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1. 发明专利

JP2011098530A Fine structure transfer apparatus 有权
标题翻译：精细结构传输设备
公开(公告)号：JP2011098530A
公开(公告)日：2011-05-19
申请号：JP2009255685
申请日：2009-11-09
申请人： Hitachi Industrial Equipment Systems Co Ltd , 株式会社日立産機システム
发明人： SHIMAO DAISUKE , YAMAZAKI TAKANORI , HASEGAWA MITSURU
IPC分类号： B29C59/04 , H01L21/027
CPC分类号： B29C59/04 , B29C35/02 , B29C37/0003 , B29C2035/046 , B29C2035/0811 , B29C2035/0822 , B29C2035/1658 , B29C2059/023
摘要： PROBLEM TO BE SOLVED: To provide a heating/cooling mechanism for a fine structure transfer apparatus, a mechanism enabling high throughput and miniaturization and suppressing occurrence of poor transfer such as a wrinkle-like trace before and after heating and pressurizing. SOLUTION: The fine structure transfer apparatus includes a preheating heaters 4, 5 to heat up the surface of a belt-like mold 1 alone, right before bringing the belt-like mold into contact with the heating and pressurizing rollers; the temperature of the surface of the belt-like mold is made equal to that of the heating and pressurizing rollers, enabling to reliably obtain a predetermined temperature; and cooling rollers 7 or a cooling nozzle 6 are arranged right after the heating and pressurizing rollers, enabling cooling by forced cooling and pressure holding, and to transfer a pattern. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种精细结构转印装置的加热/冷却机构，能够实现高产量和小型化的机构，并且抑制加热和加压之前和之后的皱纹状痕迹等不良转印的发生。解决方案：在将带状模具与加热和加压辊接触之前，精细结构传送装置包括一个预热加热器4,5，用于单独加热带状模具1的表面; 使带状模具的表面的温度与加热和加压辊的温度相等，使得能够可靠地获得预定温度; 并且冷却辊7或冷却喷嘴6布置在加热和加压辊之后，通过强制冷却和压力保持来进行冷却，并且转印图案。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2013067124A Transfer apparatus 审中-公开
标题翻译：传送装置
公开(公告)号：JP2013067124A
公开(公告)日：2013-04-18
申请号：JP2011208408
申请日：2011-09-26
申请人： Hitachi Industrial Equipment Systems Co Ltd , 株式会社日立産機システム
发明人： SHIMAO DAISUKE , YAMAZAKI TAKANORI , OGINO MASAHIKO , HASEGAWA MITSURU
IPC分类号： B29C59/02 , B29C59/00 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To control a resist film thickness and a thin thickness of a material to be transferred in a transfer apparatus more precisely than ever before.SOLUTION: A fine hole is opened on such a part that production is not affected to the extent possible within a plane where a die such as a silicon wafer and a material to be transferred or a resist film are in contact. A sensor more precise than ever before for measuring a thickness of only the material to be transferred through the fine hole is mounted. Thus, the size of only the material to be transferred can be measured, and a change in dimension during the transfer is multiplied by a simple correction value with linearity, thereby allowing film thickness control more precise than ever before.
摘要翻译：要解决的问题：为了更准确地控制在传送装置中要传送的材料的抗蚀剂膜厚度和薄的厚度。解决方案：在这样的部件上打开细孔，使得生产不会在诸如硅晶片和待转移材料或抗蚀剂膜的管芯接触的平面内尽可能地受到影响。安装了比以前更精确地测量仅通过细孔传输的材料的厚度的传感器。因此，可以测量只有待传送的材料的尺寸，并且在传送期间尺寸的变化乘以简单的线性校正值，从而使膜厚度控制比以前更精确。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2010280129A Device for transferring fine structure 有权
标题翻译：用于传输细微结构的设备
公开(公告)号：JP2010280129A
公开(公告)日：2010-12-16
申请号：JP2009135174
申请日：2009-06-04
申请人： Hitachi Industrial Equipment Systems Co Ltd , 株式会社日立産機システム
发明人： SHIMAO DAISUKE , OGINO MASAHIKO , YAMAZAKI TAKANORI
IPC分类号： B29C59/02 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a device for transferring a fine structure, capable of reducing a tact (the number of processes) and achieving rapid heating and cooling performance with high accuracy while taking little time or cost for maintenance.
SOLUTION: The device for transferring a fine structure, which carries out thermal transfer of a fine structure, includes a pressure-receiving part 2, a pressurizing part 1 and a transfer part 10 mounted on one of opposing faces of the pressure-receiving part and of the pressurizing part. The transfer part includes a heat insulating member 105, a heating and cooling member 102 attached to the surface of the heat insulating member, and a top plate 101 attached to the surface of the heating and cooling member. The top plate may be replaced by a wafer 106 for compensating flatness or a mold 107 having a fine pattern formed on the surface, which is attached to the surface of the heating and cooling member by a holding member. Further, the top plate, or a wafer or a mold can be separated from the heating and cooling member.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种转印精细结构的装置，能够在几乎没有时间或维护成本的情况下以高精度实现节省（工艺数）和实现快速加热和冷却性能。解决方案：用于传送精细结构的热传递的精细结构的传送装置包括压力接收部分2，加压部分1和传送部分10，该传送部分10安装在压敏部分2的相对面之一上。接收部分和加压部分。转印部分包括绝热构件105，附着在绝热构件的表面上的加热和冷却构件102以及附接到加热和冷却构件的表面的顶板101。顶板可以由用于补偿平坦度的晶片106或具有形成在表面上的精细图案的模具107代替，该模具107由保持构件附接到加热和冷却构件的表面。此外，顶板或晶片或模具可以与加热和冷却构件分离。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2014133351A Fine structure transfer apparatus and fine structure transfer method 审中-公开
标题翻译：精细结构转移装置和精细结构转移方法
公开(公告)号：JP2014133351A
公开(公告)日：2014-07-24
申请号：JP2013002197
申请日：2013-01-10
申请人： Hitachi Industrial Equipment Systems Co Ltd , 株式会社日立産機システム
发明人： SHIMAO DAISUKE , HASEGAWA MITSURU , YAMAZAKI TAKANORI
IPC分类号： B29C59/04 , H01L21/027
CPC分类号： B29C59/04 , B29C35/02 , B29C35/0805 , B29C35/16 , B29C37/0003 , B29C2035/0211 , B29C2035/0811 , B29C2035/0822 , B29C2035/1616 , B29C2035/1625 , B29C2035/1658 , B29C2035/1683 , B29C2059/023
摘要： PROBLEM TO BE SOLVED: To provide a mechanism to prevent fracture of a body to be transferred at the time of starting or finishing of transfer in a thermal continuous transfer apparatus.SOLUTION: In order to prevent fracture (fusion) of a body to be transferred 9 by hindering heat conduction from a belt-shaped metal mold 1 and a supporting base material 12 at the time of starting and finishing of transfer, a mechanism to instantly cool surfaces of upper and lower cylindrical pressure rollers, a surface of the belt-shaped metal mold 1, a surface of the supporting base material 12 and the body to be transferred 9 is provided immediately before the upper and lower cylindrical pressure rollers for pressurizing and heating sandwich the belt-shaped metal mold 1 and the body to be transferred 9, or a mechanism to insert a raw material to hinder heat conduction from the upper and lower cylindrical pressure rollers to the body to be transferred 9 is possessed, and the body to be transferred 9 is sandwiched together with the raw material to hinder heat conduction, so that the fracture of the body to be transferred 9 due to excessive heating is prevented.
摘要翻译：要解决的问题：提供一种防止在热连续转印装置中转印开始或结束时被转印体的断裂的机构。解决方案：为了防止被转印的物体的断裂（融合）如图9所示，通过在传送开始和结束时阻止带状金属模具1和支撑基材12的热传导，立即冷却上，下圆柱形压力辊表面的机构，带状金属模具1，在用于加压和加热的上部和下部圆柱形加压辊夹持带状金属模具1和被转印物体9之前，立即设置支撑基材12的表面和被转印体9，或者将原料插入以阻止从上下圆柱形加压辊到被转印体9的热传导的机构，并且被转印体9为与原料夹在一起以阻止热传导，从而防止由于过度加热而被转移的身体的断裂9。

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