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1. 发明专利

JP2009113465A Thin film composite material, material for wiring board using it, wiring board, and electronic component 审中-公开
标题翻译：薄膜复合材料，使用它的接线板材料，接线板和电子元件
公开(公告)号：JP2009113465A
公开(公告)日：2009-05-28
申请号：JP2008056402
申请日：2008-03-06
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： HIRATA YOSHITAKE , SHIMADA YASUSHI
IPC分类号： B32B15/08 , H05K1/09 , H05K1/16
摘要： PROBLEM TO BE SOLVED: To provide a thin film composite material, a material for a wiring board, a wiring board, and an electronic component capable of forming a reliable capacitor even when a high dielectric constant resin layer is thinned.
SOLUTION: The thin film composite material includes copper foil, a metal thin film layer including nickel formed on one surface of the copper foil, and a resin composition layer formed on the metal thin film layer and having a specific inductive capacity of a cured object of 20 or more at 25°C and 1 MHz.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：即使当高介电常数树脂层变薄时，提供薄膜复合材料，布线板材料，布线板和能够形成可靠电容器的电子部件。解决方案：薄膜复合材料包括铜箔，在铜箔的一个表面上形成的包含镍的金属薄膜层，以及形成在金属薄膜层上并具有介电常数ε的介电常数的树脂组合物层固化物体在25℃和1MHz下为20以上。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2008208367A Adhesive composition, method for producing the same, adhesive film produced using the composition, substrate for mounting semiconductor, and semiconductor device 审中-公开
标题翻译：胶粘剂组合物，其制造方法，使用该组合物生产的粘合膜，用于安装半导体的基板和半导体器件
公开(公告)号：JP2008208367A
公开(公告)日：2008-09-11
申请号：JP2008035244
申请日：2008-02-15
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： INADA TEIICHI , SUMIYA KEIJI , TOMIYAMA TAKEO , IWAKURA TETSUO , KAWAKAMI HIROYUKI , SUZUKI MASAO , MATSUZAKI TAKAYUKI , HOSOKAWA YOICHI , HATAKEYAMA KEIICHI , SHIMADA YASUSHI , TANAKA HIROKO , KURITANI HIROYUKI
IPC分类号： C09J163/00 , C08G59/18 , C08G59/62 , C09J7/02 , C09J133/00 , C09J133/14 , C09J161/04 , H01L23/14 , H01L23/29 , H01L23/31
CPC分类号： H01L23/14 , C08G59/18 , C08L2666/02 , C08L2666/04 , C09J7/10 , C09J7/35 , C09J163/00 , C09J2205/102 , C09J2433/00 , C09J2463/00 , H01L23/145 , H01L23/293 , H01L23/3114 , H01L23/3737 , H01L23/564 , H01L2224/50 , H01L2924/01019 , H01L2924/01068 , H01L2924/01087 , H01L2924/12044 , H01L2924/15311 , H05K1/0271 , Y10T156/1089 , Y10T428/2839 , Y10T428/287 , Y10T428/31511
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition which has heat resistance and moisture resistance required for mounting a semiconductor device on a wiring board for mounting semiconductor, where the semiconductor device has a coefficient of thermal expansion significantly differing from that of the wiring board, and with which an adhesive film capable of suppressing volatiles upon the use thereof can be formed, a method for producing the adhesive composition, an adhesive film produced using the adhesive composition, a substrate for mounting a semiconductor, and a semiconductor device. SOLUTION: Provided are the method for producing an adhesive composition comprising (a) an epoxy resin, (b) a curing agent, and (c) a polymeric compound incompatible with the epoxy resin and optionally (d) a filler and/or (e) a curing accelerator, the adhesive film prepared by forming the adhesive composition into the form of a film, the wiring board for mounting a semiconductor provided with the adhesive film on the surface for mounting chips of the wiring board, and a semiconductor device produced using the adhesive film or the wiring board for mounting semiconductor. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种粘合剂组合物，其具有将半导体器件安装在用于安装半导体的布线板上所需的耐热性和耐湿性，其中半导体器件的热膨胀系数显着不同于可以形成能够在使用时抑制挥发物的粘合膜，粘合剂组合物的制造方法，使用粘合剂组合物制造的粘合膜，用于安装半导体的基板和半导体装置。提供一种粘合剂组合物的制造方法，其包括（a）环氧树脂，（b）固化剂和（c）与环氧树脂不相容的聚合物，和任选地（d）填料和/ 或（e）固化促进剂，通过将粘合剂组合物形成为膜的方式制备的粘合剂膜，将用于安装布线板的芯片的表面上安装有粘合剂膜的半导体的布线板和半导体使用粘合膜制造的装置或用于安装半导体的布线板。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2007165814A Member for capacitor embedded in substrate, and substrate with embedded capacitor using it and manufacturing method of the substrate 审中-公开
标题翻译：嵌入在基板中的电容器的构件，以及使用其的嵌入式电容器的基板和基板的制造方法
公开(公告)号：JP2007165814A
公开(公告)日：2007-06-28
申请号：JP2006007891
申请日：2006-01-16
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： SHIMADA YASUSHI , HIRATA YOSHITAKE , KONDO YUSUKE , NAKANO HIROSHI
IPC分类号： H01G2/06 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a member for a capacitor embedded in a substrate with which the capacitor can be efficiently embedded in the substrate, to provide a substrate with the embedded capacitor using it, and to provide a method for manufacturing the substrate.
SOLUTION: This invention provides the member for the capacitor embedded in the substrate in which a heat-curing adhesive film 4 and a plastic carrier film 5 of a B-stage condition are laminated on one surface of a capacitor element in which a dielectric layer 2 is provided between facing electrodes 1 and 3, and provides the substrate with the embedded capacitor using it and the method for manufacturing the substrate.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供嵌入到基板中的电容器的部件，电容器可以通过该部件有效地嵌入到基板中，以使用它来提供具有嵌入式电容器的基板，并且提供一种用于制造基质。解决方案：本发明提供了嵌入在基板中的电容器的构件，其中将热固化粘合膜4和B阶状态的塑料载体膜5层压在电容器元件的一个表面上，其中电介质层2设置在面对电极1和3之间，并且使用它提供衬底和嵌入式电容器以及用于制造衬底的方法。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2007039567A Composite molded article for high-frequency electronic component and composition for producing composite molded article for high-frequency electronic component 审中-公开
标题翻译：用于高频电子元件的复合成型制品和用于生产用于高频电子元件的复合成型制品的组合物
公开(公告)号：JP2007039567A
公开(公告)日：2007-02-15
申请号：JP2005225980
申请日：2005-08-03
申请人： Fujifilm Holdings Corp , Goo Chemical Co Ltd , Hitachi Chem Co Ltd , Kri Inc , Nippon Zeon Co Ltd , Osaka Gas Co Ltd , 互応化学工業株式会社 , 大阪瓦斯株式会社 , 富士フイルムホールディングス株式会社 , 日本ゼオン株式会社 , 日立化成工業株式会社 , 株式会社Kri
发明人： YAMAGUCHI KOICHI , OMODA AKIRA , HAYASHI HIROYUKI , TSURUMI MITSUYUKI , HIROKAWA YOSHITSUGU , YAMAMOTO KAZUNORI , MURAI AKIRA , SHIMADA YASUSHI , MIZUNO YASUYUKI , ODA TOSHIKAZU , HAMADA NOBUHITO , NISHINO HITOSHI
IPC分类号： C08L101/00 , B32B7/02 , B32B15/08 , B32B27/18 , C08K3/04 , C09J11/04 , C09K21/08 , H05K1/03 , H05K3/28 , H05K3/46
CPC分类号： C08J5/005 , C08J2363/00
摘要： PROBLEM TO BE SOLVED: To provide a composite molded article for a high-frequency electronic component, capable of reducing dielectric loss (or tanδ) in high-frequency band, especially GHz band; and to provide a method for producing the molded article, an electronic component, etc using the molded article. SOLUTION: The composite molded article for the high-frequency electronic component contains 0.0001-0.1 wt.% at least one kind selected from the group consisting of a nanotube and a nanowire in the matrix. The method for producing the molded article, the resin composition for producing the molded article, the electronic component or the like formed by using the molded article or the resin composition are also provided. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够降低高频带，特别是GHz频带的介电损耗（或tanδ）的高频电子部件用复合成形品。并且提供使用该模制品制造模塑制品，电子部件等的方法。解决方案：用于高频电子部件的复合成型体含有0.0001-0.1重量％的从基质中的纳米管和纳米线中选出的至少一种。还提供了使用该成型体或树脂组合物形成的成型体的制造方法，成型体的制造用树脂组合物，电子部件等。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2007019530A Semiconductor device and radio electronic device 审中-公开
标题翻译：半导体器件和无线电电子器件
公开(公告)号：JP2007019530A
公开(公告)日：2007-01-25
申请号：JP2006230550
申请日：2006-08-28
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： SHIMADA YASUSHI , HIRATA YOSHITAKE , KURITANI HIROYUKI , OTSUKA KAZUHISA , YAMAGUCHI MASANORI , SHIMAYAMA YUICHI , MADARAME TAKESHI , WATANABE ETSUO , KONDO YUSUKE , YAMAMOTO KAZUNORI
IPC分类号： H01L23/12 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multilayer wiring board with a capacitor having a high dielectric constant material thin in thickness while exhibiting a small capacitance variation and that has no problem in formability, to provide a method of fabricating the multilayer wiring board, and to provide a semiconductor device and a radio electronic device.
SOLUTION: The multilayer wiring board has a plurality of insulating layers, a plurality of conductive layers, a non-through hole processed to be conductive to connect the plurality of conductive layers electrically, and a capacitor 12 having electrodes formed on upper and lower surfaces of at least one insulating layer formed of a high dielectric constant material 8. Recesses between conductor patterns including the electrodes are filled with insulating materials different from the high dielectric constant material 8, and the surfaces of the conductor patterns and the surfaces of the filled insulating materials are flattened. A method of fabricating the multilayer wiring board, a semiconductor device having a semiconductor chip mounted on the multilayer wiring board, and a radio electronic device mounted with the semiconductor device, are also disclosed.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种多层布线板，其具有厚度较薄的高介电常数材料的电容器，同时具有小的电容变化，并且在成形性方面没有问题，提供一种制造多层布线板的方法并且提供一种半导体器件和无线电电子器件。解决方案：多层布线板具有多个绝缘层，多个导电层，被加工成导电的非贯通孔，以电连接多个导电层;以及电容器12，其具有形成在上部和由高介电常数材料8形成的至少一个绝缘层的下表面。包括电极的导体图案之间的凹陷填充有不同于高介电常数材料8的绝缘材料，并且导体图案和表面的表面填充绝缘材料变平。还公开了一种制造多层布线板的方法，具有安装在多层布线板上的半导体芯片的半导体器件和安装有半导体器件的无线电电子器件。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2006019407A Manufacturing method of multilayer wiring board with built-in capacitor, and the multilayer wiring board 审中-公开
标题翻译：具有内置电容器的多层布线板的制造方法和多层布线板
公开(公告)号：JP2006019407A
公开(公告)日：2006-01-19
申请号：JP2004194147
申请日：2004-06-30
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： SHIMADA YASUSHI , HIRATA YOSHITAKE , KONDO YUSUKE , KAWAKAMI YUTAKA
IPC分类号： H05K3/46 , H01G4/12 , H01L23/12 , H05K1/16
摘要： PROBLEM TO BE SOLVED: To provide the manufacturing method of a multilayer wiring board with a built-in capacitor, and a multilayer wiring board with a built-in capacitor. SOLUTION: The dielectric thin film of thickness of 0.05-2 μm is provided in one side of metallic foil, and a board for capacitors is used wherein insulating material is laminated on the metallic foil of the opposite side provided with dielectric thin film. The materials for the multilayer wiring board with built-in capacitors comprises a step (1) for forming a metal layer used as a capacitor electrode on the dielectric thin film of the surface of the board for capacitors, a step (2) for forming an etching resist on the dielectric thin film containing the pattern where the metal layer is formed on the surface of the board for capacitors at least, a step (3) for etching the dielectric thin film by the high-pressure flush using the water system treating solution containing ceramic grain, and a step (4) for removing etching resist after etching. Thus, the multilayer wiring board with built-in capacitors is provided by forming one layer or two layers or more wiring layers on at least one side of the materials for the multilayer wiring board with built-in capacitors via the insulating layer. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供具有内置电容器的多层布线板的制造方法以及具有内置电容器的多层布线板。解决方案：在金属箔的一侧设置厚度为0.05-2μm的电介质薄膜，并且使用电容器板，其中绝缘材料层压在设置有电介质薄膜的相对侧的金属箔上。用于具有内置电容器的多层布线板的材料包括在用于电容器板的表面的电介质薄膜上形成用作电容器电极的金属层的步骤（1），用于形成至少在电容器用电路板的表面上形成含有金属层的图案的电介质薄膜上的耐蚀刻剂，使用水系处理液通过高压冲洗来蚀刻电介质薄膜的工序（3）以及用于在蚀刻后去除蚀刻抗蚀剂的步骤（4）。因此，具有内置电容器的多层布线基板通过在绝缘层上形成内置电容器的多层布线基板材料的至少一侧上形成一层或两层以上布线层来提供。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2004363425A Passive element incorporating board 审中-公开
公开(公告)号：JP2004363425A
公开(公告)日：2004-12-24
申请号：JP2003161696
申请日：2003-06-06
申请人： Hitachi Chem Co Ltd , Hitachi Ltd , 日立化成工業株式会社 , 株式会社日立製作所
发明人： TAGAMI TOMONORI , KURIYAMA SATORU , YAMAMOTO KAZUNORI , SHIMADA YASUSHI
IPC分类号： H01G4/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a passive element incorporating board capable of incorporating a passive component with a practical value and attaining low profile and downsizing. SOLUTION: The passive element incorporating board is provided with a multilayer board comprising a dielectric layer 20 of a front side, a dielectric layer 22 of a rear side, and intermediate dielectric layers 21, 30, 31. The intermediate dielectric layers 30, 31 are of high dielectric constant dielectric layers whose dielectric constant is higher than that of the other dielectric layers 20 to 22 and whose thickness is thinner than the thickness of the other dielectric layers 20 to 22. The passive element incorporating board is provided with capacitor electrodes 63a and 64a at the front side and the rear side, sandwiching the high dielectric constant dielectric layers 31; a through-hole 50s formed on the dielectric layer 21 for electric connection to the capacitor electrode 63a; and a through-hole 50r formed on the dielectric layer 22 for electric connection to the capacitor electrode 64a. The center of the through-hole 50s is deviated from the center of the through-hole 50r in a direction in parallel with the face of the high dielectric constant dielectric layers 31 by a diameter of the through-holes 50s, 50r or over. COPYRIGHT: (C)2005,JPO&NCIPI

8. 发明专利

JP2004103615A Multilayer wiring board, semiconductor device, and radio electronic equipment 有权
公开(公告)号：JP2004103615A
公开(公告)日：2004-04-02
申请号：JP2002259284
申请日：2002-09-04
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： SHIMADA YASUSHI , HIRATA YOSHITAKE , KURITANI HIROYUKI , OTSUKA KAZUHISA , YAMAGUCHI MASANORI , SHIMAYAMA YUICHI , MADARAME TAKESHI , WATANABE ETSUO , KONDO YUSUKE , YAMAMOTO KAZUNORI
IPC分类号： H05K1/16 , H01L23/12 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multilayer wiring board which is less warped and where a capacitor is built in an optional layer except the core layer, to provide a semiconductor device composed of the multilayer wiring board and a semiconductor chip mounted on it, and to provide radio electronic equipment mounted with the semiconductor device. SOLUTION: The multilayer wiring board is equipped with a plurality of insulating layers, a plurality of conductor layers, a non-through-hole which is turned conductive to electrically connect the conductor layers together, and a capacitor 12 composed of an insulating layer formed of high dielectric material 8 and electrodes which are each formed on the top and under surface of the insulating layer. The multilayer wiring board is made of high dielectric hardened material which is 0.1 to 30 μm in thickness and has relative permittivity of 20 to 100 at a frequency of 1 MHz at 25°C. The semiconductor device composed of the multilayer wiring board, and the semiconductor chip mounted on it and the radio electronic equipment mounted with the semiconductor device, are provided. COPYRIGHT: (C)2004,JPO

9. 发明专利

JP2009227542A Method for producing barium titanate precursor solution, method for producing barium titanate thin film, barium titanate thin film obtained by the production method, and electronic component using barium titanate thin film 审中-公开
标题翻译：制备钛酸钡前驱体溶液的方法，生产钛酸钡薄膜的方法，由生产方法获得的钛酸钡薄膜和使用钛酸钡薄膜的电子组件
公开(公告)号：JP2009227542A
公开(公告)日：2009-10-08
申请号：JP2008077822
申请日：2008-03-25
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： HIRATA YOSHITAKE , KONDO YUSUKE , SHIMADA YASUSHI
IPC分类号： C01G23/00 , C04B35/46 , H01G4/12 , H01G4/33
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a barium titanate precursor solution and a method for producing a barium titanate thin film, by which a content of impurity elements, particularly aluminum element is reduced, and to provide a barium titanate thin film obtained by the production method and electronic components using the barium titanate thin film. SOLUTION: The method for producing a barium titanate precursor solution and the method for producing a barium titanate thin film each includes: (A) a step of preparing a mixed solution of a barium alkoxide and a titanium alkoxide; (B) a step of adding an amino alcohol to the solution obtained in the step (A); (C) a step of filtering a solution obtained in the step (B) to remove insoluble matter; and (D) a step of adding a carboxylic acid to a solution obtained in the step (C), wherein the proportion of aluminum element contained as an impurity to barium element in the produced solution is COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：待解决的问题：提供钛酸钡前体溶液的制备方法和钛酸钡薄膜的制造方法，通过该方法使杂质元素，特别是铝元素的含量降低，并提供钛酸钡通过制造方法获得的薄膜和使用钛酸钡薄膜的电子部件。解决方案：钛酸钡前体溶液的制造方法和钛酸钡薄膜的制造方法均包括：（A）制备钡醇盐和钛醇盐的混合溶液的工序; （B）将步骤（A）中得到的溶液中加入氨基醇的步骤; （C）过滤步骤（B）中得到的溶液以除去不溶物的步骤; 和（D）将步骤（C）中得到的溶液中加入羧酸的步骤，其中在所制备的溶液中作为杂质含有的铝元素与钡元素的比例<0.005mol％。还提供了通过制造方法获得的钛酸钡薄膜和使用钛酸钡薄膜的电子部件。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2009059753A Flame-retardant noise suppressing sheet 审中-公开
标题翻译：阻燃噪音抑制片
公开(公告)号：JP2009059753A
公开(公告)日：2009-03-19
申请号：JP2007223619
申请日：2007-08-30
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KONDO YUSUKE , SHIMADA YASUSHI , MORITA KOJI , MIZUSHIMA ETSUO
IPC分类号： H05K9/00 , B22F1/00 , C08G59/62 , C08K3/08 , C08K3/22 , C08L33/14 , C08L61/06 , C08L63/00 , C22C19/03 , C22C19/07 , C22C38/00 , H01F1/00 , H01F1/147 , H01F1/26
摘要： PROBLEM TO BE SOLVED: To provide a flame-retardant noise suppressing sheet which is reliable even in a severe environment. SOLUTION: The flame-retardant noise suppressing sheet contains (A) 1,000 pts.wt. of flat soft magnetic material powder, (B) 30 to 40 pts.wt. of epoxy resin, (C) 30 to 80 pts.wt. of phenol bromide resin, (D) 0.03 to 1.5 pts.wt. of a hardening accelerator, (E) 45 to 200 pts.wt. of an epoxy group containing acrylic copolymer of ≥-10°C in Tg (glass transition temperature) and ≥800,000 in weight-average molecular weight containing 2 to 6% by weight of glycidyl methacrylate, (F) 3 to 30 pts.wt. of antimony oxide, and (G) 3 to 20 pts.wt. of a dispersant. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供即使在恶劣环境下也是可靠的阻燃噪声抑制片。
解决方案：阻燃噪声抑制片含有（A）1,000重量份平面软磁性材料粉末，（B）30〜40重量份的环氧树脂，（C）30〜80重量份的酚醛树脂，（D）0.03〜1.5重量份的硬化促进剂，（E）45〜200重量份（Tg）（玻璃化转变温度）≥10℃的环氧基丙烯酸共聚物和含有2〜6重量％的甲基丙烯酸缩水甘油酯的重均分子量为≥800,000的（F）3〜30重量份。的氧化锑，（G）3〜20重量份。的分散剂。版权所有（C）2009，JPO＆INPIT

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