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    • 8. 发明专利
    • SEMICONDUCTOR DEVICE
    • JPS61287155A
    • 1986-12-17
    • JP12806885
    • 1985-06-14
    • HITACHI LTD
    • KOBAYASHI SHIROITO MASAHIKOMINATO AKIRA
    • H01L23/02H01L21/56H01L23/28H01L23/29H01L23/31H01L23/49
    • PURPOSE:To obtain excellent dampproofing and corrosion resistance by bringing a semiconductor device after wire bonding into contact with a nonaqueous solvent, into which an organic substance generating a metal-organic matter compound insoluble to water is dissolved, forming a compound and sealing the semiconductor device with a resin. CONSTITUTION:Triazoles are preferable as a compound formation type organic matter. A chip such as a silicon chip 1 is mounted onto lead frames 2, and Cu wires 3 are bonded with Ag electrodes 4 for the lead frames 2 and Al electrodes 5 for the silicon chip 1. The semiconductor device is dipped into an ethyl alcohol solution into which benzotriazole is dissolved, a compound of a metal-the organic matter is shaped on the surface, and the semiconductor device is pulled up from said solution and dried. Ag-benzotriazole films 6 are shaped onto the surfaces of the Ag electrodes 4 for the lead frames, Cu- benzotriazole films 7 onto the surfaces of the Cu wires 3 and Al-benzotriazole films 8 onto the surfaces of the Al electrodes 5 for the silicon chip 1, and these films, chip, wires, electrodes, etc. are sealed with a sealing resin 9.
    • 10. 发明专利
    • Method and device for corrosion prevention of wetting metallic material
    • 用于腐蚀防止金属材料腐蚀的方法和装置
    • JPS6152379A
    • 1986-03-15
    • JP17371484
    • 1984-08-21
    • Hitachi Ltd
    • HONDA TAKUKASHIMURA EIJIMINATO AKIRA
    • C23F15/00C23F11/18F22D11/00G21D1/02
    • Y02E30/40
    • PURPOSE: To prevent the corrosion of the wetting metallic material of a boiling water reactor (BWR) during the shutdown of the BWR by measuring the specific conductivity of the water to be used and controlling the concn. of the dissolved oxygen in the water or the pH thereof from the measured value.
      CONSTITUTION: The conductivity of the water is measured by a detector 16 and the concn. of the dissolved oxygen in the water is measured by a dissolved oxygen meter 17 in order to prevent the corrosion of condensate and feed water pipings by the water in the shutdown stage of the BWR plant for the purpose of making a periodic inspection of the BWR10. The oxygen conc. is adjusted by an oxygen feeder 18 so as to attain 40ppbW40ppm when the specific conductivity is ≤0.1μS/cm to decrease considerably the corrosion rate of the piping of the wetting metallic material. An inert gas is fed from the feeder 18 to deaerate the water until the concn. of the dissolved oxygen is brought to ≤40ppb or ammonia or the like is fed to the water to maintain the pH at 7.5W10 passive region to prevent the corrosion of the metallic pipings if the specific conductivity exceeds 0.1μS/cm.
      COPYRIGHT: (C)1986,JPO&Japio
    • 目的:通过测量使用的水的比电导率和控制浓度来防止BWR关闭期间沸水反应堆(BWR)的润湿金属材料的腐蚀。 的水中的溶解氧或其pH值。 构成:水的电导率由检测器16和浓度 通过溶解氧计17来测量水中的溶解氧,以便在BWR工厂的关闭阶段防止冷凝物和给水管道的腐蚀,以便定期检查BWR10。 氧浓度 通过氧气进料器18进行调节,以便当比电导率<= 0.1muS / cm时达到40ppb-40ppm,以显着降低润湿金属材料的管道的腐蚀速率。 从进料器18供给惰性气体,使水脱水直至浓缩。 的溶解氧达到= 40ppb,或者如果比电导率超过0.1muS / cm,则将氨​​等进料到水中以将pH保持在7.5-10被动区域以防止金属管道的腐蚀。