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1. 发明专利

JP2013033911A Substrate for mounting light emitting element and led package 有权
标题翻译：用于安装发光元件和LED封装的基板
公开(公告)号：JP2013033911A
公开(公告)日：2013-02-14
申请号：JP2012064702
申请日：2012-03-22
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： IMAI NOBORU , ISAKA FUMIYA , NEMOTO MASANORI , TANOI MINORU , TAKAHASHI TAKESHI
IPC分类号： H01L33/62 , H01L23/12 , H01L23/34 , H01L23/36
CPC分类号： H01L33/62 , H01L25/0753 , H01L25/167 , H01L33/48 , H01L33/60 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a substrate for mounting a light emitting element which enables flip chip mounting using a single sided wiring board and is excellent in heat radiation performance and light reflectivity, and to provide an LED package using the substrate for mounting the light emitting element.SOLUTION: A substrate for mounting a light emitting element is a single sided wiring board including: an insulative substrate; a pair of wiring patterns which are formed on one surface of the substrate and separated from each other so as to form a first gap therebetween; a pair of filling parts in which a pair of through holes, penetrating the substrate in the thickness direction and separated from each other so as to form a second gap therebetween, are formed, the pair of filling parts made of a metal, which fills the pair of through holes so as to contact with the pair of the wiring patterns and be exposed on the one surface and the opposite surface of the substrate; and an insulation layer formed on the one surface of the substrate so as to cover the pair of wiring patterns and having light reflectivity. The respective filling parts of the pair of filling parts have horizontal projection areas that are 50% of or larger than areas of the respective wiring patterns of the pair of the wiring patterns. The insulation layer has openings from which the pair of the wiring patterns are respectively exposed.
摘要翻译：要解决的问题：提供一种用于安装发光元件的基板，其能够使用单面布线板进行倒装芯片安装，并且具有优异的散热性能和光反射率，并且提供使用该基板的LED封装安装发光元件。解决方案：用于安装发光元件的基板是单面布线板，包括：绝缘基板; 一对布线图案，其形成在所述基板的一个表面上并且彼此分离以在其间形成第一间隙; 一对填充部件，其中形成有一对通孔，其在厚度方向上穿透基板并且彼此分离以在其间形成第二间隙，所述一对填充部分由金属制成，填充部件一对通孔，以与所述一对布线图案接触并暴露在所述基板的一个表面和相对表面上; 以及形成在所述基板的一个表面上以便覆盖所述一对布线图案并具有光反射率的绝缘层。一对填充部的各个填充部具有水平投影面积，该面积为该对配线图案的各个配线图案的面积的50％以上。绝缘层具有分别露出一对布线图案的开口。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2013093556A Heater element mounting substrate, manufacturing method of the same and semiconductor package 审中-公开
标题翻译：加热器元件安装基板及其制造方法及半导体封装
公开(公告)号：JP2013093556A
公开(公告)日：2013-05-16
申请号：JP2012203970
申请日：2012-09-18
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： IMAI NOBORU , ISAKA FUMIYA , MATSUO NAGAYOSHI , NEMOTO MASANORI , TANOI MINORU
IPC分类号： H01L23/12 , H01L23/36
CPC分类号： H01L33/647 , H01L33/62 , H01L33/641 , H01L2224/16225 , H01L2933/0075 , H05K1/0206 , H05K2201/10106
摘要： PROBLEM TO BE SOLVED: To provide a heater element mounting substrate which has excellent thermal conductivity in a plate thickness direction though a single-sided wiring board and which has general versatility so as to allow a design of conductive patterns exposed on both surfaces to have different shapes from each other; and provide a manufacturing method of the heater element mounting substrate and a semiconductor package.SOLUTION: A heater element mounting substrate 2 comprises: a resin film 20; a plurality of wiring patterns 21 formed on a first surface 20a of the resin film 20; and a plurality of filling parts 23 composed of a conductive material filled in a plurality of through holes 22 formed in the resin film 20. An area of at least one of the plurality of wiring patterns 21 is 30% and over of an area of the first surface 20a of the resin film 20. Each of the filling parts 23 has a protruding part protruding from the wiring pattern 21 when viewed from the first surface 20a side and an area where the filling parts 23 and the wiring pattern 21 overlap each other when viewed from a second surface 20b side is 50% and over of an area of the wiring pattern. An LED element 3 is mounted on the resin film 20.
摘要翻译：要解决的问题：提供一种加热器元件安装基板，其通过单面布线板在板厚方向上具有优异的导热性，并且具有通用性，以允许在两个表面上露出的导电图案的设计具有彼此不同的形状; 并提供加热元件安装基板和半导体封装的制造方法。解决方案：加热元件安装基板2包括：树脂膜20; 形成在树脂膜20的第一表面20a上的多个布线图案21; 以及多个填充部23，其由填充在形成于树脂膜20中的多个通孔22的导电性材料构成。多个布线图案21中的至少一个的面积为30％以上树脂膜20的第一表面20a。当从第一表面20a侧观察时，每个填充部23具有从布线图案21突出的突出部分和填充部23和布线图案21彼此重叠的区域，当从第二表面20b侧观察是布线图案的面积的50％以上。 LED元件3安装在树脂膜20上。版权所有：（C）2013，JPO＆INPIT

3. 发明专利

JP2013033912A Light emitting element mounting substrate and led package 审中-公开
标题翻译：发光元件安装基板和LED封装
公开(公告)号：JP2013033912A
公开(公告)日：2013-02-14
申请号：JP2012064703
申请日：2012-03-22
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： IMAI NOBORU , ISAKA FUMIYA , NEMOTO MASANORI , TANOI MINORU , TAKAHASHI TAKESHI
IPC分类号： H01L33/64 , H01L33/60
CPC分类号： H01L2224/16245 , H01L2924/181 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide: a light emitting element mounting substrate which allows for flip chip mounting using a single-sided wiring board, and has excellent heat dissipation and light reflectivity, and facilitates dividing an LED package into individual pieces; and the LED package using the light emitting element mounting substrate.SOLUTION: A light emitting element mounting substrate 2 includes: a pair of wiring patterns 22A and 22B, each of which has a mounting region 30 configured to mount an LED chip 3 thereon, and is formed on a surface 20a of a resin film 20; a pair of filling parts 23A and 23B contacted with the pair of wiring patterns 22A and 22B, respectively; and an insulating layer 24 having light reflectivity which is formed on the surface 10a of the resin film 20 so as to cover the pair of wiring patterns 22A and 22B. The pair of filling parts 23A and 23B respectively have protruding parts 230 and 231 that protrude outward from the pair of wiring patterns 22A and 22B. The insulating layer 24 includes an opening 24a for passing bumps 32a and 32b electrically connected to the LED chip 3, in a region corresponding to the mounting region 30.
摘要翻译：要解决的问题：提供：一种发光元件安装基板，其允许使用单面布线板的倒装芯片安装，并且具有优异的散热和光反射率，并且有助于将LED封装分成单独的片; 以及使用发光元件安装基板的LED封装。解决方案：发光元件安装基板2包括：一对布线图案22A和22B，每个布线图案22A和22B具有安装区域30，其安装在其上的LED芯片3，并且形成在树脂的表面20a上电影20; 分别与一对布线图案22A和22B接触的一对填充部分23A和23B; 以及形成在树脂膜20的表面10a上以覆盖一对布线图案22A和22B的具有光反射率的绝缘层24。一对填充部分23A和23B分别具有从一对布线图案22A和22B向外突出的突出部分230和231。绝缘层24包括用于使电极连接到LED芯片3的凸起32a和32b在对应于安装区域30的区域中的开口24a。（C）2013，JPO和INPIT

4. 发明专利

JP2013033910A Substrate for mounting light emitting element, led package, and manufacturing method of led package 审中-公开
标题翻译： LED发光元件安装基板，LED封装及其制造方法
公开(公告)号：JP2013033910A
公开(公告)日：2013-02-14
申请号：JP2012064701
申请日：2012-03-22
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： IMAI NOBORU , ISAKA FUMIYA , NEMOTO MASANORI , KITAMURA TETSURO , TAKAHASHI TAKESHI
IPC分类号： H01L33/62 , H01L23/02 , H01L23/12
CPC分类号： H01L33/642 , H01L33/486 , H01L33/62 , H01L2224/16245 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a substrate for mounting a light emitting element which enables flip chip mounting using a single sided wiring board, achieves good heat radiation, and easily makes LED packages into an individual piece, and to provide the LED package using the substrate for mounting the light emitting element and a manufacturing method of the LED package.SOLUTION: A substrate for mounting a light emitting element 2 includes: a pair of wiring patterns 22A, 22B formed on a surface 20a of a resin film 20 so as to have a mounting region 30 where an LED chip 3 is mounted and be arranged in a predetermined direction; and a pair of filling parts 23A, 23B which respectively contact with the pair of wiring patterns 22A, 22B. The pair of filling parts 23A, 23B has protruding parts 230, 231 which protrude outward from the pair of wiring patterns 22A, 22B when viewed from the surface 20a side of the resin film 20.
摘要翻译：要解决的问题：为了提供一种用于安装使用单面布线板进行倒装芯片安装的发光元件的基板，实现良好的散热，并且容易使LED封装成单件，并且提供LED 封装使用用于安装发光元件的基板和LED封装的制造方法。解决方案：用于安装发光元件2的基板包括：形成在树脂膜20的表面20a上的一对布线图案22A，22B，以便具有安装LED芯片3的安装区域30;以及沿预定方向布置; 以及分别与一对布线图案22A，22B接触的一对填充部23A，23B。一对填充部23A，23B具有从树脂膜20的表面20a侧观察时从一对配线图案22A，22B向外突出的突出部230,231。（C）2013，JPO＆INPIT

5. 发明专利

JP2013093557A Heater element mounting substrate, manufacturing method of the same and semiconductor package 审中-公开
标题翻译：加热器元件安装基板及其制造方法及半导体封装
公开(公告)号：JP2013093557A
公开(公告)日：2013-05-16
申请号：JP2012203971
申请日：2012-09-18
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： IMAI NOBORU , ISAKA FUMIYA , MATSUO NAGAYOSHI , NEMOTO MASANORI , TANOI MINORU
IPC分类号： H01L23/12
CPC分类号： H01L33/647 , H01L33/62 , H01L33/641 , H01L2224/16225 , H01L2933/0075 , H05K1/0206 , H05K2201/10106
摘要： PROBLEM TO BE SOLVED: To provide a heater element mounting substrate which has excellent thermal conductivity in a plate thickness direction though a single-sided wiring board and which is not likely to be influenced by an electrode position of the heater element to be mounted; and provide a manufacturing method of the heater element mounting substrate, a heater element mounting substrate providing a semiconductor package, a manufacturing method of the same and a semiconductor package.SOLUTION: A heater element mounting substrate 2 comprises: a resin film 20; a plurality of wiring patterns 21 formed on a first surface 20a of the resin film 20; and a plurality of filling parts 23 composed of a conductive material filled in a plurality of through holes 22 formed in the resin film 20. An area of at least one of the plurality of wiring patterns 21 is 30% and over of an area of the first surface 20a of the resin film 20. An area where the filling parts 23 and the wiring pattern 21 overlap each other when viewed from a second surface 20b side is 50% and over of an area of the wiring pattern 21. An LED element 3 is mounted on the resin film 20.
摘要翻译：要解决的问题：提供一种加热器元件安装基板，其通过单面布线板在板厚方向上具有优异的导热性，并且不可能受到加热器元件的电极位置的影响安装; 并提供加热器元件安装基板的制造方法，提供半导体封装的加热元件安装基板，其制造方法和半导体封装。解决方案：加热元件安装基板2包括：树脂膜20; 形成在树脂膜20的第一表面20a上的多个布线图案21; 以及多个填充部23，其由填充在形成于树脂膜20中的多个通孔22的导电性材料构成。多个布线图案21中的至少一个的面积为30％以上树脂膜20的第一表面20a。从第二表面20b侧观察时，填充部23和布线图案21彼此重叠的区域为布线图案21的面积的50％以上。LED元件3 安装在树脂膜20上。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2013033909A Substrate for mounting light emitting element and led package 审中-公开
标题翻译：用于安装发光元件和LED封装的基板
公开(公告)号：JP2013033909A
公开(公告)日：2013-02-14
申请号：JP2012064700
申请日：2012-03-22
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： IMAI NOBORU , ISAKA FUMIYA , KITAMURA TETSURO , NEMOTO MASANORI , TANOI MINORU
IPC分类号： H01L33/64
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L33/64 , H01L2224/16245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H05K1/0203 , H05K1/0204 , H05K3/427 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a substrate for mounting a light emitting element which enables flip chip mounting using a single sided wiring board and is excellent in heat radiation performance, and to provide an LED package using the substrate for mounting the light emitting element.SOLUTION: A substrate for mounting a light emitting element is a single sided wiring board including: an insulative substrate; a pair of wiring patterns which are formed on one surface of the substrate and separated from each other so as to form a first gap therebetween; a pair of through holes which penetrate the substrate in the thickness direction and are separated from each other so as to form a second gap therebetween; and a pair of filling parts made of a metal, which fills the pair of through holes so as to contact with the pair of wiring patterns and be exposed on the one surface and the opposite surface of the substrate. The respective filling parts of the pair of filling parts have horizontal projection areas that are 50% of or larger than areas of the respective wiring patterns of the pair of wiring patterns.
摘要翻译：要解决的问题：提供一种用于安装发光元件的基板，其能够使用单面布线板进行倒装芯片安装并且具有优异的散热性能，并且提供使用该基板的LED封装件来安装光发光元件。解决方案：用于安装发光元件的基板是单面布线板，包括：绝缘基板; 一对布线图案，其形成在所述基板的一个表面上并且彼此分离以在其间形成第一间隙; 一对通孔，其在厚度方向上穿透基板并彼此分离，以在它们之间形成第二间隙; 以及一对由金属制成的填充部，其填充一对通孔以与该对布线图案接触并暴露在基板的一个表面和相对表面上。一对填充部的各个填充部分具有水平投影区域，其为该对布线图案的各个布线图案的面积的50％或更大。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2008205103A Method of manufacturing tape carrier for semiconductor device 有权
标题翻译：制造用于半导体器件的胶带载体的方法
公开(公告)号：JP2008205103A
公开(公告)日：2008-09-04
申请号：JP2007038110
申请日：2007-02-19
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： ISHIKAWA HIROSHI , YANO HIROAKI , SASAKI TAKASHI , NEMOTO MASANORI
IPC分类号： H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method capable of stably manufacturing a tape carrier for a semiconductor device, such as a TAB tape for LCD, having an ultra-fine wiring pattern while reducing uselessness in material resources and in time.
SOLUTION: The manufacturing method includes a step of applying a liquid resist to a copper layer 2 formed on an insulative film substrate 1 to form a resist film 6; a step of exposing and developing the resist film 6 to form a wiring resist pattern 7 for wiring patten formation and forming a resist pattern 8 for inspection having a pattern width smaller than the minimum pattern width of the wiring resist pattern 7; a step of executing dimension inspection of the wiring resist pattern 7 using the resist pattern 8 for inspection; and a step of etching the copper layer 2 by using the wiring resist pattern 7 as an etching resist to form a wiring pattern 13.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供一种能够稳定地制造半导体装置用带载体的制造方法，例如用于LCD的TAB带，其具有超细的布线图案，同时减少材料资源的无用性和时间。解决方案：制造方法包括对形成在绝缘膜基板1上的铜层2施加液体抗蚀剂以形成抗蚀剂膜6的步骤; 曝光和显影抗蚀剂膜6以形成用于布线图案形成的布线抗蚀剂图案7并形成具有小于布线抗蚀图案7的最小图案宽度的图案宽度的检查用抗蚀剂图案8的步骤; 使用抗蚀剂图案8进行检查的布线抗蚀剂图案7的尺寸检查的步骤; 以及通过使用布线抗蚀剂图案7作为抗蚀剂来蚀刻铜层2以形成布线图案13的步骤。（C）2008，JPO＆INPIT

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