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    • 1. 发明专利
    • Coating apparatus and coating method
    • 涂装和涂装方法
    • JP2005205268A
    • 2005-08-04
    • JP2004012559
    • 2004-01-21
    • Hitachi Industries Co Ltd株式会社 日立インダストリイズ
    • TAJIMA JUNICHISAITO TADAYUKITOYOSHIMA HIRONOBU
    • B05D1/26B05C5/02B05C9/14B05C11/10B05D3/00H01M4/88H01M8/10
    • Y02E60/521
    • PROBLEM TO BE SOLVED: To solve the problem that the thickness of a coating film becomes too thiner or thicker at the time of starting or finishing the coating in a coating apparatus for discharging and applying a coating material from a coating head having a slit opening under a fixed condition while moving a sheet-like material to be coated. SOLUTION: The coating apparatus is provided with a control part for detecting and controlling the pressure of the coating head so as to set a coating supply pressure to be higher than a normal supply pressure in the starting of the coating, to turn the coating supply pressure to the normal supply pressure when the discharge pressure from the head reaches a specified pressure and to make the coating supply pressure negative in the termination of the coating. COPYRIGHT: (C)2005,JPO&NCIPI
    • 解决的问题:为了解决在从涂布头排出涂布装置的涂布装置中开始涂装或涂覆涂料时涂膜厚度变得太薄或变厚的问题, 在固定状态下切割开口,同时移动待涂覆的片状材料。 解决方案:涂覆装置设置有用于检测和控制涂覆头的压力的控制部件,以便在涂层开始时将涂料供给压力设定为高于正常供给压力, 当来自头部的排出压力达到特定压力时,将涂料供应压力提高到正常供应压力,并使涂层供应压力在涂层终止时为负值。 版权所有(C)2005,JPO&NCIPI
    • 3. 发明专利
    • Paste coating device
    • 涂料涂装装置
    • JP2005144326A
    • 2005-06-09
    • JP2003385155
    • 2003-11-14
    • Hitachi Industries Co Ltd株式会社 日立インダストリイズ
    • SAKAZAKI TAKESHISAITO TADAYUKITAJIMA JUNICHI
    • B05B15/04B05C5/02B05C11/00
    • PROBLEM TO BE SOLVED: To make a screen mask detachable from and attachable to a mask part comprising two mask frames to realize smooth rotation of the mask part.
      SOLUTION: The mask part A is formed by the mask frames 2, 3 rotatably attaching to a frame shaft 1, and a mask attaching rib 5 is attached astride the mask frames 2, 3. The screen mask 4 is set detachably by inserting the mask rib 4c of the mask screen 4 into the mask attaching rib 5. A coating head 7 is installed at the lower part of the frame shaft 1 to which a cam follower 9 is attached. The height of the coating head 7 is determined by the cam follower 9 abutted on the inner wall surfaces 2e (not shown in Fig.), 3e of the mask frames 2, 3. When the mask attaching rib 5 comes to the vicinity of the coating head 7 the cam follower 9 and, naturally, the coating head 7 rise along a guide installed on the inner wall surfaces 2e, 3e to avoid the mask attaching rib 5.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:使屏幕掩模可拆卸并附接到包括两个掩模框架的掩模部分,以实现掩模部分的平滑旋转。

      解决方案:掩模部分A由可旋转地附接到框架轴1的掩模框架2,3形成,并且掩模附着肋条5跨越掩模框架2,3连接。屏幕掩模4可拆卸地设置 将掩模筛4的掩模肋4c插入到掩模附着肋5中。涂布头7安装在框架轴1的下部,凸轮从动件9附接到该下部。 涂覆头7的高度由靠在荫罩框架2,3的内壁面2e(图3中未示出),3e上的凸轮从动件9确定。当面罩安装肋5到达 涂覆头7凸轮从动件9,并且自然地,涂覆头7沿着安装在内壁表面2e,3e上的导向件上升,以避免面罩附接肋5。版权所有(C)2005,JPO&NCIPI

    • 6. 发明专利
    • Positioning method
    • 定位方法
    • JP2003066096A
    • 2003-03-05
    • JP2001255672
    • 2001-08-27
    • Hitachi Industries Co Ltd株式会社 日立インダストリイズ
    • TAJIMA JUNICHIMITSUMOTO MASARUTOYOSHIMA HIRONOBU
    • B42D15/10G01R31/26G06K19/00
    • PROBLEM TO BE SOLVED: To resolve a problem in inspection of a chip where a chip conveying process and a positioning process are different processes and main work after conveyance is in a stand-by state during a position correcting process. SOLUTION: An index table conveying method is used, and a plurality of positioning pockets provided with recessed parts and inclinations are provided on an index table so that feeding, conveyance to an inspection part, inspection processes, and chip discharge after inspection of semiconductor chips such as a non-contact IC tag can be carried out in parallel. For example, the semiconductor chips are dropped into the positioning pockets and positioned by intermittently adding pulses to an index table driving pulse motor in a stopping position neighborhood of the pulse motor, generating a cogging phenomenon, and carrying out excitation using minute vibration generated by the cogging phenomenon.
    • 要解决的问题:为了解决在位置校正处理期间芯片输送处理和定位处理不同处理的芯片的检查和运输后的主要工作处于待机状态的问题。 解决方案:使用分度台传送方法,并且在分度台上设置多个设置有凹部和倾斜的定位凹槽,以便在检查半导体芯片之后进行检查处理和切屑放电 作为非接触IC标签可以并行进行。 例如,将半导体芯片落入定位槽内,通过在脉冲电动机的停止位置附近间歇地向指标表驱动脉冲电动机施加脉冲而定位,产生齿槽现象,并利用由 齿槽现象
    • 8. 发明专利
    • Hot press device and method
    • 热压设备和方法
    • JP2005169464A
    • 2005-06-30
    • JP2003413534
    • 2003-12-11
    • Hitachi Industries Co Ltd株式会社 日立インダストリイズ
    • SAITO TADAYUKITAJIMA JUNICHIWATANABE SHIGEO
    • B30B3/00B29C43/46B29C43/58B30B15/34
    • PROBLEM TO BE SOLVED: To prevent the generation of deformation such as wrinkles and peeling at the part subjected to thermocompression bonding in hot press of an object to be treated, and to satisfactorily realize the thermocompression bonding of the object to be bonded to the object to be pressed. SOLUTION: Objects 10a and 10b to be compression-bonded are subjected to hot pressing to an object 11 to be pressed of the object 10 to be treated. In the period (τ 1 to τ 2 ) where the front exposed part 11a in which the object 11 to be pressed of the object 10 to be treated is exposed is hot-pressed with heat rollers 13 and 14, pressure P applied to a heat roller 13 is set to P 0 and peripheral velocity V is set to V 0 in order to carry the object 10 to be treated. In the period (τ 2 to τ 3 ) where the objects 10a and 10b to be compression-bonded are hot-pressed, the pressing force P is set to P 1 (>P 0 ) and the peripheral velocity V is successively increased starting from the V 0 . Finally, in the period (τ 3 to τ 4 ) where the front exposed part 11b in which the object 11 to be pressed of the object 10 to be treated is exposed is hot-pressed, the pressing force P is returned to P 0 , and the peripheral velocity V is held to the peripheral velocity V 1 after the increase in the hot pressing period (τ 2 to τ 3 ). COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:为了防止在被处理物体的热压中经受热压接的部分产生皱纹和剥离等变形,并且令人满意地实现待粘合物体的热压接 要按的对象。 解决方案:将要压缩的物体10a和10b经受热压到被处理物体10的被按压物体11。 在要被处理物体10被按压的物体11露出的前露出部11a的期间(τ 1 〜τ 2 )中, 按压加热辊13,14,将施加到加热辊13的压力P设定为P 0 ,将圆周速度V设定为V 0 ,以便携带物体 10待处理。 在要压缩的物体10a和10b被热压的期间(τ 2 到τ 3 )中,按压力P被设定为P 1 (> P 0 ),并且圆周速度V从V 0 开始连续增加。 最后,在要被处理物体10被按压的物体11露出的前露出部11b的期间(τ 3 〜τ 4 )中, 热压后,按压力P返回到P 0 ,并且在热压时间的增加之后圆周速度V保持为圆周速度V SB> 1 τ 2 至τ 3 )。 版权所有(C)2005,JPO&NCIPI