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JP2014146685A Led mounting substrate 审中-公开
标题翻译： LED安装基板
公开(公告)号：JP2014146685A
公开(公告)日：2014-08-14
申请号：JP2013014271
申请日：2013-01-29
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： SHIOZAWA TOMONORI
IPC分类号： H05K3/28 , H01L33/60
CPC分类号： H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an LED mounting substrate capable of securing reflectance because blackening is less likely to occur even when a white solder resist formed on a surface of an LED wiring board comes into contact with a metal and the like while maintaining a degree of freedom on a circuit design of the LED wiring board.SOLUTION: An LED mounting substrate comprises: an insulating substrate; a conductor pattern formed on one surface of the insulating substrate and including a mounting terminal for mounting an LED element and a connection terminal connected to the LED element; a conductor pattern formed on the other surface of the insulating substrate; and a two-layered solder resist formed on the one surface of the insulating substrate and on the conductor pattern on this one surface and including an opening on the mounting terminal and the connection terminal. The two-layered solder resist is formed with a white solder resist containing a slip agent as an upper layer.
摘要翻译：要解决的问题：提供一种能够确保反射率的LED安装基板，即使当形成在LED布线板的表面上的白色阻焊剂与金属等接触时，也可能发生黑化，同时保持一定程度的LED布线板的电路设计的自由度。解决方案：LED安装基板包括：绝缘基板; 导体图案，形成在所述绝缘基板的一个表面上，并且包括用于安装LED元件的安装端子和连接到所述LED元件的连接端子; 形成在所述绝缘基板的另一个表面上的导体图案; 以及形成在绝缘基板的一个表面上并且在该一个表面上的导体图案上的包括安装端子和连接端子上的开口的两层阻焊剂。双层阻焊剂由含有滑爽剂作为上层的白色阻焊剂形成。

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