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1. 发明专利

JPH07240495A LEAD FRAME FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH07240495A
公开(公告)日：1995-09-12
申请号：JP3139794
申请日：1994-03-01
申请人： HITACHI CABLE
发明人： SUGIMOTO HIROSHI , SUZUMURA TAKASHI , TAKAGI MASAHARU , OTAKA TATSUYA , KAMEYAMA YASUHARU , KOYAMA HIDEYUKI
IPC分类号： H01L23/28 , H01L21/56 , H01L23/50
摘要： PURPOSE:To eliminate leakage of resin at the time of molding and to prevent the deformation of the lead after molding. CONSTITUTION:A tab 5 for mounting a semiconductor chip is provided in the center with leads extending in four directions from the outer periphery of the tab 5. The leads include signal leads 10 where outer leads 2 are arranged at a constant interval, and suspension leads 3 extending in same direction as the signal lead 10 from the corner of the tab 5. A pad 6 for altering the interval of lead at the part for forming a dam bar of insulating resin is provided at the outer part of the suspension lead 3. The interval (d) between the pad 6 of suspension lead 3 and an adjacent outer lead 2 is set equal to the interval (d) between other outer leads 2, 2 by providing the pad 6 with a protrusion 9.

2. 发明专利

JPH0738038A COMPOSITE LEAD FRAME AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH0738038A
公开(公告)日：1995-02-07
申请号：JP17659193
申请日：1993-07-16
申请人： HITACHI CABLE
发明人： YONEMOTO TAKAHARU , SUZUMURA TAKASHI , TAKAGI MASAHARU
IPC分类号： H01L21/60 , H01L23/50
摘要： PURPOSE:To obtain a composite lead frame and a manufacture thereof which enable joining, with a high peeling strength, of outer leads of a metal lead frame to inner leads and conductor layers of a flexible multilayer interconnection board which are different in height. CONSTITUTION:A composite lead frame 11 which is provided with a metal lead frame 12 having outer leads 24 and 25 formed in a prescribed pattern and with a flexible multilayer interconnection board 13 having inner leads 16 formed in a prescribed pattern on an insulating film 15 having conductor layers 14 on the lower side, and constructed by connecting the outer leads 24 and 25 to the conductor layers 14 and the inner leads 16. Joining parts connecting the outer leads 24 and 25 to the conductor layers 14 and the inner leads 16 are provided from inside to outside in the sequence of height.

3. 发明专利

JPH05326811A COMPOSITE LEAD FRAME AND SEMICONDUCTOR DEVICE USING THEREOF 失效
公开(公告)号：JPH05326811A
公开(公告)日：1993-12-10
申请号：JP12587692
申请日：1992-05-19
申请人： HITACHI CABLE
发明人： ONDA MAMORU , TAKAGI MASAHARU
IPC分类号： H01L23/50
摘要： PURPOSE:To provide a composite lead frame, to be used for a semiconductor device, on which a bonding wire can be made short, the connected part of the bonding wire can be accurately recognized using a monitoring camera when a bonding work is conducted by a bonder, and the bonding can be connected accurately. CONSTITUTION:The title lead frame is provided with a signal wiring formed on one surface of an insulating layer 14, a power supply wiring layer 15 formed on other surface of the insulating layer 14, a wiring substrate 12 on which a semiconductor chip 13 is mounted on one surface side, and a lead frame main body 11 on which a lead part 11a, to be electrically connected to the wiring layers 15 and 16 of the wiring substrate 12. The power source wiring layer 15 is exposed to one surface of the wiring substrate 12, a recessed part 21 is made in one side of the substrate 12, and the semiconductor chip 13 is mounted on the above-mentioned recessed part.

4. 发明专利

JPH05218145A MULTILAYER WIRING TYPE FILM CARRIER 失效
公开(公告)号：JPH05218145A
公开(公告)日：1993-08-27
申请号：JP2250592
申请日：1992-02-07
申请人： HITACHI CABLE
发明人： YAMAGUCHI KENJI , NAKADA YOSHIHIRO , TANAKA HIROKI , ONDA MAMORU , TAKAGI MASAHARU , MURAKAMI TOMIO
IPC分类号： H01L21/60
摘要： PURPOSE:To provide a new multilayer wiring type film carrier by which a bump of a chip to be mounted can be reliably connected to an inner and the connection can be inspected. CONSTITUTION:This multilayer wiring type film carrier has at least a multilayer TAB film carrier 3 having a conductor layer to become an outer lead 6a and a multilayer TAB film carrier 3 having a conductor layer to become an inner lead 6b while electrically connecting the conductor layer to become the outer lead 6a to the conductor layer to become the inner lead 6b and having a plurality of kinds of extension length in the direction of the chip mounting part.

5. 发明专利

JPH05175285A HYBRID SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH05175285A
公开(公告)日：1993-07-13
申请号：JP34280891
申请日：1991-12-25
申请人： TOSHIBA CORP , HITACHI CABLE
发明人： OTSUKA MASASHI , NAGANO JUNYA , TAKAGI MASAHARU , YAMAGUCHI KENJI
IPC分类号： H01L21/603 , H01L21/60 , H05K1/09 , H05K3/32
摘要： PURPOSE:To provide a hybrid semiconductor device which can be easily assembled and, at the same time, which can be manufactured at a low cost. CONSTITUTION:A metallic layer pattern 15 at a lead joining section on a substrate 14 is composed of a copper pattern 21, nickel layer 22 plated on the pattern 21, and gold layer 23 plated on the layer 22 and a tin layer 24 is plated on the front end section of an inner lead 12. The inner lead 12 is electrically connected to the pattern 15 through a gold-tin eutectic layer 25 by thermocompression bonding the lead 12 to the pattern 15.

6. 发明专利

JPH05136318A COMPOSITE LEAD FRAME AND ITS MANUFACTURE 失效
公开(公告)号：JPH05136318A
公开(公告)日：1993-06-01
申请号：JP10635392
申请日：1992-04-24
申请人： HITACHI CABLE
发明人： ONDA MAMORU , MURAKAMI TOMIO , TAKAGI MASAHARU , TANAKA HIROKI , YAMAGUCHI KENJI
IPC分类号： H01L21/60 , H01L23/50
摘要： PURPOSE:To stably bond the title lead frame by a method wherein, when an inner lead and an outer lead on a flexible wiring board are bonded, a gold/tin alloy which contains 10 to 40wt.% of gold is used. CONSTITUTION:Outer leads 15a, 15b are constituted of a metal lead frame; a composite lead frame is constituted of a flexible wiring board 17 where inner leads 27 are formed of a fine interconnection pattern on an insulating film 19. In this case, the bonding layer of the outer leads 15a, 15b to the inner leads 27 is composed of a gold/tion alloy, and the content of gold for the alloy is 10 to 40wt.%. The specific alloy is provided with a proper melting-point range of (210 to 305 deg.C). Consequently, in a bonding operation, it is not required to heat the alloy to a high temperature of 340 deg.C or higher as the deterioration temperature of an adhesive which is used to connect the insulating film 19 to the inner leads 27. Thereby, the composite lead frame can be bonded stably.

7. 发明专利

JPH0521689A MULTILAYER LEAD FRAME 失效
公开(公告)号：JPH0521689A
公开(公告)日：1993-01-29
申请号：JP17659991
申请日：1991-07-17
申请人： HITACHI CABLE
发明人： YAMAGUCHI KENJI , TANAKA HIROKI , NAKADA YOSHIHIRO , ONDA MAMORU , TAKAGI MASAHARU , MURAKAMI TOMIO
IPC分类号： H01L23/50
摘要： PURPOSE:To provide a new multilayer lead frame remarkably enhanced in heat dissipating properties. CONSTITUTION:A ground or power supply conductor layer 7, an insulating layer 6 formed on the conductor layer 7, an inner lead 5 finely formed on the insulating layer through etching or evaporation, and a signal lead 1b and a grounding or power supply lead 1a formed of a metal frame are provided. The inner lead 5 and the signal lead 1b are electrically connected together by bonding, and the grounding or power supply lead 1a is connected to the conductor layer 7, and an exposed part where an electronic part is directly mounted is provided to the conductor layer 7 by removing the insulating layer 6.

8. 发明专利

JPS63265634A WATERPROOF SHEET PROVIDED WITH NONWOVEN FABRIC 失效
公开(公告)号：JPS63265634A
公开(公告)日：1988-11-02
申请号：JP20036687
申请日：1987-08-11
申请人： HITACHI CABLE
发明人： WATANABE SHIGETAKA , TAKAGI MASAHARU
IPC分类号： B32B25/10
摘要： PURPOSE:To contrive improvements in water resistance and shock resistance by making adhesive work on a site and a liquid adhesive agent unnecessary, by a method wherein any one kind out of polyester series or, polyvinyl alcohol series or glass series or glass series fibrous nonwoven fabric is fused onto one side of a waterproof rubber sheet unitarily thermally through a hot-melt film. CONSTITUTION:A hot-melt film 2 is held by placing the same between nonwoven fabric 1 and a waterproof rubber sheet 2, which is fused thermally and the nonwoven fabric 1 and waterproof rubber sheet 2 are stuck to each other at an interface. The waterproof sheet provided with the nonwoven fabric constituted in this manner can display sufficient cushioning properties to a protrusion or unevenness of a substrate when a nonwoven fabric 1 side is used by facing the same to the bottom side. Then when the nonwoven fabric 1 is laid by facing the same to the surface side, resistance to such contact of a foreign matter as to generate an external injury can be improve due to the nonwoven fabric 1. Therefore, the nonwoven fabric 1 can be fused thermally within a factory through a hot-melt film uniformly in a longitudinal direction without having a thermal deformation. A work on a site for the nonwoven fabric for which a liquid adhesive agent has been used can be eliminated and shock resistance and waterproof properties can be displayed completely.

9. 发明专利

JPS6260976B2 失效
公开(公告)号：JPS6260976B2
公开(公告)日：1987-12-18
申请号：JP9043982
申请日：1982-05-27
申请人： HITACHI CABLE
发明人： MATSUMURA IKUHIDE , WATANABE SHIGETAKA , ISODA MAMORU , TAKAGI MASAHARU
IPC分类号： B29C65/00 , B29B15/00 , B29C65/52 , B29K21/00 , B29L31/10 , B32B25/04

10. 发明专利

JPS61202865A PLATEN ROLLER 失效
公开(公告)号：JPS61202865A
公开(公告)日：1986-09-08
申请号：JP4341085
申请日：1985-03-05
申请人： HITACHI CABLE
发明人： TAKAGI MASAHARU , TAKAHASHI NOBORU , NATORI TAKESHI , KATAOKA TAKESHI , NAGATSUMA KATSUYOSHI , KIMURA HISAMI
IPC分类号： B41J11/02 , B41J11/04 , B41J11/057
摘要： PURPOSE:To reduce the weight of a shaft core and increase rigidity by providing a cylindrically formed hard foamed urethane resin layer, a non-foamed hard urethane resin skin layer and a shaft core with more than three pieces of reinforcing rib arranged toward a circumferential direction at an equal interval. CONSTITUTION:A hard foamed urethane resin layer 2 is formed in a cylindrical form on the external circumference of a metal shaft 1, and a hard urethane resin skin layer 3 is coated on the external circumference and edge of the hard foamed urethane resin layer 2. At least three pieces of reinforcing rib 4 fixed in an external circumferential shaft direction of a solid metal shaft 1 with a prearranged width in a fixed radial direction should be fitted in a circumferential direction at an equal interval. In this way, the diameter of the metal shaft 1 can be narrowed by forming the reinforcing rib 4. Its weight can be reduced and at the same time, its rigidity is increased. Thus the application of the hard foamed resin layer 2 and the resin skin layer 3 as a roller base enables a light-weight platen to be formed.

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