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1. 发明专利

JP2007318173A Multilayer ceramic substrate and its manufacturing method 审中-公开
标题翻译：多层陶瓷基板及其制造方法
公开(公告)号：JP2007318173A
公开(公告)日：2007-12-06
申请号：JP2007206714
申请日：2007-08-08
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： NAKADA MIYAKO , UEDA ITARU , ITO HIROYUKI , TANIGUCHI FUMITAKE
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multilayer ceramic substrate having such surface properties that poor plating or the like is reduced for an external electrode, and to provide a manufacturing method of a multilayer ceramic substrate suitable for attaining such surface properties. SOLUTION: An external electrode is formed on at least one side of an unburnt multilayer ceramic substrate 7 laminating green sheets 1a-1c for a substrate which can be burnt at a low temperature. A restriction layer principally comprising inorganic particles not sintered at the burning temperature of the unburnt multilayer ceramic substrate is provided tightly to both sides or one side of the unburnt multilayer ceramic substrate including the external electrode to form an integral laminate 10. After the integral laminate is burnt, the restriction layer is removed to manufacture a multilayer ceramic substrate 11. The surface roughness (arithmetic mean roughness Ra) of the external electrode is 0.1-6 μm after the restriction layer is removed. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供一种具有这样的表面性能的多层陶瓷基板，其对外部电极的电镀等减少，并且提供适于获得这种表面性能的多层陶瓷基板的制造方法。解决方案：在未烧结的多层陶瓷基板7的至少一侧上形成外部电极，层叠用于可在低温下燃烧的基板的生片1a-1c。在未烧结的多层陶瓷基板的燃烧温度下，主要包含未烧结的无机粒子的限制层紧密地设置在包含外部电极的未燃烧的多层陶瓷基板的两面或一侧，形成整体的叠层体10。烧制后，除去限制层以制造多层陶瓷基板11.除去限制层之后，外部电极的表面粗糙度（算术平均粗糙度Ra）为0.1-6μm。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2007318174A Method for manufacturing multilayer ceramic substrate and multilayer ceramic substrate manufactured thereby 有权
标题翻译：制造多层陶瓷基板和制造多层陶瓷基板的方法
公开(公告)号：JP2007318174A
公开(公告)日：2007-12-06
申请号：JP2007206715
申请日：2007-08-08
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： NAKADA MIYAKO , UEDA ITARU , ITO HIROYUKI , TANIGUCHI FUMITAKE
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multilayer ceramic substrate having such surface properties that poor plating or the like is reduced for an external electrode, and to provide a method for manufacturing a multilayer ceramic substrate suitable for attaining such surface properties.
SOLUTION: In a process for manufacturing a multilayer ceramic substrate, an unburnt multilayer ceramic substrate having a restriction layer for suppressing the contraction of the substrate surface is burnt and immersed into an etching liquid, and then the restriction layer is removed by performing ultrasonic cleaning in the etching liquid. Alternatively, an unburnt multilayer ceramic substrate having a restriction layer for suppressing the contraction of the substrate surface is burnt and immersed into the etching liquid, and then the restriction layer is removed by performing ultrasonic cleaning in the cleaning liquid.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有这样的表面性能的多层陶瓷基板，其对于外部电极减少了差的电镀等，并且提供了一种制造适合于获得这种表面性能的多层陶瓷基板的方法。解决方案：在制造多层陶瓷基板的方法中，将具有用于抑制基板表面的收缩的限制层的未燃烧的多层陶瓷基板烧焦并浸渍在蚀刻液中，然后通过执行在蚀刻液中进行超声波清洗。或者，将具有用于抑制基板表面的收缩的限制层的未燃烧的多层陶瓷基板燃烧并浸渍在蚀刻液中，然后通过在清洗液中进行超声波清洗除去限制层。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2006108483A Multilayered ceramic board having cavity and its manufacturing method 审中-公开
标题翻译：多层陶瓷板及其制造方法
公开(公告)号：JP2006108483A
公开(公告)日：2006-04-20
申请号：JP2004294878
申请日：2004-10-07
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： UEDA ITARU , NAKADA MIYAKO
IPC分类号： H05K3/46 , H01L23/12
CPC分类号： H01L24/97 , H01L24/73 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73257 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15192 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2924/00014 , H01L2224/81 , H01L2924/05432 , H01L2924/00012 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To prevent the occurrence of cracks in a cavity and suppress the occurrence of inclined portions, by suppressing the contraction of the front surface, in a multilayered ceramic board equipped with cavity and contraction of the inside of the cavity. SOLUTION: A first ceramic green sheet laminate and a second ceramic green sheet laminate, having a through hole are stacked and crimped to form the multilayer ceramic board having the cavity. On top and bottom faces of the board, constraint layers mainly formed of alumina are formed. Then, the unbaked multilayered ceramic board is baked, and thereafter the constraint layers are removed. In manufacturing the multilayer ceramic board, a cavity constraint layer which is mainly formed of alumina and is larger than the through hole is formed at a part of the first ceramic green sheet laminate, corresponding to the through hole. When the first and second ceramic green sheet laminates are stacked so that the peripheral edge of the cavity constraint layer overhangs the through hole and then crimping them together to fabricate the multilayered ceramic board, crimping processes by hydrostatic pressure press, etc. are performed twice, one after forming the cavity constraint layer and one after forming the constraint layers on top and bottom faces of the board. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题为了防止在空腔中发生裂纹并且通过抑制前表面的收缩来抑制倾斜部分的发生，在具有空腔和腔体内部的收缩的多层陶瓷板中。解决方案：将具有通孔的第一陶瓷生片层叠体和第二陶瓷生片层合体层叠并压接以形成具有空腔的多层陶瓷板。在板的顶面和底面上形成主要由氧化铝形成的约束层。然后，烘烤未烘烤的多层陶瓷板，然后除去约束层。在多层陶瓷板的制造中，在第一陶瓷生片层叠体的与贯通孔对应的部分形成有主要由氧化铝形成并且比通孔大的空腔限制层。当第一和第二陶瓷生片叠片层叠时，使空腔约束层的周边边缘突出于通孔，然后将它们压合在一起以制造多层陶瓷板，进行两次静水压力压接，一个在形成空腔约束层之后，一个在板的顶面和底面上形成约束层之后。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2006156948A Multi-layer ceramic substrate and multi-layer ceramic substrate manufacturing method 有权
标题翻译：多层陶瓷基板和多层陶瓷基板制造方法
公开(公告)号：JP2006156948A
公开(公告)日：2006-06-15
申请号：JP2005230227
申请日：2005-08-09
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： NAKADA MIYAKO , UEDA ITARU , ITO HIROYUKI , TANIGUCHI FUMITAKE
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multi-layer ceramic substrate having a surface property of less plating defective for an external electrode; and a multi-layer ceramic substrate manufacturing method applicable to obtain such a surface property. SOLUTION: The external electrode is formed on at least an upper surface of a non-sintered multi-layer ceramic substrate where a green sheet for substrate composed of a low temperature sintering ceramic material is laminated, and a constraint layer, whose main component is an inorganic particle not to sinter at the sintering temperature of the low temperature sintering ceramic material, is located to be adhered to the upper surface and/or lower surface including the external electrode of the non-sintered multi-layer ceramic substrate as an united laminated layer. In the multi-layer ceramic substrate where the constraint layer is removed after sintering the laminated layer, the proportion of metal constituting the inorganic particles remained on the external electrode to the sum of the metal constituting the external electrode and the metal constituting the inorganic particles is 10 mass% or less. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种对外部电极具有较少电镀缺陷的表面特性的多层陶瓷衬底; 以及适用于获得这种表面性质的多层陶瓷基板的制造方法。解决方案：外部电极形成在非烧结多层陶瓷基板的至少上表面上，其中层压由低温烧结陶瓷材料构成的基板的生片，其主要的约束层组分是在低温烧结陶瓷材料的烧结温度下不烧结的无机颗粒，被定位为粘附到包含非烧结多层陶瓷衬底的外部电极的上表面和/或下表面作为联合层压层。在烧结层叠层之后去除约束层的多层陶瓷基板中，构成外部电极的构成无机粒子的金属的比例与构成外部电极的金属和构成无机粒子的金属的和的比例为 10质量％以下。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2006108482A Multilayered ceramic board having cavity and its manufacturing method 有权
标题翻译：多层陶瓷板及其制造方法
公开(公告)号：JP2006108482A
公开(公告)日：2006-04-20
申请号：JP2004294877
申请日：2004-10-07
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： UEDA ITARU , NAKADA MIYAKO
IPC分类号： H05K3/46 , H01L23/12
CPC分类号： H01L24/97 , H01L2224/16 , H01L2224/16235 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2224/81 , H01L2924/05432 , H01L2224/85 , H01L2224/83 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To prevent the occurrence of cracks in a cavity and suppress the occurrence of inclined portions, by suppressing the contraction of the front surface, in a multilayer ceramic board equipped with cavity and contraction of the inside of the cavity. SOLUTION: A first ceramic green sheet laminate and a second ceramic green sheet laminate, having a through hole are stacked and crimped to form the multilayered ceramic board having the cavity. On top and bottom faces of the board, constraint layers formed mainly of alumina are formed. Then, the unbaked multilayer ceramic board is baked, and thereafter the constraint layers are removed. In manufacturing the multilayer ceramic board, a cavity constraint layer which is mainly formed of alumina and is larger than the through hole is formed at a part of the first ceramic green sheet laminate, corresponding to the through hole. The first and second ceramic green sheet laminates are so stacked that the peripheral edge of the cavity constraint layer so as to overhang the through hole and then are crimped to fabricate the multilayered ceramic board. Since a part of the cavity constraint layer remains at a part between the first and second ceramic green sheet laminates at the bottom of the cavity, the multilayer ceramic board has an interposed portion having a high concentration of alumina. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题为了防止在空腔中发生裂纹并抑制倾斜部分的发生，通过抑制前表面的收缩，在具有空腔和腔体内部的收缩的多层陶瓷板中。解决方案：将具有通孔的第一陶瓷生片层叠体和第二陶瓷生片叠层体层叠并压接以形成具有空腔的多层陶瓷板。在板的顶面和底面上形成主要由氧化铝形成的约束层。然后，烘烤未烘烤的多层陶瓷板，然后除去约束层。在多层陶瓷板的制造中，在第一陶瓷生片层叠体的与贯通孔对应的部分形成有主要由氧化铝形成并且比通孔大的空腔限制层。第一和第二陶瓷生片层压板被堆叠成使得空腔约束层的周边边缘突出于通孔，然后被压接以制造多层陶瓷板。由于空腔约束层的一部分保留在空腔底部的第一和第二陶瓷生片层叠体之间的一部分，所以多层陶瓷板具有高浓度的氧化铝的插入部分。版权所有（C）2006，JPO＆NCIPI

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