专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2007273982A Method of manufacturing semiconductor module 有权
标题翻译：制造半导体模块的方法
公开(公告)号：JP2007273982A
公开(公告)日：2007-10-18
申请号：JP2007078132
申请日：2007-03-26
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： SOGA TASAO , SHIMOKAWA HIDEYOSHI , NAKATSUKA TETSUYA , NEGISHI MIKIO , NAKAJIMA KOICHI , ENDO TSUNEO
IPC分类号： H05K3/34 , B23K1/00 , B23K35/14 , B23K35/22 , B23K35/26 , B23K101/42 , C22C13/00 , H01L21/60 , H01L25/00
CPC分类号： H01L2224/16 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/01012 , H01L2924/01046 , H01L2924/01322 , H01L2924/01327 , H01L2924/09701 , H01L2924/10253 , H01L2924/13091 , H01L2924/15153 , H01L2924/1517 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide the method of manufacturing a semiconductor module having a temperature hierarchy connection in which the defect of a void is reduced and the connection reliability of a high temperature side connection portion is maintained even in the case where the soldering of a lead-free solder material is carried out in the air. SOLUTION: There is provided the method of manufacturing an electron device comprising an electron component, a first substrate on which the electron component is mounted, and a second substrate on which the first substrate is mounted. The method comprises the first step of connecting the electrode of the electron component and the electrode of the first substrate by reflowing first lead-free solder which has a metal ball whose melting point is higher than those of an Sn solder ball and the Sn solder at temperature equal to or more than 240°C and equal to or less than the heat-resistant temperature of the electron component and in which the metal ball is covered with an Ni layer and the Ni layer is covered with an Au layer, and the second step of connecting the first substrate on which the electron component is mounted and the second substrate by reflowing second lead-free solder at temperature lower than a reflow temperature in the first step. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供制造具有温度层级连接的半导体模块的方法，其中空隙的缺陷减小，并且即使在高温侧连接部分的连接可靠性仍然保持的情况下，在空气中进行无铅焊料的焊接。提供了制造电子器件的方法，该电子器件包括电子元件，其上安装有电子元件的第一衬底和安装有第一衬底的第二衬底。该方法包括通过回流第一无铅焊料将第一衬底的电子部件的电极和第一衬底的电极连接在一起的第一步骤，其具有熔点高于Sn焊球的金属球，并且Sn焊料在温度等于或高于240℃，并且等于或小于电子部件的耐热温度，并且其中金属球被Ni层覆盖并且Ni层被Au层覆盖，并且第二通过在第一步骤中低于回流温度的温度下回流第二无铅焊料来连接其上安装有电子成分的第一基板和第二基板的步骤。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2005026702A Electronic apparatus, semiconductor device and semiconductor module 有权
标题翻译：电子设备，半导体器件和半导体器件
公开(公告)号：JP2005026702A
公开(公告)日：2005-01-27
申请号：JP2004234020
申请日：2004-08-11
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： SOGA TASAO , SHIMOKAWA HIDEYOSHI , NAKATSUKA TETSUYA , MIURA KAZUMA , NEGISHI MIKIO , NAKAJIMA KOICHI , ENDO TSUNEO
IPC分类号： B23K1/00 , B23K3/06 , B23K35/14 , B23K35/22 , B23K35/24 , B23K35/26 , B23K35/28 , B23K35/30 , B23K101/40 , C22C5/02 , C22C5/06 , C22C9/02 , C22C13/00 , C22C28/00 , H01L21/50 , H01L21/52 , H01L21/56 , H01L21/60 , H01L23/10 , H01L23/12 , H01L23/31 , H01L23/36 , H01L23/367 , H01L23/433 , H01L23/485 , H01L23/492 , H01L23/495 , H01L23/50 , H05K1/14 , H05K3/34
CPC分类号： H01L24/13 , B32B15/01 , C22C5/02 , C22C9/02 , C22C11/06 , C22C13/00 , H01L21/50 , H01L21/56 , H01L21/563 , H01L23/10 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/4924 , H01L23/49513 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/16 , H01L2224/0401 , H01L2224/06102 , H01L2224/11334 , H01L2224/1134 , H01L2224/1147 , H01L2224/13099 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/16235 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29294 , H01L2224/29298 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/81024 , H01L2224/81054 , H01L2224/81203 , H01L2224/81205 , H01L2224/8121 , H01L2224/81409 , H01L2224/81815 , H01L2224/8319 , H01L2224/83801 , H01L2224/97 , H01L2924/00011 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15738 , H01L2924/1576 , H01L2924/15787 , H01L2924/16152 , H01L2924/16315 , H01L2924/166 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/141 , H05K3/3463 , H05K3/3484 , H05K2201/0215 , H05K2201/045 , H05K2201/09572 , H05K2201/10636 , Y02P70/611 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2924/01031 , H01L2924/01026 , H01L2924/3512 , H01L2924/00015 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/83205
摘要： PROBLEM TO BE SOLVED: To provide an electronic apparatus having novel solder connections, especially, one realizing solder connections at a high temperature side in a temperature hierarchical connection. SOLUTION: A connection part between a semiconductor device and a substrate is made of metal balls, such as Cu balls and a compound of Sn with the metal balls, and the metal balls are connected by the compound. A primary substrate having electronic components is mounted on a secondary substrate, such as a printed circuit board and a mother board, in the electronic apparatus. Connections between the electronic components and the primary substrate are established by reflowing a solder paste having the Cu balls and Sn solder balls. Connections between the primary substrate and the secondary substrate are established by reflowing a Sn-(2.0 to 3.5) mass% Ag-(0.5 to 1.0) mass% Cu solder. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供具有新型焊接连接的电子设备，特别是在温度分层连接中实现高温侧的焊接连接。解决方案：半导体器件和衬底之间的连接部分由诸如Cu球的金属球和Sn与金属球的化合物制成，并且金属球通过化合物连接。具有电子部件的主基板安装在电子设备中的诸如印刷电路板和母板的二次基板上。通过回流具有Cu球和Sn焊球的焊膏来建立电子部件和初级基板之间的连接。通过回流Sn-（2.0〜3.5）质量％Ag-（0.5〜1.0）质量％铜焊料来建立初级衬底和次级衬底之间的连接。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2005229113A Electronic apparatus, semiconductor device and semiconductor module 有权
标题翻译：电子设备，半导体器件和半导体器件
公开(公告)号：JP2005229113A
公开(公告)日：2005-08-25
申请号：JP2005028375
申请日：2005-02-04
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： SOGA TASAO , SHIMOKAWA HIDEYOSHI , NAKATSUKA TETSUYA , MIURA KAZUMA , NEGISHI MIKIO , NAKAJIMA KOICHI , ENDO TSUNEO
IPC分类号： B23K1/00 , B23K3/06 , B23K35/14 , B23K35/22 , B23K35/24 , B23K35/26 , B23K35/28 , B23K35/30 , B23K101/40 , C22C5/02 , C22C5/06 , C22C9/02 , C22C13/00 , C22C28/00 , H01L21/50 , H01L21/52 , H01L21/56 , H01L21/60 , H01L23/10 , H01L23/12 , H01L23/31 , H01L23/36 , H01L23/367 , H01L23/433 , H01L23/485 , H01L23/492 , H01L23/495 , H01L23/50 , H05K1/14 , H05K3/34
CPC分类号： H01L24/13 , B32B15/01 , C22C5/02 , C22C9/02 , C22C11/06 , C22C13/00 , H01L21/50 , H01L21/56 , H01L21/563 , H01L23/10 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/4924 , H01L23/49513 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/16 , H01L2224/0401 , H01L2224/06102 , H01L2224/11334 , H01L2224/1134 , H01L2224/1147 , H01L2224/13099 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/16235 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29294 , H01L2224/29298 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/81024 , H01L2224/81054 , H01L2224/81203 , H01L2224/81205 , H01L2224/8121 , H01L2224/81409 , H01L2224/81815 , H01L2224/8319 , H01L2224/83801 , H01L2224/97 , H01L2924/00011 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15738 , H01L2924/1576 , H01L2924/15787 , H01L2924/16152 , H01L2924/16315 , H01L2924/166 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/141 , H05K3/3463 , H05K3/3484 , H05K2201/0215 , H05K2201/045 , H05K2201/09572 , H05K2201/10636 , Y02P70/611 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2924/01031 , H01L2924/01026 , H01L2924/3512 , H01L2924/00015 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/83205
摘要： PROBLEM TO BE SOLVED: To provide an electronic apparatus assembled by temperature-hierarchical bonding using a solder capable of maintaining a bonding strength at high temperature, a new solder paste, a method of solder bonding, and a soldered joint structure. SOLUTION: A connection between a semiconductor device and a substrate is formed of metal balls made of Cu or the like and compounds formed of metal balls and Sn, and the metal balls are bonded together by the compounds. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种通过使用能够保持高温下的接合强度的焊料进行温度分级接合而组装的电子设备，新的焊膏，焊接方法和焊接接头结构。解决方案：半导体器件和衬底之间的连接由由Cu等制成的金属球和由金属球和Sn形成的化合物形成，金属球通过化合物结合在一起。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2003297873A Semiconductor device, structure and electronic device 审中-公开
标题翻译：半导体器件，结构和电子器件
公开(公告)号：JP2003297873A
公开(公告)日：2003-10-17
申请号：JP2002093558
申请日：2002-03-29
申请人： Hitachi Ltd , Renesas Eastern Japan Semiconductor Inc , 株式会社ルネサス東日本セミコンダクタ , 株式会社日立製作所
发明人： TAKAHASHI YOSHIMASA , KURIHARA YASUTOSHI , KODAMA HIRONORI , ENDO TSUNEO , SAKURAI YOSUKE , NAKAJIMA KOICHI , NEGISHI MIKIO
IPC分类号： B23K35/26 , C22C5/02 , C22C11/06 , C22C13/00 , H01L21/60
CPC分类号： H01L24/97 , H01L24/01 , H01L24/73 , H01L2224/16145 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/83851 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/09701 , H01L2924/10329 , H01L2924/13091 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/30105 , H01L2924/3025 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2224/92247 , H01L2924/00012 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device for which the flow-out of a primary mounting solder material and short-circuit, the disconnection and the position deviation of a chip component due to the flow-out are prevented when loading the semiconductor device composed by loading the chip component on a substrate and resin-sealing the loaded chip component on an external wiring board. SOLUTION: For the semiconductor device, a solder layer fixing the chip component and a wiring member is sealed with a resin layer, and the solder layer is constituted of a composite material for which non-metal powder is dispersed in a matrix metal. Thus, for the semiconductor device, the flow-out of the solder material and the short-circuit, the disconnection and the position deviation of the chip component due to the flow-out at secondarily mounting the semiconductor device composed by loading the chip component on the wiring member by the solder material and resin-sealing the soldered part on an external wiring member can be prevented. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了提供一种主要安装焊料流出和短路的半导体器件，当加载时防止由于流出而导致的芯片部件的断开和位置偏移所述半导体器件通过将芯片部件加载在基板上并将负载的芯片部件树脂密封在外部布线板上而构成。解决方案：对于半导体器件，用树脂层密封固定芯片部件和布线部件的焊料层，并且焊料层由非金属粉末分散在基体金属中的复合材料构成。因此，对于半导体器件，由于在二次安装通过将芯片部件加载而构成的半导体器件的流出时，芯片部件的流出和短路，芯片部件的断开和位置偏移可以防止通过焊料的配线构件和将焊接部件树脂密封在外部配线构件上。版权所有（C）2004，JPO

5. 发明专利

JP2003260587A SOLDER 审中-公开
公开(公告)号：JP2003260587A
公开(公告)日：2003-09-16
申请号：JP2002064251
申请日：2002-03-08
申请人： HITACHI LTD
发明人： SOGA TASAO , SHIMOKAWA HIDEYOSHI , NAKATSUKA TETSUYA , NEGISHI MIKIO , NAKAJIMA KOICHI , ENDO TSUNEO
IPC分类号： B23K35/14 , B23K35/02 , B23K35/26 , H01L21/60 , H01L23/10 , H01L23/12 , H01L23/498 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide electronic equipment using novel solder joint particularly to realize a solder joint on a high temperature side in a temperature layering connection. SOLUTION: A connection between a semiconductor device and a substrate is formed of metallic balls of Cu or the like and a compound of the metallic ball and Sn. The metallic balls are connected to one another through the compound. COPYRIGHT: (C)2003,JPO

6. 发明专利

JP2002280396A ELECTRONIC APPARATUS, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE 审中-公开
公开(公告)号：JP2002280396A
公开(公告)日：2002-09-27
申请号：JP2001376582
申请日：2001-12-11
申请人： HITACHI LTD
发明人： SOGA TASAO , SHIMOKAWA HIDEYOSHI , NAKATSUKA TETSUYA , MIURA KAZUMA , NEGISHI MIKIO , NAKAJIMA KOICHI , ENDO TSUNEO
IPC分类号： B23K1/00 , B23K3/06 , B23K35/14 , B23K35/22 , B23K35/24 , B23K35/26 , B23K35/28 , B23K35/30 , B23K101/40 , C22C5/02 , C22C5/06 , C22C9/02 , C22C13/00 , C22C28/00 , H01L21/50 , H01L21/52 , H01L21/56 , H01L21/60 , H01L23/10 , H01L23/12 , H01L23/31 , H01L23/36 , H01L23/367 , H01L23/433 , H01L23/485 , H01L23/492 , H01L23/495 , H01L23/50 , H05K1/14 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a novel electronic apparatus having solder connections, especially, realize solder connections at a high temperature side in a temperature hierarchical connection. SOLUTION: A connection between a semiconductor device, and a substrate is made of metal balls such as Cu balls and a compound of Sn with the metal ball, and the metal balls are connected by the compound.

7. 发明专利

JP2002254194A ELECTRONIC EQUIPMENT 审中-公开
公开(公告)号：JP2002254194A
公开(公告)日：2002-09-10
申请号：JP2001376583
申请日：2001-12-11
申请人： HITACHI LTD
发明人： SOGA TASAO , SHIMOKAWA HIDEYOSHI , NAKATSUKA TETSUYA , MIURA KAZUMA , NEGISHI MIKIO , NAKAJIMA KOICHI , ENDO TSUNEO
IPC分类号： B23K1/00 , B23K3/06 , B23K35/14 , B23K35/22 , B23K35/24 , B23K35/26 , B23K35/28 , B23K35/30 , B23K101/40 , C22C5/02 , C22C5/06 , C22C9/02 , C22C13/00 , C22C28/00 , H01L21/50 , H01L21/52 , H01L21/56 , H01L21/60 , H01L23/10 , H01L23/12 , H01L23/31 , H01L23/36 , H01L23/367 , H01L23/433 , H01L23/485 , H01L23/492 , H01L23/495 , H01L23/50 , H05K1/14 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a soldering material realizing soldering joint for an electronic equipment by the new solder joint, in particular solder joint on the high temperature side in temperature hierarchical joint. SOLUTION: After the solder joint part of a semiconductor device and a board are soldered, a compound 3 containing Sn, etc., is formed around a ball 1 of metals such as Cu, Al, Au and Ag or a metal alloy, the metal ball 1 is connected by the compound 3. The brazing filler metal is provided by the paste containing a mixture of the ball 1 of the metal such as Cu, Al, Au, and Ag or the metal alloy and a metal ball 2 of Sn or In.

8. 发明专利

JPH1174422A MOLDING METHOD AND DEVICE OF SEMICONDUCTOR DEVICE AND ITS RESIN SEALING BODY 失效
公开(公告)号：JPH1174422A
公开(公告)日：1999-03-16
申请号：JP25000097
申请日：1997-08-28
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： NAKAJO TAKUYA , NAKAJIMA KOICHI , ENDO TSUNEO
IPC分类号： B42D15/10 , B29C45/02 , B29C45/26 , H01L21/56 , H01L23/28
摘要： PROBLEM TO BE SOLVED: To prevent the gate traces from remaining on a resin sealed body or the releasing force from damaging a sheet, by providing the gate on the opposing main surface to a base in the cavities for molding the resin sealed body. SOLUTION: The traces of a gate to fill the cavties with liquid resin are on the opposing main surface of a base 15 in a resin sealed body 28. That is, after the formation of the resin sealed body 28, when the gate traces formed by the gate are separated from the resin sealed body 28, the gate traces in no contact with the base 15 are in the state rectangularly protruding from one main surface of the resin sealing body 28. Resultantly, the gate traces can be cleanly scraped off from the top face of the resin sealed body 28 simultaneously making feasible of preventing the releasing force from damaging the base 15.

9. 发明专利

JPH10199910A SEMICONDUCTOR DEVICE, MANUFACTURE THEREOF AND IC CARD USING THE SAME 失效
公开(公告)号：JPH10199910A
公开(公告)日：1998-07-31
申请号：JP25000197
申请日：1997-08-28
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： NAKAJIMA KOICHI , ARAI NORINAGA , UEHARA KAZUAKI , NAKAJO TAKUYA , TAKESHITA KAZUYUKI , ENDO TSUNEO , SATO TSUNEO
IPC分类号： B42D15/10 , G06K19/077 , H01L21/56 , H01L21/60 , H01L23/28
摘要： PROBLEM TO BE SOLVED: To provide a flexible COB(chip-on-board package) IC having a specified strength for flexible IC cards. SOLUTION: A flexible COB/IC 10 having a specified strength for IC cards is composed of a carrier 12 and a chip 21. The carrier 12 is an insulating flexible sheets 15 having eight outer side leads at both sides of a center outer lead 16a on one main surface, with connection holes 18 bored at positions facing side outer leads 16. The chip 21 is disposed in a hole 17 at the center of the sheet 15 and fixed to the center outer lead 16a, through an insulative adhesive layer 24. Wires 26 bonded to electrode pads 22 of the chip 21 are connected to respective side outer leads 16 at the connection holes 18. The chip 21 and wires 26 on the sheet 15 are sealed with a resin, to form a resin sealed body 28 having a convex part 29 at the top surface.

10. 发明专利

JPH04280667A HIGH INTEGRATED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH04280667A
公开(公告)日：1992-10-06
申请号：JP4389191
申请日：1991-03-08
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： NAKAJIMA KOICHI , ENDO TSUNEO
IPC分类号： H01L25/18 , H01L25/10 , H01L25/11 , H05K1/14 , H05K3/36
摘要： PURPOSE:To obtain a high integrated semiconductor device which is hardly enlarged in size even if semiconductor chips are increased in number by a method wherein wiring boards are arranged nearly in parallel at prescribed intervals, which are assembled into a multiboard structure with a single lead wire. CONSTITUTION:A chip 1 is mounted on a wiring board 2 through the intermediary of adhesive agent or the like, a wiring pattern 3 is provided onto the upside of the board 2, and the front and the rear of the board 2 are electrically connected together to constitute a rigid wiring board. For instance, the rear and the front of a printed board are electrically connected together through a through-hole wiring 4, and the through-hole wirings 4 are connected to the terminals provided onto the chip 1 through a wiring pattern 3 and a bonding wire 5 of the board 2. Solderable lands 4A are formed around the through-hole wirings 4 provided to the front and the rear of the board 2, a solder guide line 4B formed of the same material with the wiring is provided extending from a part near the end of the board 2 to the land 4A, a lead wire 7 and the land 4A are surely soldered to each other even if the gap is narrow.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式