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1. 发明专利

JP2000066414A DEVELOPER DISCHARGE NOZZLE IN RESIST DEVELOPING APPARATUS 失效
公开(公告)号：JP2000066414A
公开(公告)日：2000-03-03
申请号：JP25189098
申请日：1998-08-21
申请人： ISHIKAWA SEISAKUSHO KK , MITANI TADAOKI , HORI HIDENOBU , NIKKISO CO LTD
发明人： MITANI TADAOKI , HORI HIDENOBU , NIKI TOSHIICHI , HABU YOSHIHIKO , CHIBA TOSHIAKI
IPC分类号： G03F7/30 , B05B1/14 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To perfectly solve the problem of bubbles due to the intrusion of air caused at the time of coating a wafer with a developer, to spread the developer on the wafer in a very short time and to enable uniform development even when the diameter of the wafer is as large as 8-12 in. SOLUTION: A bundle of 1,000-32,000 tubes 6 made of hollow fibers of 0.1-0.5 mm inside diameter having micropores in the peripheral surfaces is housed in a housing 8 to form the objective developer discharge nozzle 4. A developer sent from a developer feed source is discharged from the micropores in the peripheral surfaces of the hollow fibers in the housing 8 through the interiors of the hollow fibers so that the developer spreads concentrically on a wafer from the central part toward the peripheral part as if it is discharged from one hollow nozzle.

2. 发明专利

JP2000068197A BUBBLE PREVENTER AND ELIMINATOR 失效
公开(公告)号：JP2000068197A
公开(公告)日：2000-03-03
申请号：JP25193298
申请日：1998-08-20
申请人： ISHIKAWA SEISAKUSHO KK , MITANI TADAOKI , HORI HIDENOBU , NIKKISO CO LTD
发明人： MITANI TADAOKI , HORI HIDENOBU , NIKI TOSHIICHI , HABU YOSHIHIKO , CHIBA TOSHIAKI
IPC分类号： G03F7/30 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To prevent the generation of microbubbles and remove bubbles mixed in a chemical by sending the chemical, a developing solution, into hollow fibers through fine holes formed on the outer surfaces of the hollow fibers in a housing, and passing it through the hollow fibers to be discharged onto a wafer through a discharge nozzle. SOLUTION: When discharging a developing solution onto a wafer W through a discharge nozzle 5, with a valve 3 opened, a developing solution is sent out from a source 1 of the developing solution into a housing 8 through hollow pipes 2a, 2b. The developing solution then fills a space around the outer surfaces of hollow fibers 6 stored in the housing 8 and finally fills the entire housing 8. At that time, the air existing in the space 7 is exhausted through an exhaust pipe 10. Meanwhile, the developing solution enters each of the hollow fibers 6 through fine holes formed on the outer surfaces and passes through the hollow fibers 6 along the inner surfaces to be discharged onto a wafer W from a discharge nozzle 5 through a hollow pipe 2c. At that time, even if bubbles are mixed in the developing solution, the ones having the larger diameter than that of the fine holes formed on the outer surfaces of the hollow fibers 6 never enter the hollow fibers 6.

3. 发明专利

JP2000124126A DEVELOPING SOLUTION DISCHARGE NOZZLE FOR RESIST DEVELOPING APPARATUS 失效
公开(公告)号：JP2000124126A
公开(公告)日：2000-04-28
申请号：JP3809199
申请日：1999-02-17
申请人： ISHIKAWA SEISAKUSHO KK , NIKKISO CO LTD
发明人： MITANI TADAOKI , HORI HIDENOBU , NIKI TOSHIICHI , CHIBA TOSHIAKI
IPC分类号： B05C11/08 , G03F7/30 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To prevent developer from containing air bubbles and dripping off from a nozzle even if wafer is larger than 12 inches (30 cm) in diameter, when developing solution is sprayed on the wafer, thus improving product yield. SOLUTION: A developer discharge nozzle has a structure, where a large number of hollow fibers 6 each having a large number of fine holes on its outer surface, prescribed in length, and very fine in inner diameter are bound into a bundle providing a space between them, and the bundle is housed and fixed in a housing 8. A developer, fed from a developing solution supply source, is introduced into spaces which are demarcated inside the housing 8 and discharged out of the housing 8 passing through the hollow fibers 8 via the fine holes bored in their outer surfaces, where flows of developer are bound into a bundle and spread concentrically in a laminar flow from the center to the periphery of a wafer so as to be discharged through a single hollow nozzle, despite the developer being discharged out through a large number of hollow fibers.

4. 发明专利

JP2000058434A DEVELOPING SOLUTION DISCHARGE NOZZLE OF RESIST DEVELOPING DEVICE 失效
公开(公告)号：JP2000058434A
公开(公告)日：2000-02-25
申请号：JP23631198
申请日：1998-08-07
申请人： ISHIKAWA SEISAKUSHO KK , MITANI TADAOKI , HORI HIDENOBU
发明人： MITANI TADAOKI , HORI HIDENOBU , NIKI TOSHIICHI , HABU YOSHIHIKO
IPC分类号： G03F7/30 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To completely solving a so-called air bubble problem where air is trapped by a method wherein a developing solution is discharged out from a supply source as being bundled as if it is discharged out from a hollow nozzle and made to spread concentrically over a wafer from its center to periphery. SOLUTION: One thousand to thirty-two thousand of hollow fiber tubes which are 0.1 to 0.5 mm in inner diameter are bundled and attached to the tip of a hollow tube. A developing solution discharged out form the fiber tubes becomes hemispherical and get gradually expanding to become spheres, where flows of developing solution discharged out from the adjacent fiber tubes come into contact with each other to turn into spheres of an integral structure. A developing solution drops down on a wafer W increasing in volume, and flows of developing solution are discharged out from fiber tubes as being bundled as if they are discharged out from a single hollow nozzle and made to spread concentrically over the wafer W from its center to periphery. Thereafter, the surface of the wafer W is uniformly coated with a thin film of developing solution.

5. 发明专利

JP2000058435A DEVELOPER EJECTING NOZZLE FOR RESIST DEVELOPING DEVICE AND METHOD THEREFOR 失效
公开(公告)号：JP2000058435A
公开(公告)日：2000-02-25
申请号：JP23631298
申请日：1998-08-07
申请人： ISHIKAWA SEISAKUSHO KK , MITANI TADAOKI , HORI HIDENOBU
发明人： MITANI TADAOKI , HORI HIDENOBU , NIKI TOSHIICHI , HABU YOSHIHIKO
IPC分类号： G03F7/30 , B05C5/00 , B05D1/26 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To improve yield by preventing the generation of any problem of air bubbles to be caught by generated air, and reducing liquid drop from a nozzle at the time of ejecting developer to a wafer, even when the aperture of a wafer is increased to 12 inches or more. SOLUTION: A nozzle 14 is constituted of one ejection port 10, whose hole diameter is larger at the central part and plural ejection ports 11 whose hole diameters are small at the peripheral part of the ejection port. The inner diameter of one ejection port 10, whose hole diameter is larger at the central part is set 2 mm-6 mm, and the inner diameters of the plural ejection ports 11 whose hole diameters are small at the peripheral part are set 0.1 mm-0.5 mm. At applying developer to a wafer, developer is ejected from one ejection port 10, whose hole diameter is large at the central part of the nozzle, so that the developer can be scattered to almost the entire face of the wafer. Then, the ejection of the developer at the ejection port at the central part of the nozzle is stopped. Afterwards, the developer is ejected from the plural ejection ports 11, whose hole diameters are small at the peripheral part so that the developer can be scattered and applied to the entire face of the wafer.

6. 发明专利

JP2000074257A Pressure excessive response preventing device 审中-公开
标题翻译：压力过高的预防措施
公开(公告)号：JP2000074257A
公开(公告)日：2000-03-14
申请号：JP25752998
申请日：1998-08-26
申请人： Hidenobu Hori , Ishikawa Seisakusho Ltd , Tadaoki Mitani , Nikkiso Co Ltd , 三谷忠興 , 秀信堀 , 日機装株式会社 , 株式会社石川製作所
发明人： MITANI TADAOKI , HORI HIDENOBU , NIKI TOSHIICHI , HABU YOSHIHIKO , CHIBA TOSHIAKI
IPC分类号： F16K21/00 , F16K47/14 , F16L55/04 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a device without a transient response obtaining sufficient performance and eliminating a reverse flow relating to chemicals of acid, alkali, etc., by constituting the transient response of pressure in the chemicals due to opening/closing of a valve so as to be prevented by elastic deformation of a hollow fiber in a housing. SOLUTION: Many hollow fibers 6 having a fine hole in an outer peripheral surface and having a prescribed length and a fine internal diameter are stored in a housing 8 by fixing left/right end parts thereof. The housing 8, formed in cylindrical shape, is constituted by a lower part communicating with a hollow pipe 2b, left side surface communicating with a hollow pipe 2c, and an upper part communicating with a discharge pipe 10. Since a developing solution is delivered onto a wafer from a nozzle with chemicals passing in the hollow fiber from the fine hole of the hollow fiber outer peripheral surface in the housing, a transient response in the chemicals due to opening/closing of a valve is absorbed by elastic deformation of the hollow fiber, generation of bubbles in the vicinity of the valve is prevented, and a shock generated in the pipe can be relaxed.
摘要翻译：要解决的问题：通过构成由于阀的打开/关闭而导致的化学品中的压力的瞬态响应，提供一种没有瞬态响应的装置，获得足够的性能并消除与酸，碱等化学物质相反的逆流以防止壳体中的中空纤维的弹性变形。解决方案：在外周表面具有细孔并且具有规定长度和细内径的许多中空纤维6通过固定其左/右端部而被保存在壳体8中。形成为圆筒状的壳体8由与中空管2b连通的下部，与中空管2c连通的左侧面和与排出管10连通的上部构成。由于显影液被输送到来自喷嘴的晶片，其中化学品从壳体中空纤维外周表面的细孔穿过中空纤维，由于阀的打开/关闭而导致的化学品中的瞬态响应被中空纤维的弹性变形吸收能够防止在阀附近产生气泡，能够缓和管内的冲击。

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