO
IPC分类号： H05B33/22 , H01L51/50 , H05B33/10 , H05B33/12 , H05B33/14
摘要： PROBLEM TO BE SOLVED: To provide an organic EL display panel with high reliability to which a passive matrix method is applied, which can be manufactured at low cost, and to provide a manufacturing method of the same.
SOLUTION: An organic EL display panel 10 is composed of insulation layers 16 formed between first electrodes 14 formed into stripe-shape films on an upper surface of a substrate 12, pole-shaped bodies 18 formed on upper surfaces of the insulation layers 16 with an interval between each other, plate-shaped bodies 20 formed in stripe at a position crossing the first electrodes 14 on the upper surface of the pole-shaped bodies 18, an organic light-emitting layer 22 formed in film on upper surfaces of the first electrodes 14 and the insulation layers 16, and second electrodes 24 formed on upper surfaces of the organic light-emitting layer 22 through the plate-shaped bodies 20.
COPYRIGHT: (C)2004,JPO&NCIPI

4. 发明专利

JP2008028444A Passive ultrasonic tag, method of reading recorded information and system thereof 有权
标题翻译：被动超声波标签，读取记录信息的方法及其系统
公开(公告)号：JP2008028444A
公开(公告)日：2008-02-07
申请号：JP2006195422
申请日：2006-07-18
申请人： Internatl Business Mach Corp , インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation
发明人： TSUBOI KENJI , KUDO YOSHIHARU , NISHINO HITOSHI
IPC分类号： H04B11/00 , G06K19/06 , H04B1/59
CPC分类号： G01S15/74 , G06K19/07749 , H04B11/00
摘要： PROBLEM TO BE SOLVED: To provide a passive ultrasonic tag and an ultrasonic reading system capable of recording and reading information by utilizing an ultrasonic wave for transmission and reception in a more simplified way for more maintaining reliability. SOLUTION: This passive ultrasonic tag 100 has a tag base 102; and two or more holes (106, 108, 110) each spreading over a surface 104 of the tag base 102 and are respectively provided with bottoms (112, 114, 116) having predetermined depth dimensions (d1, d2, d3) toward the inside (Z) from the surface of the tag base to the inside of the tag base. Of the two or more holes, at least the two holes have a depth dimension set as a different dimension. With this configuration, when ultrasonic scanning is executed over a three-dimensional range including the surfaces of the two holes and bottoms of the two holes, the tag base acts so that reflection of the ultrasonic wave can be different (R1, R2, R3) on the basis of the setting of the bottoms of the two holes, and thus, information can be recorded and read. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够以更简化的方式利用用于发送和接收的超声波来记录和读取信息的无源超声波标签和超声波读取系统，以更加保持可靠性。解决方案：该无源超声波标签100具有标签基座102; 以及两个或更多个孔（106,108,110），每个孔分别铺展在标签基座102的表面104上，并且分别设置有朝向内侧的具有预定深度尺寸（d1，d2，d3）的底部（112,114,116）（Z）从标签基底的表面到标签基底的内部。在两个或更多个孔中，至少两个孔具有设置为不同尺寸的深度尺寸。利用这种结构，当在包括两个孔的两个孔和底部的表面的三维范围上执行超声波扫描时，标签基座起作用以使超声波的反射可以不同（R1，R2，R3）基于两个孔的底部的设置，因此可以记录和读取信息。版权所有（C）2008，JPO＆INPIT

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