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1. 发明专利

JP2001121053A ROLL COATER FOR COATING AND PRODUCTION METHOD OF PRINTED CIRCUIT BOARD USING THE SAME 失效
公开(公告)号：JP2001121053A
公开(公告)日：2001-05-08
申请号：JP30380799
申请日：1999-10-26
申请人： IBIDEN CO LTD , TOYODA AUTOMATIC LOOM WORKS
发明人： SUZUKI AYUMI , NIKI NORIO , AOKI MAKOTO , KITAJIMA KAZUHISA , KAGOHASHI SUSUMU , KAJIYAMA YUKARI , TANAKA HIROSHI
IPC分类号： H05K3/28 , B05C1/02 , B05C1/08 , H05K3/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a roll coater for coating capable of forming an interlaminar resin insulating layer and a solder-resist layer with even thickness and producing a printed circuit board excellent in the connection and reliability by preventing formation failure of openings for via holes and openings for solder bumps and diameter and shape defects attributed to unevenness of the coating film thickness. SOLUTION: The roll coater 20 for coating is a coater to be used when forming an interlaminater resin insulating layer and/or a solder-resist layer in a printed circuit board comprising a substrate and conductor circuits and interlaminater resin insulating layers successively formed on the substrate and a solder-resist layer formed on the uppermost layer is formed and the substrate of the roll 21 constituting the roll coater 20 for coating are so grooved as to have a large number of grooves in a rotation direction and the grooves 22a, 22b in the roll end parts 21a are formed shallower than those in other parts.

2. 发明专利

JP2005167141A Method of manufacturing printed wiring board and multilayer printed wiring board 审中-公开
标题翻译：制造印刷线路板和多层印刷线路板的方法
公开(公告)号：JP2005167141A
公开(公告)日：2005-06-23
申请号：JP2003407527
申请日：2003-12-05
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： IWATA YUTAKA , SUZUKI AYUMI , KATADA SATORU , SHINODA KENJI
IPC分类号： H05K1/02 , H05K3/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer printed wiring board that is free of warpage.
SOLUTION: While stress is generated on a worksheet 30 when hardening a solder resist constituent 70γ, strength around the worksheet 30 is increased by copper that constitutes a frame state conductor pattern 149 comprising slits 159S. Simultaneously, the formed slits 159S reduce the difference of the area of the copper positioned at the points corresponding to a gap between the inside of the product and the outside of the product, thereby reducing the stress that generates warpage to make it more resistant to the warpage.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种制造没有翘曲的多层印刷线路板的方法。解决方案：当硬化阻焊剂组分70γ时，在工作片30上产生应力，构成包括狭缝159S的框状导体图案149的铜增加了工作片30周围的强度。同时，形成的狭缝159S减少了位于与产品内部和产品外部之间的间隙相对应的位置处的铜的区域的差异，从而减少产生翘曲的应力，以使其更耐受翘曲。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2000357872A BUILDUP MULTILAYER PRINTED WIRING BOARD 失效
公开(公告)号：JP2000357872A
公开(公告)日：2000-12-26
申请号：JP2000166112
申请日：2000-06-02
申请人： IBIDEN CO LTD
发明人： SUZUKI AYUMI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a buildup multilayer printed wiring board superior in surface flatness of a layer insulation film and insulation reliability. SOLUTION: A first resin layer 8 is formed at regions R1 forming no patterns on an inner layer board 2 having an inner layer conductor pattern 3, the resin layer 8 is formed by leaving specified clearances C1 from the side faces of the conductor pattern 3, a resin varnish is applied and hardened to form a second insulation layer 10 constituting a cover layer 9, the resin layer 10 fills the clearances C1 and covers the conductor pattern 3 and the first resin layer 8, an adhesive layer 11 is formed on the second resin layer 10 and roughened, etc., and an outer conductor pattern 6 is formed on the adhesive layer 11 by electroless Cu plating.

4. 发明专利

JPH04107939A MANUFACTURE OF DOUBLE-SIDED FILM CARRIER 失效
公开(公告)号：JPH04107939A
公开(公告)日：1992-04-09
申请号：JP22743590
申请日：1990-08-28
申请人： IBIDEN CO LTD
发明人： SUZUKI YOSHIHIDE , SUZUKI AYUMI , YABE SHUICHI , HORIBA YASUHIRO
IPC分类号： H01L21/60
摘要： PURPOSE:To manufacture a double film carrier efficiently and at low cost by sticking a copper foil to a film backing through an adhesive. CONSTITUTION:A copper foil 12a is stuck after a device hole 11a and outer lead hole 11c have been formed in a film backing 11 with an adhesive 11b attached to one surface of the backing. Then, after a back coat agent 15 has been embedded in the device hole 11a and outer lead hole 11c and a copper foil 13a with an adhesive 13b attached to one surface thereof has been stuck on the other surface of the film backing 11, a through hole is drilled and a copper plate 16 is formed on the whole surface of the hole. After that, a photoresist coat 17 is formed on both faces and developed, the copper plate 16 and copper foils 12a, 13a protruding from the photoresist coat 17 are etched, the back coat agent 15 and photoresist coat 17 are removed by sodium hydroxide, and finish plating 18 is applied to the whole copper-protruding part such as copper foil 12a. Thus, it is possible to simplify a process and to lower a cost.

5. 发明专利

JP2001053445A METHOD MANUFACTURING PRINTED WIRING BOARD 失效
公开(公告)号：JP2001053445A
公开(公告)日：2001-02-23
申请号：JP22648699
申请日：1999-08-10
申请人： IBIDEN CO LTD
发明人： KITAJIMA KAZUHISA , MATSUBARA SHIGEJI , NIKI NORIO , SUZUKI AYUMI
IPC分类号： H05K3/28 , H05K3/00 , H05K3/42 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To stably maintain an opening formed in an insulating resin layer with a desired diameter for a long time by reducing the illuminance drop of a discharge lamp for exposure having a bulb length that falls within a specific range by forming a photosensitive resin layer on a lower-layer conductor circuit and, at the same time, exposing the photosensitive resin layer to the light emitted from the discharge lamp. SOLUTION: A discharge lamp 7 for exposure has a bulb length of 90-250 mm and a bulb diameter of 90-150 mm. In such a bulb length of the lamp 7, the length can reduce the illuminance variations of between discharge lamps 7 and the illuminance drop of the lamp 7 resulting from foreign maters adhering to the internal surface of the bulb of the lamp 7 and assures the effect of the impurity removing material incorporated in the lamp 7. In the discharge lamp 7 of such and arrangement, the photosensitive reactions of a photosensitive resin, a resin for forming photosensitive solder resist, and a photosensitive dry film become appropriate and openings having desired diameters and wiring can be formed and stably maintained for a long time, because the variation of the exposing factor, such as the wavelength, illuminance, etc., of the light source is reduced regardless of the used time.

6. 发明专利

JPH08264941A BUILD-UP MULTILAYER PRINTED BOARD AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH08264941A
公开(公告)日：1996-10-11
申请号：JP6647395
申请日：1995-03-24
申请人： IBIDEN CO LTD
发明人： SUZUKI AYUMI
IPC分类号： H05K3/46 , H05K1/00 , H05K3/18 , H05K3/38
摘要： PURPOSE: To provide the manufacturing method of a build-up multilayer printed wiring board, having excellent flatness and insulating reliability on the surface of an interlayer insulating layer, which can be manufactured in a reliable and easy manner. CONSTITUTION: First, the first resin layer 8 is formed on the non-pattern formed region R1 located on an inner layer substrate 2 having inner conductive patterns 3 in the title manufacturing method. The above-mentioned first resin layer 8 is formed in such a manner that the prescribed clearance C1 is maintained between the side faces of the inner layer conductive patterns 3. Then, the second insulating layer 10, which constitutes a coated layer 9, is formed by coating and hardening resin varnish RW1. The second resin layer 10 fills up the clearance C1 and covers the inner layer conductive patterns 3 and the first resin layer 8. Besides, after an adhesive material layer 11 has been formed on the second resin layer 10, the layer 11 is roughened, and an outer layer conductive pattern 6 is formed on the adhesive material layer 11 by conducting non- electrolytic plating.

7. 发明专利

JPH07115273A MULTILAYER PRINTED WIRING BOARD 失效
公开(公告)号：JPH07115273A
公开(公告)日：1995-05-02
申请号：JP28598093
申请日：1993-10-19
申请人： IBIDEN CO LTD
发明人： ENOMOTO AKIRA , SUZUKI AYUMI , TAKASAKI YOSHINORI
IPC分类号： H05K3/46
摘要： PURPOSE:To embody a more enhanced fine pattern by reducing the size of a via hole and further reducing circuit widths or circuit clearances and propose a multilayer printed wiring board based on an additive process forming a high reliability connection via hole as well. CONSTITUTION:In a multilayer printed wiring board where a conductor layer formed by way of a resin insulation layer based on an additive process is laminated, a lower layer which comprises the resin insulation layer is made of a ceramic-contained resin layer and an upper layer of the resin insulation layer is a multilayer printed wiring board which is an electroless plating adhesive layer.

8. 发明专利

JPH0681154A ADHESIVE FOR WIRING BOARD AND PRODUCTION OF PRINTED WIRING BOARD USING THIS ADHESIVE AND PRINTED WIRING BOARD 失效
公开(公告)号：JPH0681154A
公开(公告)日：1994-03-22
申请号：JP23187392
申请日：1992-08-31
申请人： IBIDEN CO LTD
发明人： SUZUKI AYUMI , ASAI MOTOO
IPC分类号： C23C18/18 , C09J201/00 , C23C18/20 , H05K3/18 , H05K3/38
摘要： PURPOSE:To develop the adhesive which is excellent in both of electroless platability and coatability at a specific film thickness and to establish the tech nique of producing the printed wiring board utilizing the adhesive. CONSTITUTION:This adhesive is prepd. by dispersing the fine powder of a heat resistant resin which is soluble in an acid or oxidizing agent and is subjected to a curing treatment into an uncured heat resistant resin matrix exhibiting the characteristic to be hardly soluble in the acid or oxidizing agent when the matrix is subjected to curing treatment. The adhesive is so prepd. that the value obtd. by measuring the viscosity of the adhesive by a rotary viscometer is 1.0+ or -0.5Pa.s at 6rpm rotating speed and 0.5+ or -0.2Pa.s at 60rpm rotating speed and the ratio of the viscosity at 6rpm rotating speed to the viscosity at 60rpm rotating speed exhibits 2.0+ or -1.0 as adequate conditions for forming a thick film of >=20mum by one time of coating. This adhesive for wiring boards is excellent in both of the electroless platability and coatability, and this invention includes the process for production of the printed wiring board by using this adhesive and the printed wiring board.

9. 发明专利

JPH04169462A CONVEYING ROLL 失效
公开(公告)号：JPH04169462A
公开(公告)日：1992-06-17
申请号：JP29634690
申请日：1990-10-31
申请人： IBIDEN CO LTD
发明人： SUZUKI AYUMI , SATAKE HIROAKI , KATO HISAO , ADACHI TAKEMA
IPC分类号： B65H27/00
摘要： PURPOSE:To convey a long scale object in a safe condition by simple constitution by providing constitution such as supporting both side parts of the long scale object in a condition that a protection-required part is floated by protruding streak parts provided in both sides of a roll. CONSTITUTION:A conveying roll 10 has a cylindrical part 11 supported to a supporting shaft, flange part 12 formed in both sides of this cylindrical part 11 and rubber-made protruding streak parts 13 brought into contact with each flange part 12 and having a diameter larger than the cylindrical part 11, and the one flange part 12 can be removed relating to the cylindrical part 11. Thus in this conveying roll 10, a central part of a long scale object 20 is supported in a floating condition by bringing both sides of the long scale object 20 into contact with each protruding streak part 13. Further, when an auxiliary roller, shown by a virtual line, is brought into contact with both side surfaces of the long scale object 20 in an opposite side to each protruding streak part of the conveying roll 10, the long scale object 20 can be more surely conveyed.

10. 发明专利

JPH05102669A MANUFACTURE OF MULTILAYER PRINTED WIRING BOARD 失效
公开(公告)号：JPH05102669A
公开(公告)日：1993-04-23
申请号：JP32916991
申请日：1991-12-12
申请人： IBIDEN CO LTD
发明人： SUZUKI AYUMI , ASAI MOTOO
IPC分类号： H05K3/46
摘要： PURPOSE:To form recesses corresponding to via-holes on interlayer insulating layers easily and facilitate secure formation of small diameter via-holes by a method wherein columns which are made of photosensitive resin and provided on an inner layer patterns in required positions are dissolved and removed. CONSTITUTION:After photosensitive resin layers are formed on the surfaces of a substrate 1, the layers are exposed and developed to form columns 3 made of the photosensitive resin on internal layer conductor circuits 2 in positnons corresponding to via-holes. Resin of which interlayer insulators 4 are made is applied to the substrate 1 and recesses are formed in the interlayer insulators 4 by removing the columns 3 from the required positions on the inner layer conductor circuits 2. Conductor circuits are formed in the recesses and surfaces of the interlayer insulators 4. With this constitution, resin having excellent heat-resistance electrical insulation and moisture-resistant can be used as interlayer insulating material and, further, via-holes having small diameters can be formed with a high accuracy.

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