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    • 5. 发明专利
    • THIN FILM SEMICONDUCTOR DEVICE
    • JPH0350731A
    • 1991-03-05
    • JP18463189
    • 1989-07-19
    • HITACHI LTD
    • KANEKO YOSHIYUKITSUTSUI KENKOIKE NORIOTSUKADA TOSHIHISA
    • H01L21/3205H01L21/768H01L23/52H01L23/522H01L27/12H01L29/786
    • PURPOSE:To relieve defects by constituting dual line wiring at the intersecting part of a gate bus and a data bus of a TFT gate array, and eliminating a part of the dual line wiring, when the short between the wirings generates. CONSTITUTION:On a light transparent insulating substrate 10, Cr metal is selectively stuck and formed as a gate electrode and gate buses 1, 1'. By plasma discharge, silicon nitride 11 is deposited as a gate insulating film and an interlayer insulating film on the whole surface. By plasma discharge, an amorphous silicon layer is deposited as an amorphous semiconductor layer 2, and further N-type amorphous silicon 3 is deposited. After the amorphous silicon (the N-type layer also is contained) 2, 3 are etched in a desired pattern, a source electrode 4, a drain electrode 5 and data buses 5' are formed by using Cr, Al, etc., and the N-type amorphous silicon is etched by using the pattern as a mask. A transparent electrode is selectively stuck by using indium tin oxide, and a protecting film 7 is stuck on the almost whole surface by using silicon nitide and the like. Hence a semiconductor device can be relieved from the generation of defects caused by short circuiting by cutting a part of the dual line.