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1. 发明专利

JP2013207039A Wiring board for mounting light emitting element 审中-公开
标题翻译：用于安装发光元件的接线板
公开(公告)号：JP2013207039A
公开(公告)日：2013-10-07
申请号：JP2012073589
申请日：2012-03-28
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： YAMAMOTO TEPPEI
IPC分类号： H05K1/05 , H01L33/62
摘要： PROBLEM TO BE SOLVED: To provide a wiring board for mounting a light emitting element which prevents the increase of the work hours for making interlayer connection and enables easy formation of a lower surface electrode even when an aluminum substrate achieving high reflection rate and heat radiation performance is used as a base substrate.SOLUTION: A wiring board for mounting a light emitting element includes: an aluminum base; an upper substrate disposed on an upper surface of the aluminum base; a lower substrate disposed on a lower surface of the aluminum base; and a light emitting element mounting part provided at an opening of the upper substrate. The upper electrode provided on the upper substrate and the lower surface electrode provided on the lower substrate are electrically connected through the aluminum base to form an interlayer connection.
摘要翻译：要解决的问题：为了提供一种用于安装发光元件的布线板，其防止增加制造层间连接的工作时间，并且即使当铝基板实现高反射率和散热性能时也能够容易地形成下表面电极用作基底基板。解决方案：用于安装发光元件的布线板包括：铝基座; 上基板，设置在所述铝基座的上表面上; 设置在铝基底的下表面上的下基板; 以及设置在上基板的开口处的发光元件安装部。设置在上基板上的上电极和设置在下基板上的下表面电极通过铝基电连接以形成层间连接。

2. 发明专利

JP2014135344A Wiring board manufacturing method 审中-公开
标题翻译：接线板制造方法
公开(公告)号：JP2014135344A
公开(公告)日：2014-07-24
申请号：JP2013001728
申请日：2013-01-09
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： YAMAMOTO TEPPEI , NISHIDA TAKANORI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method which can reduce material cost by reducing a margin to be removed by cutting in a coreless technique and which has high workability.SOLUTION: A wiring board manufacturing method comprises: a process (1) of laminating a prepreg and a copper foil C on both sides of a three-layer peelable copper foil in which physically peelable copper foils B are arranged on both sides of a copper foil A to be a supporting material to form a laminate with the supporting member; a process (2) of forming an interlayer connection hole which penetrates from the copper foil C to the copper foil B of the laminate with the supporting material; and a process (3) of performing copper plating on the interlayer connection hole of the laminate with the supporting material and on the copper foil B to form interconnection for connecting the copper foil C and the copper foil B and a conductor layer having the copper foil C and copper plating.
摘要翻译：要解决的问题：提供一种线路板制造方法，其可以通过在无芯技术中切割而减少要去除的余量而降低材料成本，并且具有高的可加工性。解决方案：一种线路板制造方法，包括：工艺（1）在三层可剥铜箔的两面层叠预浸料和铜箔C，其中物理上可剥离的铜箔B布置在铜箔A的两侧作为支撑材料以与支撑构件形成层压体 ; 形成从所述铜箔C向所述层叠体的铜箔B与所述支撑材料贯通的层间连接孔的工序（2）以及在具有支撑材料的层叠体的层间连接孔上和铜箔B上进行铜电镀的工序（3），以形成用于连接铜箔C和铜箔B的互连和具有铜箔的导体层 C和镀铜。

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