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1. 发明专利

JP2010184852A Low melting point glass composition, low-temperature sealing material using the same, and electronic component 有权
标题翻译：低熔点玻璃组合物，使用其的低温密封材料和电子组件
公开(公告)号：JP2010184852A
公开(公告)日：2010-08-26
申请号：JP2009174883
申请日：2009-07-28
申请人： Hitachi Powdered Metals Co Ltd , 日立粉末冶金株式会社
发明人： NAITO TAKASHI , TACHIZONO SHINICHI , YOSHIMURA KEI , HASHIBA YUJI , KANAZAWA KEIICHI , YAMADA SHINJI , AMO SATORU , YAMAMOTO HIROTAKA , AOYAGI TAKUYA
IPC分类号： C03C8/08 , C03C8/04 , C03C8/16 , C03C8/18 , C03C8/24 , H01J5/20 , H01J9/26 , H01J11/02 , H01J11/12 , H01J11/24 , H01J11/26 , H01J11/46 , H01J11/48
CPC分类号： C03C8/08 , C03C3/21 , C03C8/24 , H01L31/022425 , Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a low melting point glass composition substantially free from lead, bismuth and antimony, and sealable at ≤400°C, preferably at ≤380°C, after consideration on environment and safety; a low-temperature sealing material and an electrode material each using the same; also provide an electronic component applying these such as an IC ceramic package, a quartz oscillator, an image display, and a solar cell. SOLUTION: This low melting point glass composition having a softening point of ≤380°C, preferably ≤360°C, contains oxides of vanadium, phosphorus, tellurium and iron. The composition further contains at least one oxide of manganese, zinc, tungsten, molybdenum or barium. Another version of the low melting point glass composition having a softening point of ≤380°C, preferably ≤360°C, contains oxides of vanadium, phosphorus, tellurium, barium, and tungsten or molybdenum, further iron or an alkali metal. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种基本上不含铅，铋和锑的低熔点玻璃组合物，并且在环境和安全性考虑之后可以在≤400℃，优选≤380℃下密封; 各自使用低温密封材料和电极材料; 还提供了应用这些的电子部件，例如IC陶瓷封装，石英振荡器，图像显示器和太阳能电池。
解决方案：该软化点≤380℃，优选≤360℃的低熔点玻璃组合物含有钒，磷，碲和铁的氧化物。该组合物还含有至少一种锰，锌，钨，钼或钡的氧化物。软化点≤380℃，优选≤360℃的低熔点玻璃组合物的另一种版本包含钒，磷，碲，钡和钨或钼的氧化物，还有铁或碱金属。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2009209032A Glass composition 有权
标题翻译：玻璃组合物
公开(公告)号：JP2009209032A
公开(公告)日：2009-09-17
申请号：JP2008268074
申请日：2008-10-17
申请人： Hitachi Powdered Metals Co Ltd , 日立粉末冶金株式会社
发明人： NAITO TAKASHI , TACHIZONO SHINICHI , YOSHIMURA KEI , YAMAMOTO HIROTAKA , YOSHIDA HIROSHI , YAMADA SHINJI , MABUCHI KATSUMI
IPC分类号： C03C3/16 , C03C3/062 , C03C8/14 , C03C8/16 , C03C8/18 , H01J11/22 , H01J11/24 , H01J11/34 , H01J11/38 , H01L31/04 , H05B3/48
CPC分类号： H01J9/261 , C03C3/062 , C03C3/21 , C03C8/24 , H01J17/183 , H01L31/022425 , Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a glass composition which is substantially free of lead and bismuth, takes the environment, safeness and a cost into consideration, is good in moisture resistance, does not corrode electrode wiring with silver, copper, aluminum, etc., and can be softened at a low temperature; and to provide sealing, wiring, structural and optical materials using the composition; and to provide image-displaying devices such as a plasma display panel, and electronic devices such as a sheathed heater and a solar battery element using the materials. SOLUTION: The composition substantially containing neither lead nor bismuth, contains at least vanadium oxide and phosphorous oxide as main components and has a ≥10 9 Ωcm specific resistance at 25°C and a ≤500°C softening point. Manganese oxide and barium oxide are contained furthermore as components, and any one of the oxides of alkali metals, antimony, tellurium, zinc, silicon, aluminum, niobium, rare earth elements, iron, tungsten and molybdenum is preferably contained. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供基本上不含铅和铋的玻璃组合物，考虑到环境，安全性和成本，耐湿性良好，不会用银，铜，铝腐蚀电极布线等，可以在低温下软化; 并使用该组合物提供密封，布线，结构和光学材料; 并且使用这些材料提供诸如等离子体显示面板的图像显示装置和诸如护套加热器和太阳能电池元件的电子装置。
解决方案：基本上不含铅和铋的组合物至少含有氧化钒和氧化磷作为主要成分，并且在25℃和≤500℃下具有≥10Ω/ cm 3的电阻率 C软化点。另外还含有氧化锰和氧化钡作为成分，优选含有碱金属，锑，碲，锌，硅，铝，铌，稀土元素，铁，钨和钼的氧化物中的任一种。版权所有（C）2009，JPO＆INPIT

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