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1. 发明专利

JP2008254038A Method and equipment of manufacturing string solder 审中-公开
标题翻译：制造商的方法和设备
公开(公告)号：JP2008254038A
公开(公告)日：2008-10-23
申请号：JP2007100184
申请日：2007-04-06
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： ITO MOTOMICHI , KUBO KENICHI
IPC分类号： B23K35/40 , B22D11/00 , B22D11/06
摘要： PROBLEM TO BE SOLVED: To provide a string solder manufacturing method and equipment by which a solder more brittle than a conventionally used Sn-Pb based solder like a lead-free solder can be continuously formed as a string solder that has a nearly circular cross section and a diameter larger than 0.5 mm.
SOLUTION: This is a string solder manufacturing method by which a string solder is formed by discharging molten solder to the surface of a member that moves relatively at a prescribed speed. The method is characterized in that the member is adjusted at a prescribed temperature at least in the position where the molten solder is discharged, that the molten solder is discharged at the prescribed speed synchronized with the moving speed of the member, and that the string solder is formed by essentially solidifying the molten solder in a few seconds.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种串焊制造方法和设备，通过该焊料制造方法和设备可以连续地形成比诸如无铅焊料的常规使用的Sn-Pb基焊料更脆的焊料作为具有接近圆形横截面，直径大于0.5mm。解决方案：这是一种串焊制造方法，其中通过将熔融焊料排出到以规定速度相对移动的构件的表面形成串焊料。该方法的特征在于，至少在熔融焊料排出的位置将构件调整到规定的温度，熔融焊料以与构件的移动速度同步的规定速度排出，并且焊料通过在几秒钟内基本上使熔融焊料固化而形成。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2006303102A Mounting apparatus of conductive ball 有权
标题翻译：导电球安装装置
公开(公告)号：JP2006303102A
公开(公告)日：2006-11-02
申请号：JP2005121232
申请日：2005-04-19
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： ITO MOTOMICHI , KUBO KENICHI
IPC分类号： H01L21/60 , H05K3/34
CPC分类号： H01L2224/11005 , H01L2224/11334 , H01L2224/742
摘要： PROBLEM TO BE SOLVED: To provide a mounting apparatus for mounting conductive balls on arranged objects to be formed by cutting a number of substrates with improved mounting efficiency. SOLUTION: The mounting apparatus for mounting the conductive balls B on the arranged objects 7 in a prescribed pattern comprises a holder 31 to which the arranged objects 7 are set horizontally, a magnetism generator 314 mounted to the holder 31 so that it opposes the arranged objects 7, a mask 22 having a through hole in a prescribed pattern, and a shaking insertion tool 27 for moving the conductive balls B supplied onto the mask. The magnetism generator 314 has a plurality of magnetic domains, adjacent magnetic domains are arranged in different polarities, the arranged objects 7 are set so that a non-mounted section of the conductive balls B is present on the boundary of the magnetic domains of the magnetism generator 314. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于将导电球安装在通过以改进的安装效率切割多个基板而形成的布置对象上的安装装置。解决方案：用于以规定的图案将导电球B安装在布置的物体7上的安装装置包括：安置对象7水平设置的保持器31，安装到保持器31的磁性发生器314，使得它与布置的物体7，具有规定图案的通孔的掩模22和用于移动供给到掩模上的导电球B的摇动插入工具27。磁性发生器314具有多个磁畴，相邻的磁畴以不同的极性排列，所设置的物体7被设定为使导电球B的非安装部分存在于磁性磁畴的边界上发电机314.版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2006005276A Arraying mask of conductive ball, and arraying apparatus using thereof 有权
标题翻译：引导球的阵风，并使用它来安装装置
公开(公告)号：JP2006005276A
公开(公告)日：2006-01-05
申请号：JP2004182245
申请日：2004-06-21
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： OCHIAI MASANORI , ITO MOTOMICHI , KUBO KENICHI
IPC分类号： H01L21/60 , H05K3/34
CPC分类号： H01L24/742 , H01L2224/11005 , H01L2224/11334 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01042 , H01L2924/01074
摘要： PROBLEM TO BE SOLVED: To provide an improved mask for arraying a conductive ball and an arraying apparatus using thereof.
SOLUTION: The mask for arraying the conductive ball on a body to be arrayed by a prescribed arraying pattern is provided with an opening which is formed corresponding to the array pattern, and which the conductive ball can be put through; a non-opening part; and a projecting part formed on one surface of the non-opening part. The projecting part is formed surrounding the opening end of the opening.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供用于排列导电球的改进掩模和使用其的排列装置。解决方案：用于将导电球排列在要由规定阵列图案排列的主体上的掩模设置有对应于阵列图案形成的开口，导电球可以通过; 不开放部分; 以及形成在所述非开口部的一个表面上的突出部。突出部围绕开口的开口端形成。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2005265506A Manufacturing device and method of micro sphere 审中-公开
标题翻译： MICRO SPHERE的制造装置和方法
公开(公告)号：JP2005265506A
公开(公告)日：2005-09-29
申请号：JP2004075776
申请日：2004-03-17
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： YAGIHARA KIYOSHI , TAKAHASHI RUI , KUBO KENICHI
IPC分类号： G01B11/08 , B22F9/08
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing device and method enabling to manufacture micro spheres having a desired size.
SOLUTION: The micro sphere manufacturing device comprises a manufacturing part which manufactures micro spheres, and a measuring part which comprises a sampling means which samples a part of the micro spheres and a measuring means which measures the size of the sampled micro spheres. The measuring means comprises a translucent mounting member on which the sampled micro spheres are dispersed, an illuminating means which forms inspection images of the micro spheres dispersed on the mounting member, an imaging means which takes the inspection images of the micro spheres, and a calculation means which calculates the size of the micro spheres based on the inspection images taken by the imaging means.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供能够制造具有所需尺寸的微球的制造装置和方法。解决方案：微球制造装置包括制造微球的制造部件和测量部件，其包括对一部分微球进行取样的取样装置和测量取样的微球尺寸的测量装置。测量装置包括半透明安装构件，分散有取样微球体的照射装置，形成分散在安装构件上的微球的检查图像的照明装置，摄取微球的检查图像的成像装置和计算基于由成像装置拍摄的检查图像计算微球尺寸的装置。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2010194593A Molten metal charging tool, and joining device equipped with the same tool 有权
标题翻译： MOLTEN金属充电工具，以及配备相同工具的接合装置
公开(公告)号：JP2010194593A
公开(公告)日：2010-09-09
申请号：JP2009044076
申请日：2009-02-26
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： ITO MOTOMICHI , KUBO KENICHI
IPC分类号： B23K3/06 , C03C27/08
摘要： PROBLEM TO BE SOLVED: To provide a charging tool and a joining device, capable of preventing a molten metal from largely swelling on or drooping from the end part face of a plate material when filling the outer edge gap of a pair of plate materials with the molten metal, and, in particular, capable of filling the gap of plate materials having edges shifted from each other, while hardly making the molten metal squeeze out on the extruded face and making the width of the welded layer constant.
SOLUTION: The molten metal charging tool has a feeding cylinder having a flow passage for a molten metal, and has a guide plate attached to the discharging port side of the feeding cylinder, at which port the flow passage is opened. The front end of the guide plate of the tool is inserted into the outer edge gap of a pair of plate materials, which are vertically disposed interposing a gap part, and the molten metal discharged from the feeding cylinder is guided into the outer edge gap. The guide plate is attached to the lower part of the discharging port or beneath thereof, so that the molten metal discharged from the discharging port is made to flow out from the upper face of the guide plate.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种充填工具和接合装置，当填充一对板的外缘间隙时，能够防止熔融金属在板材的端部面上大幅膨胀或下垂具有熔融金属的材料，特别是能够填充具有彼此偏移的边缘的板材的间隙，同时几乎不使熔融金属挤压在挤出的表面上并使焊接层的宽度恒定。解决方案：熔融金属加料工具具有一个具有用于熔融金属的流动通道的进料圆筒，并具有一个引导板，该引导板安装在进料圆筒的排出口侧，该流道在该开口处被打开。工具的引导板的前端插入一对板材的外缘间隙中，该一对板材垂直地设置有间隙部分，并且从进料筒排出的熔融金属被引导到外边缘间隙中。引导板附接到排出口的下部或其下方，使得从排出口排出的熔融金属从导向板的上表面流出。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2010168223A Molten metal filling tool and molten metal filling apparatus provided therewith 有权
标题翻译：金属填充工具和金属填充设备
公开(公告)号：JP2010168223A
公开(公告)日：2010-08-05
申请号：JP2009009415
申请日：2009-01-20
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： ITO MOTOMICHI , KUBO KENICHI
IPC分类号： C03C27/06
摘要： PROBLEM TO BE SOLVED: To provide a molten metal filling tool which is improved compared to the conventional technique, and to provide a molten metal filling apparatus using the same. SOLUTION: The filling tool which is moved along the outer peripheries of a pair of glass substrates in which the mutual main faces are arranged via a gap, and fills a molten metal in the outer circumferential gap, includes a trowel part which has a first flat face confronted with the main face of one glass substrate via a prescribed gap and a second flat face confronted with the main face of the other glass substrate via a prescribed gap, and constituted so as to be inserted into the outer circumferential gap of the pair of glass substrates, and a first guide part projecting from the first flat face of the trowel part and capable of coming in contact with the main face of the one glass substrate and/or a second guide part projecting from the second flat face of the trowel part and capable of coming in contact with the main face of the other glass substrate. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种与常规技术相比提高的熔融金属填充工具，并提供一种使用该熔融金属填充工具的熔融金属填充装置。解决方案：沿着一对玻璃基板的外周移动的填充工具，其中相互的主面通过间隙布置，并且填充外周间隙中的熔融金属，包括t刀部分，其具有经由规定间隙与一个玻璃基板的主面对置的第一平面和与另一玻璃基板的主面经由规定间隙对置的第二平面，构成为插入到另一玻璃基板的外周间隙所述一对玻璃基板和从所述t刀部的所述第一平坦面突出并且能够与所述一个玻璃基板的主面接触的第一引导部和/或从所述一个玻璃基板的主面突出的第二引导部 t刀部分并且能够与另一玻璃基板的主面接触。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2010012796A Screen printing device 审中-公开
标题翻译：屏幕打印设备
公开(公告)号：JP2010012796A
公开(公告)日：2010-01-21
申请号：JP2009237836
申请日：2009-10-15
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： ITO MOTOMICHI , KUBO KENICHI
IPC分类号： B41F15/36 , B41F15/08 , H05K3/34
CPC分类号： H05K3/1233 , B41F15/34 , B41F15/426 , B41F15/44 , B41P2215/14 , H05K2203/0139 , H05K2203/0264 , H05K2203/104
摘要： PROBLEM TO BE SOLVED: To provide a screen printing device having improved plate-separability of a print member immediately after printing a printing material, and a screen printing method.
SOLUTION: The screen printing device includes: a printing member that has an elastic and soft magnetic print member having an opening of a predetermined pattern and a print area to which a print material is supplied, and one surface positioned in a predetermined position relationship to one surface of a printed body, and that has a support part supporting the printing member; a supply means that supplies the print material to the print area while pressing the print area from another surface side of the print member positioned to the printed body and can move at least in one direction above the print member; and a magnetic force-generating means that is arranged behind the supply means in the movement direction of the supply means so as to include the print area, moves synchronously with the supply means and pulls up the print member wherein the magnetic force-generating means has a plurality of magnetic domains on one surface facing to the print member, and the adjacent magnetic domains have different magnetic poles from each other.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种丝网印刷装置，其在印刷印刷材料之后立即改善印刷部件的平板分离性，并提供丝网印刷方法。丝网印刷装置包括：印刷部件，其具有具有预定图案的开口的弹性和软磁性打印部件以及供给打印材料的打印区域，以及位于预定位置的一个表面与印刷体的一个表面的关系，并且具有支撑印刷部件的支撑部; 供给装置，其将印刷材料供应到打印区域，同时从位于印刷体的打印构件的另一表面侧按压打印区域，并且可以至少在打印构件上方的一个方向上移动; 以及磁力产生装置，其在所述供给装置的所述运送方向的后方布置在所述供给装置的运动方向上以包括所述打印区域，与所述供应装置同步地移动并拉动所述打印部件，其中所述磁力产生装置具有在面向打印构件的一个表面上的多个磁畴，并且相邻的磁畴具有彼此不同的磁极。版权所有（C）2010，JPO＆INPIT

8. 发明专利

JP2009206336A Conductive ball mounting device and conductive ball mounting method 审中-公开
标题翻译：导电球安装装置和导电球安装方法
公开(公告)号：JP2009206336A
公开(公告)日：2009-09-10
申请号：JP2008048012
申请日：2008-02-28
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： ITO MOTOMICHI , SAKURAI TATSUYA , KUBO KENICHI
IPC分类号： H01L21/60 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a conductive ball mounting device and a conductive ball mounting method, in which a supplementary ball with a diameter of 300 μm or less is mounted in a non-mounted electrode of a substrate in which conductive balls are already mounted in a plurality of electrodes. SOLUTION: A conductive ball mounting device 10 includes: an absorption nozzle 31 which has an absorption opening which can absorb one supplementary solder ball 40 (supplementary ball); a vacuum source which performs the vacuum suction of the inside of the absorption nozzle; and an air supply source which supplies air into the absorption nozzle. The air supply source is connected to the absorption nozzle 31 through a first air amount control means which is set to be capable of supplying a predetermined amount of air which can keep the supplementary ball being adhered to the absorption opening even after destroying the vacuum in the absorption nozzle by the vacuum source, and a second air amount control means which is set to be capable of momentarily supplying a predetermined amount of air which separates the supplementary ball from the absorption opening. The second air capacity control means operates after the operation of the first air capacity control means. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种导电球安装装置和导电球安装方法，其中将直径为300μm以下的辅助球安装在基板的非安装电极中，其中导电球已经安装在多个电极中。导电球安装装置10包括：吸收喷嘴31，其具有吸收一个补充焊球40（辅助球）的吸收开口; 执行吸收喷嘴内部的真空抽吸的真空源; 以及将空气供给到吸收喷嘴中的空气供给源。空气供应源通过第一空气量控制装置连接到吸收喷嘴31，该第一空气量控制装置被设置为能够提供预定量的空气，即使在破坏真空中之后也能够将辅助球粘附到吸收开口以及第二空气量控制装置，该第二空气量控制装置被设置为能够暂时地将预定量的空气从吸收开口分离。第二空气量控制装置在第一空气容量控制装置的操作之后操作。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2008091633A Method and device of mounting conductive balls 审中-公开
标题翻译：安装导电棒的方法和装置
公开(公告)号：JP2008091633A
公开(公告)日：2008-04-17
申请号：JP2006271018
申请日：2006-10-02
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： ITO MOTOMICHI , KUBO KENICHI
IPC分类号： H01L21/60 , H01L23/12 , H05K3/34
CPC分类号： H01L24/742 , H01L21/4853 , H01L24/94 , H01L2224/11 , H01L2224/11005 , H01L2224/11334 , H01L2224/117 , H01L2224/11849 , H01L2224/13 , H01L2224/131 , H01L2224/13111 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1318 , H01L2224/13184 , H01L2224/1319 , H01L2224/136 , H01L2224/94 , H05K3/3478 , H05K2203/0139 , H05K2203/041 , H05K2203/0557 , H05K2203/074 , H01L2924/014 , H01L2924/00012 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method of mounting conductive balls which can enhance an adhesion between a mask and a member to be arrayed while avoiding generation of excessive balls in mounting the conductive balls on the array member with use of the mask, and to provide a device for mounting the balls. SOLUTION: The method relates to mounting conductive balls on a member to be arrayed with use of a predetermined array pattern and includes a positioning step of positioning a mask relative to the array member, a pushing step of pushing the mask under influence of a fluid, and an inserting step of inserting conductive balls in positioning openings of the mask formed as the predetermined array pattern. When the surface of the mask to be pushed under influence of the liquid forms part of the inner wall of a tightly-sealed chamber, it is preferable that the pressure of the liquid for pushing the mask nearly uniformly act on the mask in a direction of the flat surface of the mask. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种安装导电球的方法，其可以增强掩模和要排列的构件之间的粘附，同时避免在使用掩模将导电球安装在阵列构件上时产生过多的球并且提供一种用于安装球的装置。解决方案：该方法涉及使用预定的阵列图案将导电球安装在要排列的构件上，并且包括相对于阵列构件定位掩模的定位步骤，在掩模的作用下推动掩模的推动步骤流体和将导电球插入形成为预定阵列图案的掩模的定位开口中的插入步骤。当在液体影响下被推入的掩模的表面形成密封室的内壁的一部分时，优选地，用于推动掩模的液体的压力几乎均匀地作用在掩模上，面罩的平面。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2007090188A Printing material coating method and printing material coater 审中-公开
标题翻译：印刷材料涂料方法和印刷材料涂料
公开(公告)号：JP2007090188A
公开(公告)日：2007-04-12
申请号：JP2005281208
申请日：2005-09-28
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： ITO MOTOMICHI , KUBO KENICHI
IPC分类号： B05D1/28 , B05C1/02 , H01L21/60 , H05K3/34
CPC分类号： H01L24/742 , H01L2224/1132 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029
摘要： PROBLEM TO BE SOLVED: To provide a printing material coating method and a printing material coater which absorb a variation of the height of a place to be coated and coat a printing material even if the height is different depending on the place as a deformation, etc. generates on a body to be coated when the body to be coated is coated with the printing material of liquid state in a determined pattern. SOLUTION: The printing material coating method is employed to coat one surface of the body to be coated with the coating material of liquid state in the determined pattern, wherein a projecting part of a coating means, which has a projecting part corresponding to the pattern, a flexible part, which keeps the projecting part arrayed over the surface, and a supporting part for supporting the flexible part, is made to be positioned on the surface of the body to be coated and is made to be abutted on the surface of the body to be coated while the position of the supporting part is held. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种吸收被涂覆地方的高度变化并涂覆印刷材料的印刷材料涂布方法和印刷材料涂布机，即使高度根据位置不同而不同当待涂覆的物体以确定的图案涂覆有液体状态的印刷材料时，在待涂覆的主体上产生变形等。解决方案：使用印刷材料涂布方法，以确定的图案涂覆待涂覆液体涂层材料的一个表面，其中涂覆装置的突出部分具有对应于图案，将突出部分排列在表面上的柔性部分和用于支撑柔性部分的支撑部分被定位在待涂覆的主体的表面上并且被制成邻接在表面上的被保持体的位置。版权所有（C）2007，JPO＆INPIT

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