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    • 1. 发明专利
    • Method for producing conductive particle, and conductive particle produced by the same
    • 生产导电颗粒的方法和由其生产的导电颗粒
    • JP2011249233A
    • 2011-12-08
    • JP2010123212
    • 2010-05-28
    • Hayakawa Rubber Co Ltd早川ゴム株式会社
    • YAMADA KOSAKUKAWAGUCHI AKIOGOTO YASUO
    • H01B13/00H01B5/00
    • PROBLEM TO BE SOLVED: To provide an excellent conductive particle which holds an excellent compression characteristic belonging to a substrate polymer particle, has no deterioration in conductivity without any deterioration in the adhesion of a plated film even after being affected by compressive deformation, and has little load to environment and a human body, and a method for producing the conductive particle.SOLUTION: The method for producing the conductive particle includes: a primary dope step of doping iodine to a substrate polymer particle and adjusting a polymer/iodine compound; a secondary dope step of making metal species react on the polymer/iodine compound to adjust a metal iodide composite; a reduction step of reducing the metal iodide composite to a metal particle and scattering metal particles to be a core of a plating film on a substrate polymer surface; and an electroless deposition step of making the plating film grow with metals scattered on the substrate polymer particle surface obtained in the reduction step as a core.
    • 要解决的问题为了提供一种优良的导电性颗粒,其具有属于基材聚合物颗粒的优异的压缩特性,即使在受到压缩变形的影响之后,电导率的粘合性也不会降低, 并且对环境和人体几乎没有负担,以及导电粒子的制造方法。 解决方案:导电颗粒的制造方法包括:向基材聚合物颗粒掺杂碘并调节聚合物/碘化合物的初级掺杂步骤; 使金属物质在聚合物/碘化合物上反应以调节金属碘化物复合物的次要掺杂步骤; 还原步骤是将金属碘化物复合物还原成金属颗粒,并将金属颗粒作为基板聚合物表面上的镀膜的核心散射; 以及使在所述还原工序中得到的所述基板聚合物粒子表面上散布的金属为核心的所述镀膜生长的化学沉积步骤。 版权所有(C)2012,JPO&INPIT