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1. 发明专利

JP2013214417A Circuit connection material, circuit connection material structure and manufacturing method of circuit connection material structure 审中-公开
标题翻译：电路连接材料，电路连接材料结构及制造方法电路连接材料结构
公开(公告)号：JP2013214417A
公开(公告)日：2013-10-17
申请号：JP2012084215
申请日：2012-04-02
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： TOMISAKA KATSUHIKO , FUJII MASANORI , IWAI KEIKO
IPC分类号： H01B1/22 , C09J9/02 , C09J11/06 , C09J163/00 , C09J201/00 , H01B1/00 , H01L21/60 , H05K1/14 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To provide a circuit connection material which can maintain excellent electrical connection between circuit members being connected, even when interconnecting the circuit members with low pressure.SOLUTION: A circuit connection material 50a is interposed between a first circuit member 30 having a first circuit electrode 32 and a second circuit member 40 having a second circuit electrode 42, and connects the first circuit electrode and second circuit electrode electrically by compression. At least one of the first circuit member and second circuit member is an IC chip, and the compression load is 50 MPa or less for the electrode area of the IC chip. The circuit connection material contains conductive particles 10A and an adhesive component 20a, the conductive particle has a metal layer on the surface of a plastic particle, the outermost layer of the metal layer is palladium, and the compression modulus of the conductive particle during 30% compression deformation of the particle diameter is 100-500 kgf/mm.
摘要翻译：要解决的问题：提供一种电路连接材料，即使在将电路部件互连成低压时，也能够保持连接的电路部件之间的良好的电连接。解决方案：电路连接材料50a介于具有第一电路电极32和具有第二电路电极42的第二电路部件40，并且通过压缩电连接第一电路电极和第二电路电极。第一电路构件和第二电路构件中的至少一个是IC芯片，对于IC芯片的电极区域的压缩载荷为50MPa以下。电路连接材料包含导电颗粒10A和粘合剂组分20a，导电颗粒在塑料颗粒的表面上具有金属层，金属层的最外层是钯，并且导电颗粒的压缩模量在30％粒径的压缩变形为100-500kgf / mm。

2. 发明专利

JP2013209648A Circuit connection material 审中-公开
标题翻译：电路连接材料
公开(公告)号：JP2013209648A
公开(公告)日：2013-10-10
申请号：JP2013055002
申请日：2013-03-18
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： TOMISAKA KATSUHIKO , KOBAYASHI KOJI , TAKETAZU JUN , ARIFUKU MASAHIRO , KOJIMA KAZUYOSHI , MOCHIZUKI AKIOMI
IPC分类号： C09J201/00 , C09J9/02 , C09J11/04 , C09J11/06 , C09J163/00 , H01B1/00 , H01B1/22 , H01R4/04
CPC分类号： H05K3/323 , C08K7/16 , C08K9/02 , C09J9/02 , C09J11/04 , C09J163/00 , H01L24/29 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/13016 , H01L2224/13144 , H01L2224/16 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/2939 , H01L2224/294 , H01L2224/29439 , H01L2224/29447 , H01L2224/29455 , H01L2224/29499 , H01L2224/2989 , H01L2224/81903 , H01L2224/83192 , H01L2224/838 , H01L2224/83851 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01R4/04 , H01R11/01 , H01R12/52 , H01R13/03 , H05K2201/0218 , H05K2201/0221 , Y10T29/49117 , Y10T428/256 , H01L2924/01028 , H01L2924/01026 , H01L2924/3512 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a circuit connection material capable of achieving good electrical connection between respective circuit electrodes, and also capable of fully enhancing long term reliability of electric characteristics between circuit electrodes; and a connection structure of circuit members and connection method of circuit members using the material.SOLUTION: This circuit connection material 10 includes an adhesive composition and a conductive particle, where the conductive particle 12 has a projection 14 comprising one, or two or more metal layers 22 on a nucleus 21, the metal layer 22 is formed at least on the surface of the projection 14, the metal layer 22 is composed of nickel or a nickel alloy, and the compressive elastic modulus of the conductive particle 12 at 20% compression is 100-800 kgf/mm.
摘要翻译：要解决的问题：提供能够在各个电路电极之间实现良好的电连接的电路连接材料，并且还能够完全提高电路电极之间的电特性的长期可靠性; 以及电路构件的连接结构和使用该材料的电路构件的连接方法。解决方案：该电路连接材料10包括粘合剂组合物和导电颗粒，其中导电颗粒12具有包括一个或两个或更多个金属的突起14 金属层22至少在突起14的表面上形成，金属层22由镍或镍合金构成，导电粒子12的压缩弹性模量为20％压缩是100-800kgf / mm。

3. 发明专利

JP2014141679A Connection method of circuit member and connection structure of circuit member 有权
标题翻译：电路成员的连接方法和电路组件的连接结构
公开(公告)号：JP2014141679A
公开(公告)日：2014-08-07
申请号：JP2014045370
申请日：2014-03-07
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： TOMISAKA KATSUHIKO , TAKETAZU JUN
IPC分类号： C09J7/02 , C09J5/06 , C09J9/02 , C09J11/04 , C09J11/06 , C09J163/00 , C09J171/10 , H01L21/60 , H01L23/29 , H01L23/31
CPC分类号： H05K3/323 , C09J9/02 , C09J171/00 , H01L24/29 , H01L24/83 , H01L2224/13144 , H01L2224/16 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/83851 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01R4/04 , H01R13/03 , H05K3/361 , H05K2203/1189 , H01L2924/00 , H01L2924/3512
摘要： PROBLEM TO BE SOLVED: To provide a connection method of a circuit member in which low resistance electric connection can be obtained to COG mounting and COF mounting, and panel warpage after mounting a liquid crystal driving IC to a glass panel for a liquid crystal display can be sufficiently prevented.SOLUTION: A connection method of a circuit member is that a first circuit member having a first connection terminal and a second circuit member having a second connection terminal are disposed so that the first connection terminal and the second connection terminal may counter together, an adhesive film is included between the first connection terminal and the second connection terminal that have been disposed to counter together, performed by heat compression, thereby the first connection terminal and the second connection terminal that have been disposed to counter together are electrically connected, and the connection method of a circuit member is that the adhesive film is the adhesive film in which a conductive adhesive layer including a conductive particle and an insulating adhesion layer are laminated, and the insulating adhesion layer and the conductive adhesive layer satisfy a prescribed requirement.
摘要翻译：要解决的问题：为了提供可以获得COG安装和COF安装的低电阻电连接的电路构件的连接方法，以及将液晶驱动IC安装到液晶显示器的玻璃面板之后的面板翘曲可充分防止。解决方案：电路部件的连接方法是具有第一连接端子和具有第二连接端子的第二电路部件的第一电路部件设置成使得第一连接端子和第二连接端子可以在一起在第一连接端子和第二连接端子之间，通过热压缩而被布置成相互对置的粘合膜，由此已经被设置为反接在一起的第一连接端子和第二连接端子电连接，并且电路部件的连接方法是粘合膜是粘合剂其中层压有包括导电颗粒和绝缘粘附层的导电粘合剂层，并且绝缘粘合层和导电粘合剂层满足规定的要求。

4. 发明专利

JP2013065563A Connection method of circuit member 审中-公开
标题翻译：电路成员连接方法
公开(公告)号：JP2013065563A
公开(公告)日：2013-04-11
申请号：JP2012242096
申请日：2012-11-01
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： TOMISAKA KATSUHIKO , TAKETAZU JUN
IPC分类号： H01R43/00 , H01R11/01
CPC分类号： H05K3/323 , C09J9/02 , C09J171/00 , H01L24/29 , H01L24/83 , H01L2224/13144 , H01L2224/16 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/83851 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01R4/04 , H01R13/03 , H05K3/361 , H05K2203/1189 , H01L2924/00 , H01L2924/3512
摘要： PROBLEM TO BE SOLVED: To provide a connection method of a circuit member ensuring low resistance electrical connection for COG mounting or COF mounting, while preventing warpage of a panel sufficiently after mounting a liquid crystal driving IC on a liquid crystal display glass panel.SOLUTION: In the connection method of a circuit member where a first circuit member having a first connection terminal and a second circuit member having a second connection terminal are disposed while facing the first connection terminal and the second connection terminal each other, an adhesive film is interposed between the first and second connection terminals disposed to face each other, and then the first and second connection terminals disposed to face each other are connected electrically by hot press, the adhesive film includes a lamination of a conductive adhesive layer containing conductive particles, and an insulating adhesive layer, and the insulating adhesive layer contains a bisphenol F type phenoxy resin.
摘要翻译：要解决的问题：提供确保用于COG安装或COF安装的低电阻电连接的电路部件的连接方法，同时在将液晶驱动IC安装在液晶显示器玻璃板上之后充分防止面板翘曲。解决方案：在具有第一连接端子的第一电路构件和具有第二连接端子的第二电路构件相对于第一连接端子和第二连接端子配置的电路构件的连接方法中，粘合膜介于彼此相对设置的第一和第二连接端子之间，然后通过热压将电极彼此相对设置的第一和第二连接端子连接，粘合膜包括导电粘合剂层颗粒和绝缘粘合剂层，并且绝缘粘合剂层含有双酚F型苯氧基树脂。版权所有（C）2013，JPO＆INPIT

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